Abstract: The disclosure relates to a correction light device for the irradiation of optical elements of an optical arrangement, in particular a lens, such a microlithography lens having a correction light, which include at least one correction light source and at least one mirror arrangement that deflects the light from the correction light source in the beam path to the optical element such that at least part of at least one surface of at least one optical element of the optical arrangement are irradiated in a locally and/or temporally variable fashion. The correction light strikes the surface of the optical element at a flat angle such that the obtuse angle between the optical axis of the optical arrangement at the location of the optical element and the correction light beam is less than or equal to 105°.

Abstract: The invention relates to arrangements for actuating an element in a microlithographic projection exposure apparatus. In accordance with one aspect, an arrangement for actuating an element in a microlithographic projection exposure apparatus comprises a first number (nR) of degrees of freedom, wherein an adjustable force can be transmitted to the optical element in each of the degrees of freedom, and a second number (nA) of actuators, which are coupled to the optical element in each case via a mechanical coupling for the purpose of transmitting force to the optical element, wherein the second number (nA) is greater than the first number (nR). In accordance with one aspect, at least one of the actuators is arranged in a node of at least one natural vibration mode of the optical element.

Abstract: The invention relates to arrangements for actuating an element in a microlithographic projection exposure apparatus. In accordance with one aspect, an arrangement for actuating an element in a microlithographic projection exposure apparatus comprises a first number (nR) of degrees of freedom, wherein an adjustable force can be transmitted to the optical element in each of the degrees of freedom, and a second number (nA) of actuators, which are coupled to the optical element in each case via a mechanical coupling for the purpose of transmitting force to the optical element, wherein the second number (nA) is greater than the first number (nR). In accordance with one aspect, at least one of the ac-tuators is arranged in a node of at least one natural vibration mode of the optical element.

Abstract: A microlithographic projection exposure apparatus includes a primary illumination system producing projection light, a projection objective and a correction optical system. The correction optical system includes a secondary illumination system, which produces an intensity distribution of correction light in a reference surface, and a correction element which includes a heating material and is arranged in a plane that is at least substantially optically conjugate to the reference surface such that the correction light and the projection light pass through at least one lens contained in the projection objective before they impinge on the correction element. All lenses through which both the correction light and the projection light pass are made of a lens material which has a lower coefficient of absorption for the correction light than the heating material contained in the correction element.

Abstract: A microlithographic projection exposure apparatus has a mirror array having a base body and a plurality of mirror units. Each mirror unit includes a mirror and a solid-state articulation, which has at least one articulation part that connects the mirror to the base body. A control device makes it possible to modify the alignment of the respective mirror relative to the base body. Mutually opposing surfaces of the mirror and of the base body, or of a mirror support body connected to it, are designed as corresponding glide surfaces of a sliding bearing.

Abstract: The disclosure relates to a correction light device for the irradiation of optical elements of an optical arrangement, in particular a lens, such a microlithography lens having a correction light, which include at least one correction light source and at least one mirror arrangement that deflects the light from the correction light source in the beam path to the optical element such that at least part of at least one surface of at least one optical element of the optical arrangement are irradiated in a locally and/or temporally variable fashion. The correction light strikes the surface of the optical element at a flat angle such that the obtuse angle between the optical axis of the optical arrangement at the location of the optical element and the correction light beam is less than or equal to 105°.

Abstract: The disclosure relates to a correction light device for the irradiation of optical elements of an optical arrangement, in particular a lens, such a microlithography lens having a correction light, which include at least one correction light source and at least one mirror arrangement that deflects the light from the correction light source in the beam path to the optical element such that at least part of at least one surface of at least one optical element of the optical arrangement are irradiated in a locally and/or temporally variable fashion. The correction light strikes the surface of the optical element at a flat angle such that the obtuse angle between the optical axis of the optical arrangement at the location of the optical element and the correction light beam is less than or equal to 105°.

Abstract: The disclosure relates to a correction light device for the irradiation of optical elements of an optical arrangement, in particular a lens, such a microlithography lens having a correction light, which include at least one correction light source and at least one mirror arrangement that deflects the light from the correction light source in the beam path to the optical element such that at least part of at least one surface of at least one optical element of the optical arrangement are irradiated in a locally and/or temporally variable fashion. The correction light strikes the surface of the optical element at a flat angle such that the obtuse angle between the optical axis of the optical arrangement at the location of the optical element and the correction light beam is less than or equal to 105°.

Abstract: A projection exposure tool for microlithography for exposing a substrate is disclosed. The tool includes a projection objective. The tool also includes an optical measuring apparatus for determining a surface topography of the substrate before the substrate is exposed. The measuring apparatus has a measuring beam path which extends outside of the projection objective. The measuring apparatus is a wavefront measuring apparatus configured to determine topography measurement values simultaneously at a number of points on the substrate surface.

Abstract: The disclosure relates to a projection exposure apparatus and an optical system, such as a projection objective or an illumination system in a projection exposure apparatus for microlithography, that includes at least one optical element and at least one manipulator having a drive device for the optical element. The drive device can have at least one movable partial element and at least one stationary partial element movable relative to one another in at least one direction of movement.

Abstract: A microlithographic projection exposure apparatus comprises a projection objective which images an object onto an image plane and has a lens with a curved surface. In the projection objective there is a liquid or solid medium which directly adjoins the curved surface over a region which is usable for imaging the object. The projection exposure apparatus also has an adjustable manipulator for reducing an image field curvature which is caused by heating of the medium during the projection operation.

Abstract: The disclosure relates to a projection exposure apparatus and an optical system, such as a projection objective or an illumination system in a projection exposure apparatus for microlithography, that includes at least one optical element and at least one manipulator having a drive device for the optical element. The drive device can have at least one movable partial element and at least one stationary partial element movable relative to one another in at least one direction of movement.

Abstract: A catadioptric projection objective for images an object field onto an image field via imaging radiation. The projection objective includes at least one reflective optical component and a measuring device. The reflective optical component, during the operation of the projection objective, reflects a first part of the imaging radiation and transmits a second part of the imaging radiation. The reflected, first part of the imaging radiation at least partly contributes to the imaging of the object field. The transmitted, second part of the imaging radiation is at least partly fed to a measuring device. This allows a simultaneous exposure of the photosensitive layer at the location of the image field with the imaging radiation and monitoring of the imaging radiation with the aid of the measuring device.

Abstract: An optical system of a microlithographic projection exposure apparatus contains a module, which can be fitted in the optical system and removed from it as a unit. The module contains a cavity which can be completely filled with a liquid and hermetically sealed, and a concavely curved optical surface which bounds the cavity at the top during operation of the projection exposure apparatus. This makes it possible to fill the module outside the optical system. The module can be tilted there so that no air bubble, which prevents complete filling, can form below the concavely curved optical surface.

Abstract: The disclosure relates to an optical correction arrangement including at least one optical element and at least one irradiation mechanism for the targeted local irradiation of the optical element with electromagnetic heating radiation for the targeted local heating of the optical element. The optical correction arrangement also includes a mechanism for dissipating the thermal energy introduced into the optical element by the at least one irradiation mechanism. The disclosure furthermore relates to a projection exposure apparatus for semiconductor lithography including an optical correction arrangement according to the disclosure.

Abstract: There is provided an optical imaging device, in particular for microlithography, comprising at least one optical element and at least one holding device associated to the optical element (109), wherein the holding device holds the optical element and a first part (109.1) of the optical element contacts a first atmosphere and a second part (109.2) of the optical element at least temporarily contacts a second atmosphere. There is provided a reduction device at least reducing dynamic fluctuations in the pressure difference between the first atmosphere and the second atmosphere.

Abstract: There is provided an optical imaging device, in particular for microlithography, comprising at least one optical element and at least one holding device associated to the optical element (109), wherein the holding device holds the optical element and a first part (109.1) of the optical element contacts a first atmosphere and a second part (109.2) of the optical element at least temporarily contacts a second atmosphere. There is provided a reduction device at least reducing dynamic fluctuations in the pressure difference between the first atmosphere and the second atmosphere.

Abstract: An optical system has an aperture device having a multiplicity of aperture elements for the delimitation of the cross section of a ray bundle running through the optical system. The aperture device has a first aperture element, which is pivotable about a first rotation axis between an engagement position in the beam path of the optical system and a neutral position outside the beam path of the optical system and has a first aperture opening delimited by a first aperture edge. The aperture device also has at least one second aperture element, which is pivotable about a second rotation axis between an engagement position in the beam path of the optical system and a neutral position outside the beam path of the optical system and has a second aperture opening delimited by a second aperture edge. The second aperture opening is smaller than the first aperture opening. The aperture elements pivoted into the engagement position form an effective aperture opening.

Abstract: A projection objective of a microlithographic projection exposure apparatus comprises a manipulator for reducing rotationally asymmetric image errors. The manipulator in turn contains a lens, an optical element and an interspace formed between the lens and the optical element, which can be filled with a liquid. At least one actuator acting exclusively on the lens is furthermore provided, which can generate a rotationally asymmetric deformation of the lens.

Abstract: A microlithographic projection exposure apparatus has a mirror array having a base body and a plurality of mirror units. Each mirror unit includes a mirror and a solid-state articulation, which has at least one articulation part that connects the mirror to the base body. A control device makes it possible to modify the alignment of the respective mirror relative to the base body. Mutually opposing surfaces of the mirror and of the base body, or of a mirror support body connected to it, are designed as corresponding glide surfaces of a sliding bearing.