Abstract: Provided is an inexpensive seed material for liquid phase epitaxial growth of silicon carbide. A seed material 12 for liquid phase epitaxial growth of a monocrystalline silicon carbide includes a surface layer containing a polycrystalline silicon carbide with a 3C crystal polymorph. Upon X-ray diffraction of the surface layer thereof, a first-order diffraction peak corresponding to a (111) crystal plane is observed as a diffraction peak corresponding to the polycrystalline silicon carbide with a 3C crystal polymorph but no other first-order diffraction peak having a diffraction intensity of 10% or more of the diffraction intensity of the first-order diffraction peak corresponding to the (111) crystal plane is observed.

Abstract: Provided is an inexpensive seed material for liquid phase epitaxial growth of silicon carbide. A seed material 12 for liquid phase epitaxial growth of a monocrystalline silicon carbide includes a surface layer containing a polycrystalline silicon carbide with a 3C crystal polymorph. Upon Raman spectroscopic analysis of the surface layer with an excitation wavelength of 532 nm, a peak other than a TO peak and an LO peak is observed as a peak derived from the polycrystalline silicon carbide with a 3C crystal polymorph.

Abstract: An antenna includes a dielectric substrate, a ground electrode provided on a first surface of the dielectric substrate, a first antenna element and a second antenna elements provided to a second surface of the dielectric substrate, the first and second antenna elements having an identical resonance frequency and an identical Q value, a transmission line connecting the first and second antenna elements, and a feed part provided in the transmission line.

Abstract: A wireless tag includes a tag-inlet including an antenna pattern formed on a base and an IC chip connected to the antenna pattern on the base, and a flexible member configured to seal the tag-inlet inside the flexible member. In the wireless tag, the tag-inlet is sealed in the flexible member with folded, and the folded tag-inlet has a dielectric spacer formed of the flexible member between the folded tag-inlet.

Abstract: According to an aspect of the invention, a wireless tag includes a base member that is flexible and on a surface of which a wiring pattern is formed, a wireless circuit chip that is mounted on the base member and connected to the wiring pattern; protective members that cover the base member and the wireless circuit chip and are lower in hardness than the base member, and a plurality of spherical projections that are arranged on the surfaces of the protective members, higher in hardness than the base member, and so arranged as to interfere with other adjacent spherical projections when at least the protective members are bent beyond a predetermined angle.

Abstract: A radio tag is disclosed that includes an inlet having a base member, an antenna pattern, and a circuit chip for performing radio communications, the antenna pattern and the circuit chip being provided in the base member and includes a spacer on which the inlet is provided. The spacer has a length in a longitudinal direction thereof twice or more as great as a length of the inlet in the longitudinal direction. The spacer has a flection part at which the spacer is foldable in such a manner as to form an attached surface to be attached to an attached subject of the radio tag.

Abstract: A method of manufacturing RFID tags. A base sheet member is formed by fixedly attaching unit base substrates to a belt-like first sheet member at predetermined space intervals. Each unit base substrate is formed with an antenna pattern and has a non-contact communication-type IC chip mounted thereon. An upper-layer sheet member is formed by arranging reinforcing members between elastic, belt-like second and third sheet members, and is laminated on a surface of the first sheet member toward the unit base substrates such that each IC chip and each reinforcing member overlap each other in plan view. Regions each containing one unit base substrate are sequentially cut out from a laminate of the upper-layer sheet member and the base sheet member, thereby making RFID units.

Abstract: An RFID tag includes a semiconductor package, a substrate and an antenna pattern. The semiconductor package includes a semiconductor chip encapsulated therein and a plurality of connection terminals thereon. The plurality of connection terminals includes signal terminals and dummy terminals. The semiconductor package is mounted on the substrate. The antenna pattern is formed on the substrate and is electrically connected to the signal terminals. The antenna pattern is extended so as to overlap with at least a part of a bottom region of the semiconductor package.

Abstract: A radio-frequency identification (RFID) tag includes: a plate-shaped sealing piece made of an elastic material. An inlet is enclosed within the sealing piece. The inlet includes an electronic component and an antenna connected to the electronic component. A pair of reinforcing pieces are located respectively on the front and back surfaces of the sealing piece so as to sandwich the electronic component. The reinforcing pieces are made of a first material harder than the elastic material. A joint piece configured to couple the reinforcing pieces to each other. The joint piece is made of a second material harder than the elastic material.

Abstract: An RFID tag is disclosed that includes a first sheet having flexibility and elasticity; an antenna having flexibility and elasticity and configured to be formed on a surface of the first sheet; an IC chip configured to be electrically connected to the antenna; a second sheet having flexibility and elasticity and configured to be attached to the first sheet and to cover the antenna and the IC chip with the first sheet; and a reinforcing member having flexibility and elasticity and configured to cover the IC chip and a connecting portion of the IC chip and the antenna.

Abstract: An RFID tag includes an inlay which has a base, an antenna formed on the base, and an IC chip. The IC chip is enclosed in a surface mount package and soldered to the antenna and carries out radio communication through the antenna. The RFID tag further includes underfill that fills a gap between the base and the surface mount package, and a sheath protecting material enclosing the entire inlay.

Abstract: A radio tag is disclosed that includes an inlet having a base member, an antenna pattern, and a circuit chip for performing radio communications, the antenna pattern and the circuit chip being provided in the base member and includes a spacer on which the inlet is provided. The spacer has a length in a longitudinal direction thereof twice or more as great as a length of the inlet in the longitudinal direction. The spacer has a flection part at which the spacer is foldable in such a manner as to form an attached surface to be attached to an attached subject of the radio tag.

Abstract: A wireless tag includes a tag-inlet including an antenna pattern formed on a base and an IC chip connected to the antenna pattern on the base, and a flexible member configured to seal the tag-inlet inside the flexible member. In the wireless tag, the tag-inlet is sealed in the flexible member with folded, and the folded tag-inlet has a dielectric spacer formed of the flexible member between the folded tag-inlet.

Abstract: A radio-frequency identification (RFID) tag includes: a plate-shaped sealing piece made of an elastic material. An inlet is enclosed within the sealing piece. The inlet includes an electronic component and an antenna connected to the electronic component. A pair of reinforcing pieces are located respectively on the front and back surfaces of the sealing piece so as to sandwich the electronic component. The reinforcing pieces are made of a first material harder than the elastic material. A joint piece configured to couple the reinforcing pieces to each other. The joint piece is made of a second material harder than the elastic material.

Abstract: An RFID tag includes: a tag main body having a communication antenna, a circuit chip electrically connected to the antenna to perform wireless communication via the antenna, and a tabular sealing member in which the antenna and the circuit chip are enclosed; a print layer formed on a first surface of the tag main body by printing; and a protective film that covers the print layer. The print layer is formed only in a central area of the first surface surrounded by a marginal area of the first surface extending along the outer edge of the first surface. The protective film includes a covering portion that covers the print layer and an adhering portion that lies off the print layer while surrounding the outer edge of the print layer and adheres to the first surface.

Abstract: A radio-frequency identification (RFID) tag includes: a plate-shaped sealing piece made of an elastic material. An inlet is enclosed within the sealing piece. The inlet includes an electronic component and an antenna connected to the electronic component. A pair of reinforcing pieces are located respectively on the front and back surfaces of the sealing piece so as to sandwich the electronic component. The reinforcing pieces are made of a first material harder than the elastic material. A joint piece configured to couple the reinforcing pieces to each other. The joint piece is made of a second material harder than the elastic material.

Abstract: An RFID tag includes: a tabular dielectric member 11; an antenna pattern 12 that extends over a top surface and an undersurface of the dielectric member and forms a loop antenna L1 having both ends existing on one surface of the top surface and the undersurface; a circuit chip 13 that is electrically connected to the antenna pattern; a first electrode 14 that is connected directly or via a conductor to one end 12a of the both ends of the loop antenna and spreads on the one surface of the top surface and the undersurface; and a second electrode 15 that is connected via a conductor to the other end 12b of the both ends of the loop antenna and spreads on the other surface of the top surface and the undersurface, along the first electrode 14.

Abstract: According to an aspect of the invention, a wireless tag includes a base member that is flexible and on a surface of which a wiring pattern is formed, a wireless circuit chip that is mounted on the base member and connected to the wiring pattern; protective members that cover the base member and the wireless circuit chip and are lower in hardness than the base member, and a plurality of spherical projections that are arranged on the surfaces of the protective members, higher in hardness than the base member, and so arranged as to interfere with other adjacent spherical projections when at least the protective members are bent beyond a predetermined angle.

Abstract: An RFID tag includes: a tag main body having a communication antenna, a circuit chip electrically connected to the antenna to perform wireless communication via the antenna, and a tabular sealing member in which the antenna and the circuit chip are enclosed; a print layer formed on a first surface of the tag main body by printing; and a protective film that covers the print layer. The print layer is formed only in a central area of the first surface surrounded by a marginal area of the first surface extending along the outer edge of the first surface. The protective film includes a covering portion that covers the print layer and an adhering portion that lies off the print layer while surrounding the outer edge of the print layer and adheres to the first surface.

Abstract: An RFID tag includes a semiconductor package, a substrate and an antenna pattern. The semiconductor package includes a semiconductor chip encapsulated therein and a plurality of connection terminals thereon. The plurality of connection terminals includes signal terminals and dummy terminals. The semiconductor package is mounted on the substrate. The antenna pattern is formed on the substrate and is electrically connected to the signal terminals. The antenna pattern is extended so as to overlap with at least a part of a bottom region of the semiconductor package.