Abstract: A method, program product and system is disclosed for performing optical proximity correction (OPC) wherein mask shapes are fragmented based on the effective image processing influence of neighboring shapes on the shape to be fragmented. Neighboring shapes are smoothed prior to determining their influence on the fragmentation of the shape of interest, where the amount of smoothing of a neighboring shape increases as the influence of the neighboring shape on the image process of the shape of interest decreases. A preferred embodiment includes the use of multiple regions of interactions (ROIs) around the shape of interest, and assigning a smoothing parameter to a given ROI that increases as the influence of shapes in that ROI decreases with respect to the shape to be fragmented. The invention provides for accurate OPC that is also efficient.

Abstract: A methodology to improve the through-process model calibration accuracy of a semiconductor manufacturing process using lithographic methods by setting the correct defocus and image plane position in a patterning process model build. Separations of the optical model and the photoresist model are employed by separating out the adverse effects of the exposure tool from the effects of the photoresist. The exposure tool is adjusted to compensate for the errors. The methodology includes a determination of where the simulator best focus location is in comparison to the empirically derived best focus location.

Abstract: A method of conveying the designer's intended electrical characteristics for a semiconductor design is provided by forming tolerance bands for a design layer of interest that take into consideration constraints from design layers that interact with and influence the features on the design layer of interest. The method determines regions, i.e. tolerance bands, within which the printed edges of features of the layer of interest will print within a predetermined criterion, and satisfy a variety of constraints, including, but not limited to, electrical, overlay and manufacturability constraints arising from the influence of features on other layers. The method may be implemented in a computer program product for execution on a computer system. The resulting tolerance bands can be used to efficiently convey the designer's intent to a lithographer, an OPC engineer or a mask manufacturer or tool.

Abstract: A method is disclosed for providing associated shapes of an optical lithography mask in relation to predetermined main shapes of the mask. The method includes generating simplified layout patterns from the predetermined main shapes of the mask. Such layout patterns are generated by eliminating detail of the main shapes which leads to unmanufacturable associated shapes while preserving geometrically relevant shape information. The associated shapes are then generated relative to the simplified mask patterns.

Abstract: The present invention relates generally to a method for lithographically printing a mask pattern on a substrate, in particular a semiconductor substrate, wherein the mask pattern includes features with diverse pitches. These features may include device features such as vias or contact holes and lines in integrated circuits. The method comprises splitting the mask pattern into a plurality of masks, wherein one or more of the masks contains relatively tightly nested features and one or more of the masks contains relatively isolated features. Each of the plurality of masks is then successively exposed on a photoresist layer on the substrate. For each exposure, the exposure conditions, photoresist layer, other thin films layers, etching process, mask writing process, and/or mask pattern bias may be optimized for the tightly nested feature pattern or isolated feature pattern.

Abstract: The present invention relates generally to a method for lithographically printing a mask pattern on a substrate, in particular a semiconductor substrate, wherein the mask pattern includes features with diverse pitches. These features may include device features such as vias or contact holes and lines in integrated circuits. The method comprises splitting the mask pattern into a plurality of masks, wherein one or more of the masks contains relatively tightly nested features and one or more of the masks contains relatively isolated features. Each of the plurality of masks is then successively exposed on a photoresist layer on the substrate. For each exposure, the exposure conditions, photoresist layer, other thin films layers, etching process, mask writing process, and/or mask pattern bias may be optimized for the tightly nested feature pattern or isolated feature pattern.

Abstract: A semiconductor device can be fabricated using a photomask that has been modified using an assist feature design method (see e.g., FIG. 4A) based on normalized feature spacing. Before the device can be fabricated, a layout of original shapes is designed (402). For at least some of the original shapes, the width of the shape and a distance to at least one neighboring shape are measured (404). A modified shape can then be generated by moving edges of the original shape based on the width and distance measurements (406). This modification can be performed on some or all of the original shapes (408). For each of the modified shapes, a normalized space and correct number of assist features can be computed (410). The layout is then modified by adding the correct number of assist features in a space between the modified shape and the neighboring shape (412). This modified layout can then be used in producing a photomask, which can in turn be used to produce a semiconductor device.

Abstract: A method for developing a photomask layout by which an electrical circuit is imaged that includes introducing sub resolution assist features into a photomask layout by (1) sorting selected details of the main electrical circuit undergoing enhancement according to a predetermined order of importance of enhancement of the selected details of the main electrical circuit to the overall performance of the main electrical circuit, (2) establishing a prioritization for sub resolution assist features associated with the selected details of the main electrical circuit based on the predetermined order of importance of the selected details of the main electrical circuit with which the sub resolution assist features are associated, and (3) incorporating sub resolution assist features in the photomask layout in accordance with the established prioritization of the sub resolution features.

Abstract: A process and apparatus for dynamically adjusting the exposure dose on a photosensitive coating at a localized area within an exposure field in a step-and-scan lithography system. The process and apparatus form a pattern on a photosensitive substrate, such as used in the integrated circuit manufacturing industry. The exposure dose is adjusted at a localized area by a segmented slit system or an array of light-transmitting pixels located across the exposure field. The slit segments or individual pixels are automatically controlled in response to data obtained regarding the uniformity of the projection optics system or the mask pattern.

Abstract: A two-step method for eliminating transmission errors in alternating phase-shifting masks is described. Initially, the design data is selectively biased to provide a coarse reduction in the inherent transmission error between features of different phase, size, shape, and/or location. During fabrication of the mask with the modified data, residual transmission errors are then eliminated via the positioning of the edges of the etched-quartz trenches which define the phase of a given feature to a set location beneath the opaque chrome film. Application of feedback, in which the aerial image of the mask is monitored during the positioning of the etched-quartz edges, provides additional and precise control of the residual transmission error.

Abstract: In a laser cavity having an optical axis, a laser medium for forming a laser beam, the laser medium having a central axis off-set from the optical axis, the laser medium exhibiting focusing characteristics that vary with changes in optical power pumped into the laser medium, at least one pair of mirrors oppositely positioned for reflecting at least a portion of the laser beam, one of the mirrors being an output coupler, the laser cavity further comprising at least one focusing element having a central axis positioned between one of the mirrors and the laser medium such that the central axis of the focusing element is displaced from the optical axis a distance that is a function of the displacement of the laser medium central axis from the optical axis and the optical axis passes through the focusing element to substantially eliminate lensing effects produced by the laser medium.

Abstract: An optical recording system including a read/write optical assembly including an objective lens for reading or writing from an optical medium including a solid immersion lens disposed between the objective lens and having a surface closely spaced from the recording medium.

Abstract: A lithography system employing a solid immersion lens having a spherical surface to enhance its resolution is disclosed.

Abstract: An optical microscope which includes a high refractive index solid immersion lens interposed between the objective lens and the object being viewed to provide a microscope having resolution which is far better than the Rayleigh diffraction limit in air.