Abstract: An electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with the dielectric layers interposed therebetween, having first to sixth surfaces, and including one ends of the first and second internal electrodes exposed through the third and fourth surfaces, respectively; first and second external electrodes respectively including first and second head portions, and first and second band portions; a first connection terminal having conductive portions disposed on both ends thereof and connected to the first and second band portions, respectively; and a second connection terminal having conductive portions on both ends thereof and connected to the first and second band portions, respectively. The second connection terminal is spaced apart from the first connection terminal in a direction connecting the fifth and sixth surfaces.

Abstract: A composite electronic component includes: a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body, and first and second external electrodes disposed on both end portions of the first ceramic body. The ceramic chip includes a second ceramic body disposed on a lower portion of the multilayer ceramic capacitor, and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes. A width of first regions of the second ceramic body in which the first and second terminal electrodes are disposed is wider than a width of a second region of the second ceramic body between the first regions.

Abstract: A multilayer electronic component includes: a capacitor body including an active region including first and second internal electrodes and upper and lower cover regions; first and second external electrodes including first and second connected portions connected to the first and second internal electrodes and first and second band portions, respectively; and first and second bump terminals having conductive layers and disposed on the first and second band portions, respectively, wherein BW/3?G?BW and T/5<ET<T/2, where BW is a width of each of the first and second band portions, T is a thickness of each of the first and second connected portions, G is a width of each of the first and second bump terminals, and ET is a thickness of each of the first and second bump terminals.

Abstract: A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes, and having first to sixth surfaces; first and second external electrodes including first and second connection portions and first and second band portions, respectively; and first and second connection terminals disposed on the first and second band portions on the first surface of the capacitor body. The first and second connection terminals are each provided with a solder receiving portion to have a symmetrical shape in a direction connecting the third and fourth surfaces and a direction connecting the fifth and sixth surfaces.

Abstract: An apparatus for manufacturing a display device includes a first jig including a first side, the first side having a concave groove for receiving a cover window, wherein the cover window includes a first planar portion, a first curved portion and a second curved portion, wherein the first and second curved portions are disposed at opposite ends of the first planar portion in a first direction, a second jig including a planar side for receiving a display panel, wherein when the second jig is moved in a second direction crossing the first direction with the display panel on the planar side, the display panel is disposed between the first and second curved portions of the cover window, and a pair of third jigs for supporting the first and second curved portions of the cover window.

Abstract: A display device includes a display panel having a display area and a non-display area at least partially surrounding the display area. A panel support sheet is disposed behind the display panel and has a first hole exposing the display area of the display panel. An optical sensor is disposed within the first hole. A first light-blocking portion is disposed in a void area that is between the panel support sheet and the optical sensor, within the first hole.

Abstract: An electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed in a width direction. The capacitor body has first to sixth surfaces, the first and second internal electrodes being exposed through the third and fourth surfaces, respectively. First and second external electrodes are disposed on the third and fourth surfaces and extend to portions of the first surface. A first connection terminal and a second connection terminal are disposed to be respectively connected to be connected to the first and second external electrodes, and each has a shape including at least one indentation in a rectangular outline within which the respective connection terminal is inscribed.

Abstract: A display device includes: a display panel having a display area; a protective cover disposed on a surface of the display panel in a position overlapping the display area, the protective cover having an opening overlapping the display area and extending in a thickness direction opposite from the display panel, the protective cover including a first layer; and a fingerprint sensor disposed at least partially in the opening.

Abstract: An electronic component includes: a capacitor body; first and second external electrodes disposed on both ends of the capacitor body in a length direction; and first and second connection terminals disposed on a mounting surface of the capacitor body and electrically connected to the first and second external electrodes, respectively, and having first and second cut portions on surfaces facing each other in the length direction of the capacitor body, respectively.

Abstract: A multilayer electronic component includes a multilayer capacitor including a capacitor body in which internal electrodes are stacked to be parallel with respect to a mounting surface and external electrodes disposed on opposing end surfaces of the capacitor body, respectively, and a metal frame having a solder pocket and including a vertical portion, an upper horizontal portion extending from an upper end of the vertical portion, and a lower horizontal portion extending from a lower end of the vertical portion, the upper horizontal portion connected to an upper band portion of each of the external electrodes. 0.1?G/CT?0.7 is satisfied, in which CT is a height of the vertical portion and G is a distance between the lower band portion of each of the external electrodes and a lower end of the metal frame.

Abstract: A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween. One end of each of the first and second internal electrodes extends, respectively, to a third or fourth surface of the capacitor body. First and second external electrodes respectively include first and second connected portions disposed on the third and fourth surfaces, and first and second band portions respectively extended from the first and second connected portions to portions of a first surface of the capacitor body. A first connection terminal is disposed on the first band portion to provide a first solder accommodating portion, and a second connection terminal is disposed on the second band portion to provide a second solder accommodating portion.

Abstract: An electronic component includes: a capacitor body; first and second external electrodes disposed on a mounting surface of the capacitor body to be spaced apart from each other; and first and second connection terminals including an insulator, electrically connected to the first and second external electrodes, respectively, through land patterns each disposed on upper and lower surfaces thereof and electrically connected to each other, and having first and second bridge portions protruding so as to face each other in the length direction of the capacitor body, respectively.

Abstract: A composite electronic component includes a multilayer ceramic capacitor including a ceramic body configured by stacking a plurality of dielectric layers and configured by stacking a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween and first and second external electrodes disposed on opposing end portions of the ceramic body, and a pair of substrates spaced apart from a lower portion of the multilayer ceramic capacitor and each including, on opposing end portions, first terminal electrodes connected to the first external electrode and second terminal electrodes connected to the second external electrode.

Abstract: A composite electronic component includes: a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body, and first and second external electrodes disposed on both end portions of the first ceramic body. The ceramic chip includes a second ceramic body disposed on a lower portion of the multilayer ceramic capacitor, and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes. A width of first regions of the second ceramic body in which the first and second terminal electrodes are disposed is wider than a width of a second region of the second ceramic body between the first regions.

Abstract: A multilayer electronic component includes a capacitor body, first and second external electrodes, first and second land portions, and first and second insulating portions. The first and second external electrodes are disposed and spaced apart from each other on a mounting surface of the capacitor body. The first and second land portions include a conductive material and are disposed on the first and second external electrodes, respectively. The first and second insulating portions are disposed between the first and second land portions on the mounting surface of the capacitor body to be spaced apart from each other and each have one end connected to a respective one of the first and second land portions. A board having a multilayer electronic component includes a circuit board having first and second electrode pads disposed on one surface thereof, and the multilayer electronic component mounted thereon.

Abstract: A multilayer electronic component includes a multilayer capacitor including a capacitor body in which internal electrodes are stacked to be parallel with respect to a mounting surface and external electrodes disposed on opposing end surfaces of the capacitor body, respectively, and a metal frame having a solder pocket and including a vertical portion, an upper horizontal portion extending from an upper end of the vertical portion, and a lower horizontal portion extending from a lower end of the vertical portion, the upper horizontal portion connected to an upper band portion of each of the external electrodes. 0.1?G/CT?0.7 is satisfied, in which CT is a height of the vertical portion and G is a distance between the lower band portion of each of the external electrodes and a lower end of the metal frame.

Abstract: An electronic component and a board having the same are provided. The electronic component includes a capacitor body, and first and second external electrodes disposed and spaced apart from each other on a mounting surface of the capacitor body. The electronic component further includes first and second connection terminals respectively connected to the first and second external electrodes and having first and second cutouts, respectively. The electronic component also includes a first plating layer covering the first external electrode and the first connection terminal, and a second plating layer covering the second external electrode and the second connection terminal.

Abstract: A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween. One end of each of the first and second internal electrodes extends, respectively, to a third or fourth surface of the capacitor body. First and second external electrodes respectively include first and second connected portions disposed on the third and fourth surfaces, and first and second band portions respectively extended from the first and second connected portions to portions of a first surface of the capacitor body. A first connection terminal is disposed on the first band portion to provide a first solder accommodating portion, and a second connection terminal is disposed on the second band portion to provide a second solder accommodating portion.

Abstract: A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween. One end of each of the first and second internal electrodes extends, respectively, to a third or fourth surface of the capacitor body. First and second external electrodes respectively include first and second connected portions disposed on the third and fourth surfaces, and first and second band portions respectively extended from the first and second connected portions to portions of a first surface of the capacitor body. A first connection terminal is disposed on the first band portion to provide a first solder accommodating portion, and a second connection terminal is disposed on the second band portion to provide a second solder accommodating portion.

Abstract: A capacitor includes an active layer, a gate insulation layer on the active layer, a gate electrode on the gate insulation layer, an interlayer insulating layer on the gate electrode, and a first electrode on the interlayer insulating layer and connected to the active layer through at least one contact hole.