Abstract: A multilayer electronic component includes a capacitor body, a plurality of external electrodes disposed on a mounting surface of the capacitor body to be spaced apart from each other, and a connection terminal including land portions formed of insulators. The land portions have conductor layers formed on surfaces thereof, and are disposed on respective external electrodes. A bridge portion is disposed between land portions adjacent to each other. Cut portions are formed in the land portions. The multilayer electronic component can optionally be mounted on a circuit board having a plurality of electrode pads such that each land portion is mounted to a respective electrode pad of the circuit board.

Abstract: Provided are a display device and a method of reworking the display device. The display device includes a display element; a window which is disposed to face the display element; an adhesive member which is disposed between the display element and the window and comprises a first adhesive layer disposed on a side of the display element and a second adhesive layer disposed on a side of the window; and a light transmitting film which is disposed between the first adhesive layer and the second adhesive layer.

Abstract: A composite electronic component includes: a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body, and first and second external electrodes disposed on both end portions of the first ceramic body. The ceramic chip includes a second ceramic body disposed on a lower portion of the multilayer ceramic capacitor, and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes. A width of first regions of the second ceramic body in which the first and second terminal electrodes are disposed is wider than a width of a second region of the second ceramic body between the first regions.

Abstract: A capacitor includes a body including a dielectric layer, first internal electrodes and second internal electrodes. Each of the first internal electrodes and each of the second internal electrodes are alternately disposed with the dielectric layer interposed therebetween. A first connection electrode is disposed on a first end surface of the body to connect an end of the first internal electrodes. A second connection electrode is disposed on a second end surface of the body opposite to the first end surface to connect an end of the second internal electrodes. A first insulating layer is disposed on one surface of the body. A first terminal electrode and a second terminal electrode are respectively disposed on opposing end surfaces of the first insulating layer to connect the first connection electrode and the second connection electrode, respectively. A second insulating layer is disposed on another surface of the body.

Abstract: A multilayer electronic component includes a capacitor body, first and second external electrodes, first and second land portions, and first and second insulating portions. The first and second external electrodes are disposed and spaced apart from each other on a mounting surface of the capacitor body. The first and second land portions include a conductive material and are disposed on the first and second external electrodes, respectively. The first and second insulating portions are disposed between the first and second land portions on the mounting surface of the capacitor body to be spaced apart from each other and each have one end connected to a respective one of the first and second land portions. A board having a multilayer electronic component includes a circuit board having first and second electrode pads disposed on one surface thereof, and the multilayer electronic component mounted thereon.

Abstract: A system for disassembling a display device includes a supporting part facing a window and supporting at least a portion of the window. A window fixing part is disposed on the supporting part and is configured to fix a position of the window with respect to the supporting part. A display panel stopper is positioned above the supporting part and is spaced apart from the supporting part by a predetermined distance. A window pressurizing part is configured to apply pressure to the second region of the window along a first orthogonal to an upper surface of the supporting part. A separating stick is movable along a second direction which intersects the first direction. The separating stick is configured to be inserted between the window and a display panel adhered to the window.

Abstract: A multilayer electronic component includes a multilayer capacitor including a capacitor body in which internal electrodes are stacked to be parallel with respect to a mounting surface and external electrodes disposed on opposing end surfaces of the capacitor body, respectively, and a metal frame having a solder pocket and including a vertical portion, an upper horizontal portion extending from an upper end of the vertical portion, and a lower horizontal portion extending from a lower end of the vertical portion, the upper horizontal portion connected to an upper band portion of each of the external electrodes. 0.1?G/CT?0.7 is satisfied, in which CT is a height of the vertical portion and G is a distance between the lower band portion of each of the external electrodes and a lower end of the metal frame.

Abstract: A multilayer electronic component includes: a capacitor body including an active region including first and second internal electrodes and upper and lower cover regions; first and second external electrodes including first and second connected portions connected to the first and second internal electrodes and first and second band portions, respectively; and first and second bump terminals having conductive layers and disposed on the first and second band portions, respectively, wherein BW/3?G?BW and T/5<ET<T/2, where BW is a width of each of the first and second band portions, T is a thickness of each of the first and second connected portions, G is a width of each of the first and second bump terminals, and ET is a thickness of each of the first and second bump terminals.

Abstract: A multilayer electronic component includes a capacitor body, a plurality of external electrodes disposed on a mounting surface of the capacitor body to be spaced apart from each other, and a connection terminal including land portions formed of insulators. The land portions have conductor layers formed on surfaces thereof, and are disposed on respective external electrodes. A bridge portion is disposed between land portions adjacent to each other. Cut portions are formed in the land portions. The multilayer electronic component can optionally be mounted on a circuit board having a plurality of electrode pads such that each land portion is mounted to a respective electrode pad of the circuit board.

Abstract: A composite electronic component includes: a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body, and first and second external electrodes disposed on both end portions of the first ceramic body. The ceramic chip includes a second ceramic body disposed on a lower portion of the multilayer ceramic capacitor, and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes. A width of first regions of the second ceramic body in which the first and second terminal electrodes are disposed is wider than a width of a second region of the second ceramic body between the first regions.

Abstract: A capacitor includes an active layer, a gate insulation layer on the active layer, a gate electrode on the gate insulation layer, an interlayer insulating layer on the gate electrode, and a first electrode on the interlayer insulating layer and connected to the active layer through at least one contact hole.

Abstract: An electronic component includes: a multilayer capacitor having both ends on which external electrodes are disposed; connection terminals including vertical portions, lower horizontal portions having cut portions, respectively, and upper horizontal portions, respectively, lower surfaces of the upper horizontal portions being connected to the external electrodes; and a tantalum capacitor disposed on upper surfaces of the upper horizontal portions to be electrically connected thereto.

Abstract: A multilayer electronic component includes a capacitor body, first and second external electrodes, first and second land portions, and first and second insulating portions. The first and second external electrodes are disposed and spaced apart from each other on a mounting surface of the capacitor body. The first and second land portions include a conductive material and are disposed on the first and second external electrodes, respectively. The first and second insulating portions are disposed between the first and second land portions on the mounting surface of the capacitor body to be spaced apart from each other and each have one end connected to a respective one of the first and second land portions. A board having a multilayer electronic component includes a circuit board having first and second electrode pads disposed on one surface thereof, and the multilayer electronic component mounted thereon.

Abstract: A multilayer capacitor includes a capacitor body including a plurality of first and second internal electrodes alternately disposed therein and a dielectric layer interposed therebetween, and having first to sixth surfaces, opposing each other, respectively; a plurality of external electrodes connected to the first and second internal electrodes; an insulating layer disposed on the first surface; first and second terminal electrodes spaced apart from each other in a direction in which the third and fourth surfaces are connected, on the insulating layer; and a connecting member electrically connecting the first and second terminal electrodes and the external electrodes.

Abstract: A multilayer capacitor includes a capacitor body, dielectric layers and a plurality of first internal electrodes and second internal electrodes forming a portion of the capacitor body, the plurality of first internal electrodes and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween, the capacitor body further having a first surface and a second surface opposing each other, a third surface and a fourth surface opposing each other, and a fifth surface and a sixth surface opposing each other, the first internal electrodes and the second internal electrodes being exposed through at least the third surface and the fourth surface, respectively, an insulating layer disposed in the first surface of the capacitor body, a buffer layer at least partially covering the insulating layer, and a first terminal electrode and a second terminal electrode spaced apart from each other.

Abstract: There are provided a multilayer electronic component and a board having the same. The multilayer electronic component includes: a capacitor body; external electrodes including band portions and connected portions; connection terminals formed of insulators and disposed on the band portions; and insulating portions disposed on at least some circumferential surfaces of the connection terminals. The connection terminals include conductive patterns formed on surfaces thereof facing the band portions and surfaces thereof opposing the surfaces, cut portions are formed in some the circumferential surfaces connecting between the conductive patterns facing each other, connection patterns are formed on the cut portions to electrically connect between the conductive patterns facing each other, and the insulating portions are disposed so as not to cover the cut portions.

Abstract: A multilayer capacitor includes a capacitor body including dielectric layers and a plurality of first and second internal electrodes exposed through the third and fourth surfaces, and having first to sixth surfaces; first and second external electrodes including first and second connection portions disposed on the third and fourth surfaces, and first and second band portions extending from the first and second connection portions to portions of the first and second surfaces and the fifth and sixth surfaces; first and second conductive resin layers covering portions of the first and second band portions; an insulating layer disposed on the first surface; and first and second terminal electrodes spaced apart from each other, covering portions of the insulating layer, and connected to the first and second external electrodes.

Abstract: An organic light emitting diode (OLED) display device and a method of manufacturing the same. The device includes a substrate, a thin film transistor (TFT) on the substrate and including an active layer, a gate electrode, a source electrode, and a drain electrode, a first pixel electrode coupled to one of the source and drain electrodes, a rough portion on the first pixel electrode, a second pixel electrode on the rough portion and having a rough pattern, an intermediate layer on the second pixel electrode including an organic emission layer (EML), and an opposing electrode on the intermediate layer.

Abstract: A multilayer electronic component includes: a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed between each pair of first and second internal electrodes, the capacitor body having third and fourth surfaces opposing each other, an end of each the first and second internal electrodes being exposed through the third and fourth surfaces, respectively; first and second external electrodes disposed on the third and fourth surfaces of the capacitor body, respectively; and first and second connection terminals connected to the first and second external electrodes, respectively, wherein each of the first and second connection terminals includes a vertical portion disposed to face the external electrode, a horizontal portion extended from a lower end of the vertical portion, and a cut portion formed in a portion connecting the vertical portion and the horizontal portion to each other.

Abstract: A composite electronic component includes: a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body, and first and second external electrodes disposed on both end portions of the first ceramic body. The ceramic chip includes a second ceramic body disposed on a lower portion of the multilayer ceramic capacitor, and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes. A width of first regions of the second ceramic body in which the first and second terminal electrodes are disposed is wider than a width of a second region of the second ceramic body between the first regions.