Patents by Inventor Seiichi Sato

Seiichi Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6828316
    Abstract: The present invention relates to diamide derivatives represented by the following general formula (1): wherein A is a phenyl group or the like, which may be substituted, B is —CH═CH—, —C≡C—, —(CH═CH)2—, —C≡C—CH═CH—, —CH═CH—C≡C—, phenylene or the like, and W is and medicines comprising such a compound. These compounds have an excellent inhibitory effect on the production of an IgE antibody and are hence useful as antiallergic agents and the like.
    Type: Grant
    Filed: October 17, 2001
    Date of Patent: December 7, 2004
    Assignee: Kowa Co., Ltd.
    Inventors: Hiroyuki Ishiwata, Mototsugu Kabeya, Hiromichi Shigyo, Masami Shiratsuchi, Yukio Hattori, Hiroshi Nakao, Takao Nagoya, Seiichi Sato, Soichi Oda, Makoto Suda, Manabu Shibasaki
  • Publication number: 20040229288
    Abstract: A method for conveniently detecting binding between the von Willebrand factor and glycoprotein Ib and a means to be used therein. The von Willebrand factor fixed in a reactor immobilized in a reaction vessel in the presence of bottrocetin is bound to a chimeric protein constructed by fusing the carboxyl terminal of a partial protein containing the von Willebrand factor-binding site of glycoprotein Ib with the amino terminal of the Fc region of an immunoglobulin molecule. Then the Fc region of the above immunoglobulin molecule is detected to thereby detect the binding between the von Willebrand factor and the glycoprotein Ib or inhibition of this binding.
    Type: Application
    Filed: April 16, 2004
    Publication date: November 18, 2004
    Applicant: AJINOMOTO CO., INC.
    Inventors: Naoyuki Fukuchi, Fumie Futaki, Morikazu Kito, Seiichi Sato, Takayuki Kajiura, Yukitsugu Ono, Koichi Ishii, Akiko Tanaka, Junko Shinozaki, Yasuko Jojima
  • Patent number: 6787653
    Abstract: A process for preparing a biphenylcarboxylic acid amide derivative represented by the following formula (1): wherein, R1, R2 and R3 each independently represents a hydrogen atom or a substituent, which comprises reacting, in the presence of a metal catalyst, a halogenobenzoic acid derivative represented by the following formula (2): wherein, X represents a halogen atom with a compound represented by the following formula (3): wherein, R1, R2 and R3 have the same meanings as described above, and Y represents an leaving group having an element selected from the group consisting of boron, silicon, zinc, tin and magnesium; or salt thereof. According to the present invention, biphenylcarboxylic acid amide derivatives of the formula (1) or salts thereof having excellent inhibitory activity against IgE antibody production can be prepared by the reduced number of steps, conveniently, at lower cost and in a high yield.
    Type: Grant
    Filed: June 6, 2002
    Date of Patent: September 7, 2004
    Assignee: Kowa Co., Ltd.
    Inventors: Hiroyuki Ishiwata, Seiichi Sato, Mototsugu Kabeya, Soichi Oda
  • Patent number: 6706703
    Abstract: A bis(5-aryl-2-pyridyl) compound represented by formula (1) or a salt thereof: wherein A is a substituted or unsubstituted aromatic hydrocarbon group or a substituted or unsubstituted aromatic heterocyclic group, and X is a group selected from the group consisting of moieties having formulas (2) to (5): wherein, in formula (2), m is an integer of 1 or 2; in formula (3), n is an integer of 1 to 6; and in formula (4), R is hydrogen or a lower alkyl group and p is an integer of 1 to 6.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: March 16, 2004
    Assignee: Kowa Co., Ltd.
    Inventors: Hiroyuki Ishiwata, Seiichi Sato, Mototsugu Kabeya, Soichi Oda, Makoto Suda, Manabu Shibasaki
  • Patent number: 6685777
    Abstract: A paste applicator and paste application method for die bonding apply paste to adhere a semiconductor chip on a substrate. Data on paste application volume and application pattern which can be identified from paste thickness and chip size are stored. A dispensing flow rate calculator calculates dispensing flow rate of a dispenser based on the paste application volume data and application pattern data when the paste is dispensed from the dispenser and pressure fed to an application nozzle for applying paste. Based on this calculated dispensing flow rate and application pattern data, a dispenser controller controls the dispenser and a transfer table controller controls the transfer table for moving the application nozzle.
    Type: Grant
    Filed: November 28, 2001
    Date of Patent: February 3, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Seiichi Sato, Hitoshi Mukojima, Nobuyuki Iwashita, Nobuyuki Suefuji, Mitsuru Ozono
  • Publication number: 20040012751
    Abstract: A liquid crystal display device includes a thin film transistor (TFT) array substrate 10, a counter substrate 22 provided opposite to the TFT array substrate 10 and a liquid crystal layer 28 held between the TFT array and counter substrates 10 and 22. The TFT array substrate 10 has display and frame areas 31 and 32. There are pixel electrodes in the display area 31 which each have reflective and transparent portions 33 and 34 with convex and concave portions 29 and 30, respectively. Convex and concave portions 36 and 37 are also provided in the frame area 32 which are substantially the same in shape as convex and concave portions 29 and 30 in the display area 31. The surface of a photoresist coating film in the display area 31 shown by a dotted line 39 is substantially the same in configuration as that in the frame area 32 to make the column-like spacers 27 and 38 substantially the same in height. A cell gap between the TFT array and counter substrates 10 and 22 is made thereby substantially uniform.
    Type: Application
    Filed: June 2, 2003
    Publication date: January 22, 2004
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Tetsuya Iizuka, Nobuko Fukuoka, Yasuyuki Hanazawa, Seiichi Sato
  • Publication number: 20040002497
    Abstract: Compounds having the formula (1): 1
    Type: Application
    Filed: March 26, 2003
    Publication date: January 1, 2004
    Applicant: KOWA CO., LTD.
    Inventors: Yoshinori Kyotani, Tomoyuki Koshi, Hiromichi Shigyo, Hideo Yoshizaki, Takahiro Kitamura, Shunji Takemura, Kyoko Yasuoka, Junko Totsuka, Seiichi Sato
  • Publication number: 20030232992
    Abstract: A process for preparing a biphenylcarboxylic acid amide derivative represented by the following formula (1): 1
    Type: Application
    Filed: June 6, 2002
    Publication date: December 18, 2003
    Applicant: KOWA CO., LTD.
    Inventors: Hiroyuki Ishiwata, Seiichi Sato, Mototsugu Kabeya, Soichi Oda
  • Patent number: 6645957
    Abstract: The invention relates to compounds represented by the following general formula (1): wherein A is an aromatic compound which may be substituted, or the like, B is a nitrogen atom or CH, X is a lower alkylene group which may be substituted, or the like, Y is a single bond or the like; Z is a divalent residue of benzene which may be substituted, or the like, and m and n are independently an integer of 1 to 4, and medicines comprising such a compound. These compounds have an excellent inhibitory effect on the production of an IgE antibody and are hence useful as antiallergic agents and the like.
    Type: Grant
    Filed: June 19, 2002
    Date of Patent: November 11, 2003
    Assignee: Kowa Co., Ltd.
    Inventors: Hiroyuki Ishiwata, Seiichi Sato, Mototsugu Kabeya, Soichi Oda, Yukio Hattori, Makoto Suda, Manabu Shibasaki, Hiroshi Nakao, Takao Nagoya
  • Patent number: 6605315
    Abstract: The object of the present invention is to provide a bonding paste applicator and a method of applying a bonding paste which allow satisfactory paste applying quality and excellent operability to be realized. A bonding paste application method for applying a bonding paste by making a drawing with a paste applying nozzle made to move to a position, where a chip is mounted on a substrate, comprises the steps of storing in advance in a storing unit 46 a drawing pattern for controlling each of X, Y and Z axes to move a paste applying nozzle and a drawing pattern setting table 53 to show a category corresponding to the size of a chip to be bonded, selecting a drawing pattern corresponding to the size of the chip, which has been designated, by means of a drawing pattern selecting unit 54 and obtaining a speed pattern for each of the X, Y and Z axes based on the selected drawing pattern by means of a speed pattern computing unit 55.
    Type: Grant
    Filed: November 3, 2000
    Date of Patent: August 12, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Mitsuru Ozono, Seiichi Sato, Nobuyuki Suefuji, Nobuyuki Iwashita
  • Publication number: 20030119838
    Abstract: Compounds having the formula (1): 1
    Type: Application
    Filed: September 25, 2002
    Publication date: June 26, 2003
    Applicant: KOWA CO., LTD.
    Inventors: Yoshinori Kyotani, Tomoyuki Koshi, Hiromichi Shigyo, Hideo Yoshizaki, Takahiro Kitamura, Shunji Takemura, Kyoko Yasuoka, Junko Totsuka, Seiichi Sato
  • Patent number: 6576642
    Abstract: Compounds having the formula (1): wherein A is a phenyl, naphthyl, dihydronaphthyindeny, pyridyl, indolyl,isoindolyl, quinolyl or isoquinolyl group which are optionally substituted; X is optionally substituted alicyclic, aromatic, imino or heterocyclic groups or —S— or —O—; Y is a single bond or an alkylene group; Z is an unsubstituted aliphatic group or divalent residue of benzene or pyridine, which is optionally substituted; anis hydrogen, lower alkyl, cycloalkyl, aryl or aralkyl; with certain provisos. These compounds exhibit an inhibitory effect on the production of IgE antibodies and are, hence, useful as antiallergic agents.
    Type: Grant
    Filed: May 17, 2001
    Date of Patent: June 10, 2003
    Assignee: Kowa Co., Ltd.
    Inventors: Hiroyuki Ishiwata, Mototsugu Kabeya, Masami Shiratsuchi, Yukio Hattori, Hiroshi Nakao, Takao Nagoya, Seiichi Sato, Soichi Oda, Makoto Suda, Manabu Shibasaki
  • Publication number: 20030096828
    Abstract: The invention relates to compounds represented by the following general formula (1): 1
    Type: Application
    Filed: June 19, 2002
    Publication date: May 22, 2003
    Applicant: KOWA CO., LTD.
    Inventors: Hiroyuki Ishiwata, Seiichi Sato, Mototsugu Kabeya, Soichi Oda, Yukio Hattori, Makoto Suda, Manabu Shibasaki, Hiroshi Nakao, Takao Nagoya
  • Publication number: 20030027814
    Abstract: A bis(5-aryl-2-pyridyl) compound represented by formula (1) or a salt thereof: 1
    Type: Application
    Filed: June 29, 2001
    Publication date: February 6, 2003
    Applicant: Kowa Co., Ltd.
    Inventors: Hiroyuki Ishiwata, Seiichi Sato, Mototsugu Kabeya, Soichi Oda, Makoto Suda, Manabu Shibasaki
  • Publication number: 20030022886
    Abstract: A bis(2-aryl-5-pyridyl) compound having formula (1) or a salt thereof: 1
    Type: Application
    Filed: June 29, 2001
    Publication date: January 30, 2003
    Applicant: Kowa Co., Ltd.
    Inventors: Hiroyuki Ishiwata, Seiichi Sato, Mototsugu Kabeya, Soichi Oda, Makoto Suda, Manabu Shibasaki
  • Patent number: 6460756
    Abstract: A method of applying a bonding paste efficiently and uniformly by discharging the bonding paste from an application nozzle is presented. For applying the paste along a drawing pattern including a cross shape pattern composed of crossing plural application lines, the nozzle moves from the center of the cross shape to an end point along one application line, turns to a reverse direction at the end point, and moves to an end point at opposite side of the application line. Then, the nozzle returns from the end point to the center of the cross shape. The nozzle repeats this unit application line drawing operation for each application line. As a result, the nozzle stops less frequently near the center, has a shortened cycle time, and applies the paste uniformly.
    Type: Grant
    Filed: July 16, 2001
    Date of Patent: October 8, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Mitsuru Ozono, Seiichi Sato, Nobuyuki Suefuji
  • Patent number: 6448242
    Abstract: The invention relates to compounds represented by the following general formula (1): wherein A is an aromatic compound which may be substituted, or the like, B is a nitrogen atom or CH, X is a lower alkylene group which may be substituted, or the like, Y is a single bond or the like; Z is a divalent residue of benzene which may be substituted, or the like, and m and n are independently an integer of 1 to 4, and medicines comprising such a compound. These compounds have an excellent inhibitory effect on the production of an IgE antibody and are hence useful as antiallergic agents and the like.
    Type: Grant
    Filed: August 21, 2000
    Date of Patent: September 10, 2002
    Assignee: Kowa Co., Ltd.
    Inventors: Hiroyuki Ishiwata, Seiichi Sato, Mototsugu Kabeya, Soichi Oda, Yukio Hattori, Makoto Suda, Manabu Shibasaki, Hiroshi Nakao, Takao Nagoya
  • Publication number: 20020042414
    Abstract: The present invention relates to diamide derivatives represented by the following general formula (1): 1
    Type: Application
    Filed: October 17, 2001
    Publication date: April 11, 2002
    Applicant: KOWA CO., LTD.
    Inventors: Hiroyuki Ishiwata, Mototsugu Kabeya, Hiromichi Shigyo, Masami Shiratsuchi, Yukio Hattori, Hiroshi Nakao, Takao Nagoya, Seiichi Sato, Soichi Oda, Makoto Suda, Manabu Shibasaki
  • Publication number: 20020037372
    Abstract: A paste applicator and paste application method for die bonding apply paste to adhere a semiconductor chip on a substrate. Data on paste application volume and application pattern which can be identified from paste thickness and chip size are stored. A dispensing flow rate calculator calculates dispensing flow rate of a dispenser based on the paste application volume data and application pattern data when the paste is dispensed from the dispenser and pressure fed to an application nozzle for applying paste. Based on this calculated dispensing flow rate and application pattern data, a dispenser controller controls the dispenser and a transfer table controller controls the transfer table for moving the application nozzle.
    Type: Application
    Filed: November 28, 2001
    Publication date: March 28, 2002
    Inventors: Seiichi Sato, Hitoshi Mukojima, Nobuyuki Iwashita, Nobuyuki Suefuji, Mitsuru Ozono
  • Patent number: 6361831
    Abstract: A paste applicator and paste application method for die bonding apply paste to adhere a semiconductor chip on a substrate. Data on paste application volume and application pattern which can be identified from paste thickness and chip size are stored. A dispensing flow rate calculator calculates dispensing flow rate of a dispenser based on the paste application volume data and application pattern data when the paste is dispensed from the dispenser and pressure fed to an application nozzle for applying paste. Based on this calculated dispensing flow rate and application pattern data, a dispenser controller controls the dispenser and a transfer table controller controls the transfer table for moving the application nozzle.
    Type: Grant
    Filed: April 6, 2000
    Date of Patent: March 26, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Seiichi Sato, Hitoshi Mukojima, Nobuyuki Iwashita, Nobuyuki Suefuji, Mitsuru Ozono