Patents by Inventor Seiichi Suenaga

Seiichi Suenaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11948900
    Abstract: A bonded body according to an embodiment includes a substrate, a metal member, and a bonding layer. The bonding layer is provided between the substrate and the metal member. The bonding layer includes a first particle including carbon, a first region including a metal, and a second region including titanium. The second region is provided between the first particle and the first region. A concentration of titanium in the second region is greater than a concentration of titanium in the first region.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: April 2, 2024
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Maki Yonetsu, Seiichi Suenaga, Sachiko Fujisawa, Takayuki Naba
  • Publication number: 20240082824
    Abstract: According to one embodiment, there is provided a multielement composite oxide powder that includes an oxide particle including a composite oxide, the composite oxide containing: constituent metal elements containing two or more hexavalent metal elements and two or more pentavalent metal elements at a content of 80 atm % or more in total; and oxygen. The oxide particle has a major axis and a minor axis intersecting the major axis, and has a polygonal tunnel structure including one or more polygonal tunnels of five or more vertices in a major axis direction along the major axis.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 14, 2024
    Applicant: TOSHIBA MATERIALS CO., LTD.
    Inventors: Daisuke FUKUSHI, Seiichi SUENAGA, Akito SASAKI, Masaki TOYOSHIMA
  • Publication number: 20240079238
    Abstract: A bonded object production method according to an embodiment uses a continuous furnace to process a stacked body including a metal member, a ceramic member, and a brazing material layer located therebetween, while conveying the stacked body; and the method includes a process of heating the stacked body in an inert atmosphere from 200° C. to a bonding temperature at an average temperature raising rate of the stacked body of not less than 15° C./min, a process of bonding the stacked body in an inert atmosphere at the bonding temperature that is within a range of not less than 600° C. and not more than 950° C., and a process of cooling the stacked body from the bonding temperature to 200° C. at an average temperature lowering rate of the stacked body of not less than 15° C./min. A ceramic substrate is favorably a silicon nitride substrate.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 7, 2024
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Hiromasa KATO, Masanori HOSHINO, Hideaki HIRABAYASHI, Seiichi SUENAGA, Kazumitsu MORIMOTO
  • Publication number: 20230260868
    Abstract: A bonded body according to an embodiment includes a ceramic substrate, a copper plate, and a bonding layer. The bonding layer is located on at least one surface of the ceramic substrate and bonds the ceramic substrate and the copper plate. The bonding layer includes Ag and Ti. The copper plate includes a first region, a second region, and a third region. The first region is separated from the bonding layer in a thickness direction. The second region is located between the bonding layer and the first region and has a higher Ag concentration than the first region. The third region is located between the bonding layer and the second region and has a lower Ag concentration than the second region.
    Type: Application
    Filed: March 28, 2023
    Publication date: August 17, 2023
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Maki YONETSU, Seiichi SUENAGA, Sachiko FUJISAWA, Takashi SANO
  • Publication number: 20230202137
    Abstract: A bonded assembly according to the present embodiment, includes a metal plate and a ceramic substrate bonded to each other through a bonding layer containing Ag. In the bonded assembly, in a measurement region that is formed in a cross section formed by a thickness direction of the bonding layer and an orthogonal direction thereto, and that has a size of a length in the thickness direction of the bonding layer×a length of 200 ?m in the orthogonal direction, a Ag-rich region having a Ag concentration of 60 at % or more has an area ratio of 70% or less to a Ag-poor region having a Ag concentration of 50 at % or less.
    Type: Application
    Filed: February 28, 2023
    Publication date: June 29, 2023
    Inventors: Shota YAMAMOTO, Fumihiko YOSHIMURA, Seiichi SUENAGA, Tomoyuki OOZEKI
  • Publication number: 20230187310
    Abstract: According to the embodiment, a bonded body includes a ceramic substrate, a copper plate. A bonding layer is located on at least one surface of the ceramic substrate. The bonding layer bonds the ceramic substrate and the copper plate. The bonding layer includes a Ti reaction layer including titanium nitride or titanium oxide as a major component, and a plurality of first alloys positioned between the Ti reaction layer and the copper plate. Each of the plurality of first alloys includes at least one selected from a Cu—Sn alloy and a Cu—In alloy. The first alloys have mutually-different Sn concentrations or In concentrations. According to the embodiment, a warp amount can be reduced. A heating rate and a cooling rate in the bonding process can be increased. According to the embodiment, a silicon nitride substrate is favorable for the ceramic substrate.
    Type: Application
    Filed: February 2, 2023
    Publication date: June 15, 2023
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Seiichi SUENAGA, Maki YONETSU, Sachiko FUJISAWA, Yoichiro MORI
  • Publication number: 20230135530
    Abstract: A bonded body according to an embodiment comprises a ceramic substrate, a copper plate, and a bonding layer provided on at least one surface of the ceramic substrate and bonding the ceramic substrate and the copper plate, in which the bonding layer contains Cu, Ti, and a first element being one or two selected from Sn and In, and the bonding layer includes a Ti-rich region in which a ratio (MTi/ME1) of a mass MTi of Ti to a mass ME1 of the first element being 0.5 or more and a Ti-poor region in which the ratio (MTi/ME1) being 0.1 or less.
    Type: Application
    Filed: December 27, 2022
    Publication date: May 4, 2023
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Seiichi SUENAGA, Maki YONETSU, Sachiko FUJISAWA
  • Publication number: 20230140744
    Abstract: A bonded body according to an embodiment comprises a ceramic substrate, a copper plate, and a bonding layer provided on at least one surface of the ceramic substrate and bonding the ceramic substrate and the copper plate, in which the bonding layer contains Ag, Cu, Ti, and a first element being one or two selected from Sn and In, a Ti alloy of Ti and at least one selected from Ag, Cu, Sn, and In existing at a bonding boundary between the copper plate and the bonding layer, and the Ti alloy existing over not less than 30% per a length of 30 ?m at the bonding boundary.
    Type: Application
    Filed: December 27, 2022
    Publication date: May 4, 2023
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Seiichi SUENAGA, Maki YONETSU, Sachiko FUJISAWA
  • Publication number: 20230080016
    Abstract: A bonded body according to an embodiment includes a ceramic substrate, a copper plate, and a bonding layer that is located on at least one surface of the ceramic substrate and bonds the ceramic substrate and the copper plate. The bonding layer includes titanium. The bonding layer includes first and second regions; the first region includes a layer including titanium as a major component; the layer is formed at an interface of the bonding layer with the ceramic substrate; and the second region is positioned between the first region and the copper plate. The bonded body has a ratio M1/M2 of a titanium concentration M1 at % in the first region and a titanium concentration M2 at % in the second region that is not less than 0.1 and not more than 5 when the Ti concentrations are measured by EDX respectively in measurement regions in the first and second regions.
    Type: Application
    Filed: November 10, 2022
    Publication date: March 16, 2023
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Maki YONETSU, Seiichi SUENAGA, Sachiko FUJISAWA, Takashi SANO
  • Publication number: 20220295644
    Abstract: A bonded body includes a ceramic substrate and a copper plate, in which the copper plate is bonded to the ceramic substrate via a bonding layer, the copper plate includes a surface perpendicular to a direction in which the ceramic substrate and the copper plate are bonded, and a number percentage of copper crystal grains having major diameters greater than 400 ?m in three 5 mm×5 mm regions included in the surface is not less than 0% and not more than 5%. The bonding temperature is favorably not more than 800° C. The number percentage of the copper crystal grains having major diameters greater than 400 ?m is favorably not more than 1%.
    Type: Application
    Filed: May 27, 2022
    Publication date: September 15, 2022
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Maki YONETSU, Seiichi SUENAGA, Sachiko FUJISAWA, Takashi SANO
  • Publication number: 20220288726
    Abstract: According to one embodiment, when a DSC curve is measured using a differential scanning calorimeter (DSC) for a brazing material for bonding a ceramic substrate and a metal plate, the brazing material has an endothermic peak within a range of not less than 550° C. and not more than 700° C. in a heating process. The brazing material favorably includes Ag, Cu, and Ti. The brazing material favorably has not less than two of the endothermic peaks within a range of not less than 550° C. and not more than 650° C. in the heating process.
    Type: Application
    Filed: May 27, 2022
    Publication date: September 15, 2022
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Maki YONETSU, Seiichi SUENAGA, Sachiko FUJISAWA, Takashi SANO
  • Publication number: 20210398928
    Abstract: A bonded body according to an embodiment includes a substrate, a metal member, and a bonding layer. The bonding layer is provided between the substrate and the metal member. The bonding layer includes a first particle including carbon, a first region including a metal, and a second region including titanium. The second region is provided between the first particle and the first region. A concentration of titanium in the second region is greater than a concentration of titanium in the first region.
    Type: Application
    Filed: September 2, 2021
    Publication date: December 23, 2021
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Maki YONETSU, Seiichi SUENAGA, Sachiko FUJISAWA, Takayuki NABA
  • Patent number: 10513760
    Abstract: Provided is a method for producing a magnetic material. The method includes preparing magnetic metal particles containing at least one magnetic metal selected from a first group consisting of Fe, Co and Ni, and at least one non-magnetic metal selected from a second group consisting of Mg, Al, Si, Ca, Zr, Ti, Hf, Zn, Mn, Ba, Sr, Cr, Mo, Ag, Ga, Sc, V, Y, Nb, Pb, Cu, In, Sn and rare earth elements, pulverizing and reaggregating the magnetic metal particles, and thereby forming composite particles containing a magnetic metal phase and an interstitial phase, and heat-treating the composite particles at a temperature of from 50° C. to 800° C. The particle size distribution of the magnetic metal particles in the preparing magnetic metal particles has two or more peaks.
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: December 24, 2019
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tomohiro Suetsuna, Koichi Harada, Tomoko Eguchi, Toshihide Takahashi, Seiichi Suenaga
  • Patent number: 10184674
    Abstract: A vapor separator in an embodiment is arranged between a first space and a second space, and is used to allow vapor existing in the first space to permeate the second space by making a vapor pressure in the second space lower than a vapor pressure in the first space. The vapor separator in the embodiment includes: a porous body having a first face, a second face opposite to the first face, and fine pores passing from the first face to the second face; and a soluble absorbent existing in the fine pores of the porous body.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: January 22, 2019
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Kouichi Harada, Ryosuke Yagi, Hitomi Saito, Nao Kobayashi, Maki Yonetsu, Seiichi Suenaga
  • Patent number: 10173168
    Abstract: A vapor separator in an embodiment is arranged between a first space and a second space, and is used to allow vapor existing in the first space to permeate in the second space by making a vapor pressure in the second space lower than a vapor pressure in the first space. The vapor separator in the embodiment includes: a porous body including a first face in contact with the first space and having a convexo-concave structure, a second face in contact with the second space, and fine pores passing to the second face from at least wall of the first face which constitutes the convexo-concave structure; and water existing in the fine pores of the porous body.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: January 8, 2019
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Koichi Harada, Hitomi Saito, Maki Yonetsu, Seiichi Suenaga
  • Patent number: 10090088
    Abstract: The soft magnetic material of embodiments includes flattened magnetic metal particles including at least one magnetic metal selected from iron (Fe), cobalt (Co) and nickel (Ni), each of the flattened magnetic metal particles having a thickness of from 10 nm to 100 ?m, an aspect ratio of from 5 to 10,000, and a lattice strain of from 0.01% to 10%, and being oriented with magnetic anisotropy in one direction within aligned flattened surface; and an interposed phase existing between the flattened magnetic metal particles and including at least one of oxygen (O), carbon (C), nitrogen (N) and fluorine (F).
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: October 2, 2018
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tomohiro Suetsuna, Tomoko Eguchi, Kouichi Harada, Seiichi Suenaga, Hiroaki Kinouchi
  • Publication number: 20180272311
    Abstract: A gas separator of an embodiment includes: a honeycomb base having a plurality of through holes juxtaposed and made apart from one another by partition walls extending between a first face and a second face; and porous aggregates of inorganic material particles filled in the through holes and each having a third face and a fourth face. The porous aggregates each include pores passing from the third face to the fourth face among the inorganic material particles, and air permeability of the porous aggregates from the third faces to the fourth faces is not less than 1×10?14 m2 nor more than 1×10?11 m2.
    Type: Application
    Filed: September 15, 2017
    Publication date: September 27, 2018
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Koichi HARADA, Maki YONETSU, Hitomi SAITO, Ryosuke RAGI, Seiichi SUENAGA
  • Patent number: 9997289
    Abstract: Provided is a magnetic material including a plurality of flat particles containing a magnetic metal, and a matrix phase disposed around the flat particles and having higher electrical resistance than the flat particles. In a cross-section of the magnetic material, the aspect ratio of the flat particles is 10 or higher. If the major axis of one of the flat particles is designated as L and the length of a straight line connecting two endpoints of the flat particle is designated as W, the proportion of the area surrounded by the outer peripheries of parts in which flat particles satisfying the relationship: W ?0.95×L are continuously laminated, is 10% or more of the cross-section.
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: June 12, 2018
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tomoko Eguchi, Tomohiro Suetsuna, Koichi Harada, Toshihide Takahashi, Seiichi Suenaga
  • Patent number: 9975099
    Abstract: A fuel synthesis catalyst of an embodiment for hydrogenating a gas includes at least one selected from the group consisting of; carbon dioxide and carbon monoxide, the catalyst comprising, a base material containing at least one oxide selected from the group consisting of; Al2O3, MgO, TiO2, and SiO2, first metals containing at least one metal selected from the group consisting of; Ni, Co, Fe, and Cu and brought into contact with the base material, and a first oxide containing at least one selected from the group consisting of; CeO2, ZrO2, TiO2, and SiO2 and having an interface with each of the first metals and the base material. The first metals exist on an outer surface of the base material, and on a surface of the base material in fine pores having opening ends on the outer surface of the base material and inside the base material. The first metals and the first oxide exist in the fine pores. The first metals have interfaces with the base material in the fine pores.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: May 22, 2018
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takayuki Fukasawa, Kenji Essaki, Shinsuke Matsuno, Takashi Kuboki, Yasuhiro Goto, Seiichi Suenaga
  • Patent number: 9929321
    Abstract: The embodiment of the present disclosure provides a phosphor improved in the emission intensity maintenance ratio without impairing the emission intensity. The phosphor is a silicofluoride phosphor and shows an IR absorption spectrum satisfying the conditions of 0?I2/I1?0.01 and 6.7?(I3/I1)/CMn. In those conditional formulas, I1, I2 and I3 are intensities of the maximum peaks in the ranges of 1200 to 1240 cm?1, 3570 to 3610 cm?1 and 635 to 655 cm?1, respectively, and CMn is a weight percent of Mn contained the phosphor.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: March 27, 2018
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Yumi Fukuda, Keiko Albessard, Yasushi Hattori, Seiichi Suenaga