Patents by Inventor Sergio Kolor
Sergio Kolor has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11934313Abstract: A system including a plurality of processor cores, a plurality of graphics processing units, a plurality of peripheral circuits, and a plurality of memory controllers is configured to support scaling of the system using a unified memory architecture.Type: GrantFiled: August 22, 2022Date of Patent: March 19, 2024Assignee: Apple Inc.Inventors: Per H. Hammarlund, Lior Zimet, James Vash, Gaurav Garg, Sergio Kolor, Harshavardhan Kaushikkar, Ramesh B. Gunna, Steven R. Hutsell
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Publication number: 20230388241Abstract: An apparatus includes an interface circuit and an encoder circuit. The interface circuit is configured to send a data packet via a plurality of segments, and to send an idle value via the plurality of segments when no data packet is available. The idle value is configured to cause a segment in a receiving apparatus to idle. The encoder circuit is configured to receive a particular data packet, and, if a portion of the particular data packet has a same value as the idle value for a subset of the plurality of segments, to replace at least a portion of the data packet with a mask value to generate a modified data packet. The mask value indicates how to recreate the particular data packet. The encoder circuit is further configured to send the modified data packet to the receiving apparatus via the plurality of segments of the interface circuit.Type: ApplicationFiled: May 31, 2023Publication date: November 30, 2023Inventors: Dany Davidov, Nir Leshem, Mark Pilip, Sergio Kolor
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Publication number: 20230350828Abstract: In an embodiment, a system on a chip (SOC) comprises a semiconductor die on which circuitry is formed, wherein the circuitry comprises a plurality of agents and a plurality of network switches coupled to the plurality of agents. The plurality of network switches are interconnected to form a plurality of physical and logically independent networks. A first network of the plurality of physically and logically independent networks is constructed according to a first topology and a second network of the plurality of physically and logically independent networks is constructed according to a second topology that is different from the first topology. For example, the first topology may a ring topology and the second topology may be a mesh topology. In an embodiment, coherency may be enforced on the first network and the second network may be a relaxed order network.Type: ApplicationFiled: April 28, 2023Publication date: November 2, 2023Inventors: Sergio Kolor, Sergio V. Tota, Tzach Zemer, Sagi Lahav, Jonathan M. Redshaw, Per H. Hammarlund, Eran Tamari, James Vash, Gaurav Garg, Lior Zimet, Harshavardhan Kaushikkar, Steven Fishwick, Steven R. Hutsell, Shawn M. Fukami
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Patent number: 11803471Abstract: An integrated circuit (IC) including a plurality of processor cores, a plurality of graphics processing units, a plurality of peripheral circuits, and a plurality of memory controllers is configured to support scaling of the system using a unified memory architecture. For example, the IC may include an interconnect fabric configured to provide communication between the one or more memory controller circuits and the processor cores, graphics processing units, and peripheral devices; and an off-chip interconnect coupled to the interconnect fabric and configured to couple the interconnect fabric to a corresponding interconnect fabric on another instance of the integrated circuit, wherein the interconnect fabric and the off-chip interconnect provide an interface that transparently connects the one or more memory controller circuits, the processor cores, graphics processing units, and peripheral devices in either a single instance of the integrated circuit or two or more instances of the integrated circuit.Type: GrantFiled: August 22, 2022Date of Patent: October 31, 2023Assignee: Apple Inc.Inventors: Per H. Hammarlund, Lior Zimet, Sergio Kolor, Sagi Lahav, James Vash, Gaurav Garg, Tal Kuzi, Jeffry E. Gonion, Charles E. Tucker, Lital Levy-Rubin, Dany Davidov, Steven Fishwick, Nir Leshem, Mark Pilip, Gerard R. Williams, III, Harshavardhan Kaushikkar, Srinivasa Rangan Sridharan
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Publication number: 20230239252Abstract: In an embodiment, a system includes a plurality of integrated circuits have subsets of a plurality of agents. The plurality of integrated circuits may have network segments implemented wholly (e.g., entirely) within the respective integrated circuits and may have segment to segment (S2S) network interface circuits to couple to other network segments of a plurality of network segment forming a network among the plurality of agents.Type: ApplicationFiled: July 19, 2022Publication date: July 27, 2023Inventors: Sergio Kolor, Lior Zimet, Opher D. KAHN, Eran Tamari, Tzach Zemer, Per H. Hammarlund
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Patent number: 11706150Abstract: An apparatus includes an interface circuit and an encoder circuit. The interface circuit is configured to send a data packet via a plurality of segments, and to send an idle value via the plurality of segments when no data packet is available. The idle value is configured to cause a segment in a receiving apparatus to idle. The encoder circuit is configured to receive a particular data packet, and, if a portion of the particular data packet has a same value as the idle value for a subset of the plurality of segments, to replace at least a portion of the data packet with a mask value to generate a modified data packet. The mask value indicates how to recreate the particular data packet. The encoder circuit is further configured to send the modified data packet to the receiving apparatus via the plurality of segments of the interface circuit.Type: GrantFiled: April 6, 2021Date of Patent: July 18, 2023Assignee: Apple Inc.Inventors: Dany Davidov, Nir Leshem, Mark Pilip, Sergio Kolor
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Patent number: 11675722Abstract: In an embodiment, a system on a chip (SOC) comprises a semiconductor die on which circuitry is formed, wherein the circuitry comprises a plurality of agents and a plurality of network switches coupled to the plurality of agents. The plurality of network switches are interconnected to form a plurality of physical and logically independent networks. A first network of the plurality of physically and logically independent networks is constructed according to a first topology and a second network of the plurality of physically and logically independent networks is constructed according to a second topology that is different from the first topology. For example, the first topology may a ring topology and the second topology may be a mesh topology. In an embodiment, coherency may be enforced on the first network and the second network may be a relaxed order network.Type: GrantFiled: June 3, 2021Date of Patent: June 13, 2023Assignee: Apple Inc.Inventors: Sergio Kolor, Sergio V. Tota, Tzach Zemer, Sagi Lahav, Jonathan M. Redshaw, Per H. Hammarlund, Eran Tamari, James Vash, Gaurav Garg, Lior Zimet, Harshavardhan Kaushikkar, Steven Fishwick, Steven R. Hutsell, Shawn M. Fukami
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Patent number: 11609878Abstract: In an embodiment, a system on a chip (SOC) comprises a semiconductor die on which circuitry is formed, wherein the circuitry comprises a memory controller circuit and a plurality of networks formed from a plurality of individual network component circuits. The memory controller includes a PIO message control circuit that is configured to receive PIO messages addressed to individual network component circuits and determine whether to send the PIO messages to the individual network component circuits based on determine whether previous PIO messages are pending for the individual network component circuits. The PIO message control circuit is configured to delay a first PIO message at the PIO message control circuit in response to determining that previous PIO message is pending for the addressee of the first PIO message.Type: GrantFiled: May 13, 2021Date of Patent: March 21, 2023Assignee: Apple Inc.Inventors: Sergio Kolor, Oren Bar, Ilya Granovsky
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Publication number: 20230058989Abstract: An integrated circuit (IC) including a plurality of processor cores, a plurality of graphics processing units, a plurality of peripheral circuits, and a plurality of memory controllers is configured to support scaling of the system using a unified memory architecture. For example, the IC may include an interconnect fabric configured to provide communication between the one or more memory controller circuits and the processor cores, graphics processing units, and peripheral devices; and an off-chip interconnect coupled to the interconnect fabric and configured to couple the interconnect fabric to a corresponding interconnect fabric on another instance of the integrated circuit, wherein the interconnect fabric and the off-chip interconnect provide an interface that transparently connects the one or more memory controller circuits, the processor cores, graphics processing units, and peripheral devices in either a single instance of the integrated circuit or two or more instances of the integrated circuit.Type: ApplicationFiled: August 22, 2022Publication date: February 23, 2023Inventors: Per H. Hammarlund, Lior Zimet, Sergio Kolor, Sagi Lahav, James Vash, Gaurav Garg, Tal Kuzi, Jeffry E. Gonion, Charles E. Tucker, Lital Levy-Rubin, Dany Davidov, Steven Fishwick, Nir Leshem, Mark Pilip, Gerard R. Williams, III, Harshavardhan Kaushikkar, Srinivasan Rangan Sridharan
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Publication number: 20230053530Abstract: A system including a plurality of processor cores, a plurality of graphics processing units, a plurality of peripheral circuits, and a plurality of memory controllers is configured to support scaling of the system using a unified memory architecture.Type: ApplicationFiled: August 22, 2022Publication date: February 23, 2023Inventors: Per H. Hammarlund, Eran Tamari, Lior Zimet, Sergio Kolor, Sergio V. Tota, Sagi Lahav, James Vash, Gaurav Garg, Jonathan M. Redshaw, Steven R. Hutsell, Harshavardhan Kaushikkar, Shawn M. Fukami
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Publication number: 20230056044Abstract: A system including a plurality of processor cores, a plurality of graphics processing units, a plurality of peripheral circuits, and a plurality of memory controllers is configured to support scaling of the system using a unified memory architecture.Type: ApplicationFiled: August 22, 2022Publication date: February 23, 2023Inventors: Per H. Hammarlund, Lior Zimet, James Vash, Gaurav Garg, Sergio Kolor, Harshavardhan Kaushikkar, Ramesh B. Gunna, Steven R. Hutsell
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Publication number: 20220365900Abstract: In an embodiment, a system on a chip (SOC) comprises a semiconductor die on which circuitry is formed, wherein the circuitry comprises a memory controller circuit and a plurality of networks formed from a plurality of individual network component circuits. The memory controller includes a PIO message control circuit that is configured to receive PIO messages addressed to individual network component circuits and determine whether to send the PIO messages to the individual network component circuits based on determine whether previous PIO messages are pending for the individual network component circuits. The PIO message control circuit is configured to delay a first PIO message at the PIO message control circuit in response to determining that previous PIO message is pending for the addressee of the first PIO message.Type: ApplicationFiled: May 13, 2021Publication date: November 17, 2022Inventors: Sergio Kolor, Oren Bar, Ilya Granovsky
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Publication number: 20220334997Abstract: In an embodiment, a system on a chip (SOC) comprises a semiconductor die on which circuitry is formed, wherein the circuitry comprises a plurality of agents and a plurality of network switches coupled to the plurality of agents. The plurality of network switches are interconnected to form a plurality of physical and logically independent networks. A first network of the plurality of physically and logically independent networks is constructed according to a first topology and a second network of the plurality of physically and logically independent networks is constructed according to a second topology that is different from the first topology. For example, the first topology may a ring topology and the second topology may be a mesh topology. In an embodiment, coherency may be enforced on the first network and the second network may be a relaxed order network.Type: ApplicationFiled: June 3, 2021Publication date: October 20, 2022Inventors: Sergio Kolor, Sergio V. Tota, Tzach Zemer, Sagi Lahav, Jonathan M. Redshaw, Per H. Hammarlund, Eran Tamari, James Vash, Gaurav Garg
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Publication number: 20220321490Abstract: An apparatus includes an interface circuit and an encoder circuit. The interface circuit is configured to send a data packet via a plurality of segments, and to send an idle value via the plurality of segments when no data packet is available. The idle value is configured to cause a segment in a receiving apparatus to idle. The encoder circuit is configured to receive a particular data packet, and, if a portion of the particular data packet has a same value as the idle value for a subset of the plurality of segments, to replace at least a portion of the data packet with a mask value to generate a modified data packet. The mask value indicates how to recreate the particular data packet. The encoder circuit is further configured to send the modified data packet to the receiving apparatus via the plurality of segments of the interface circuit.Type: ApplicationFiled: April 6, 2021Publication date: October 6, 2022Inventors: Dany Davidov, Nir Leshem, Mark Pilip, Sergio Kolor
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Publication number: 20220284163Abstract: A system includes a first instance and a second instance of an integrated circuit. The integrated circuits include respective external interfaces with a physical pin layout having transmit and receive pins for a particular bus located in complementary positions relative to an axis of symmetry. The external interfaces of the first and second instances of the integrated circuit are positioned such that the transmit and receive pins for the given I/O signal on the first instance are aligned, respectively, with the receive and transmit pins for the given I/O signal on the second instance.Type: ApplicationFiled: March 5, 2021Publication date: September 8, 2022Inventors: Sergio Kolor, Dany Davidov, Nir Leshem, Mark Pilip
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Patent number: 10324873Abstract: A device and method for communicating, via a memory-mapped communication path, between a host processor and a cellular-communication modem are disclosed. The method includes providing logical channels over the memory-mapped communication path and transporting data organized according to one or more cellular communication protocols over at least one of the logical channels. In addition, the method includes acknowledging when data transfer occurs between the host processor and the cellular-communication modem, issuing commands between the host processor and the cellular-communication modem, and communicating and managing a power state via one or more of the logical channels.Type: GrantFiled: March 9, 2017Date of Patent: June 18, 2019Assignee: QUALCOMM IncorporatedInventors: Vinod H. Kaushik, Igor Malamant, Sergio Kolor
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Publication number: 20170185545Abstract: A device and method for communicating, via a memory-mapped communication path, between a host processor and a cellular-communication modem are disclosed. The method includes providing logical channels over the memory-mapped communication path and transporting data organized according to one or more cellular communication protocols over at least one of the logical channels. In addition, the method includes acknowledging when data transfer occurs between the host processor and the cellular-communication modem, issuing commands between the host processor and the cellular-communication modem, and communicating and managing a power state via one or more of the logical channels.Type: ApplicationFiled: March 9, 2017Publication date: June 29, 2017Inventors: Vinod H. Kaushik, Igor Malamant, Sergio Kolor
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Patent number: 9645959Abstract: Fast link training in embedded systems is disclosed. In one aspect, a host takes advantage of situations in which the host is coupled to one or more static devices through a communication bus. In particular, because the one or more devices are static, the host may be provided with information about the one or more devices before start up, so that when the host does perform a start up, the host already knows which device(s) to expect. Accordingly, the host may directly query the expected device(s), and after receipt of response(s) from the expected device(s), may begin link training the expected device(s). By using the provided information about the expected device(s) in this fashion, the host may bypass or skip an initial signal detection step used by conventional link training processes. Bypassing the initial signal detection step may save time, which in turn saves power.Type: GrantFiled: January 16, 2015Date of Patent: May 9, 2017Assignee: QULACOMM IncorporatedInventors: Nabeel Achlaug, Nir Gerber, Sergio Kolor, Dan Vardi
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Patent number: 9594718Abstract: A device and method for communicating, via a memory-mapped communication path, between a host processor and a cellular-communication modem are disclosed. The method includes providing logical channels over the memory-mapped communication path and transporting data organized according to one or more cellular communication protocols over at least one of the logical channels. In addition, the method includes acknowledging when data transfer occurs between the host processor and the cellular-communication modem, issuing commands between the host processor and the cellular-communication modem, and communicating and managing a power state via one or more of the logical channels.Type: GrantFiled: January 24, 2014Date of Patent: March 14, 2017Assignee: Qualcomm Innovation Center, Inc.Inventors: Vinod H. Kaushik, Igor Malamant, Sergio Kolor
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Publication number: 20160210254Abstract: Fast link training in embedded systems is disclosed. In one aspect, a host takes advantage of situations in which the host is coupled to one or more static devices through a communication bus. In particular, because the one or more devices are static, the host may be provided with information about the one or more devices before start up, so that when the host does perform a start up, the host already knows which device(s) to expect. Accordingly, the host may directly query the expected device(s), and after receipt of response(s) from the expected device(s), may begin link training the expected device(s). By using the provided information about the expected device(s) in this fashion, the host may bypass or skip an initial signal detection step used by conventional link training processes. Bypassing the initial signal detection step may save time, which in turn saves power.Type: ApplicationFiled: January 16, 2015Publication date: July 21, 2016Inventors: Nabeel Achlaug, Nir Gerber, Sergio Kolor, Dan Vardi