Patents by Inventor Sergio Kolor

Sergio Kolor has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11934313
    Abstract: A system including a plurality of processor cores, a plurality of graphics processing units, a plurality of peripheral circuits, and a plurality of memory controllers is configured to support scaling of the system using a unified memory architecture.
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: March 19, 2024
    Assignee: Apple Inc.
    Inventors: Per H. Hammarlund, Lior Zimet, James Vash, Gaurav Garg, Sergio Kolor, Harshavardhan Kaushikkar, Ramesh B. Gunna, Steven R. Hutsell
  • Publication number: 20230388241
    Abstract: An apparatus includes an interface circuit and an encoder circuit. The interface circuit is configured to send a data packet via a plurality of segments, and to send an idle value via the plurality of segments when no data packet is available. The idle value is configured to cause a segment in a receiving apparatus to idle. The encoder circuit is configured to receive a particular data packet, and, if a portion of the particular data packet has a same value as the idle value for a subset of the plurality of segments, to replace at least a portion of the data packet with a mask value to generate a modified data packet. The mask value indicates how to recreate the particular data packet. The encoder circuit is further configured to send the modified data packet to the receiving apparatus via the plurality of segments of the interface circuit.
    Type: Application
    Filed: May 31, 2023
    Publication date: November 30, 2023
    Inventors: Dany Davidov, Nir Leshem, Mark Pilip, Sergio Kolor
  • Publication number: 20230350828
    Abstract: In an embodiment, a system on a chip (SOC) comprises a semiconductor die on which circuitry is formed, wherein the circuitry comprises a plurality of agents and a plurality of network switches coupled to the plurality of agents. The plurality of network switches are interconnected to form a plurality of physical and logically independent networks. A first network of the plurality of physically and logically independent networks is constructed according to a first topology and a second network of the plurality of physically and logically independent networks is constructed according to a second topology that is different from the first topology. For example, the first topology may a ring topology and the second topology may be a mesh topology. In an embodiment, coherency may be enforced on the first network and the second network may be a relaxed order network.
    Type: Application
    Filed: April 28, 2023
    Publication date: November 2, 2023
    Inventors: Sergio Kolor, Sergio V. Tota, Tzach Zemer, Sagi Lahav, Jonathan M. Redshaw, Per H. Hammarlund, Eran Tamari, James Vash, Gaurav Garg, Lior Zimet, Harshavardhan Kaushikkar, Steven Fishwick, Steven R. Hutsell, Shawn M. Fukami
  • Patent number: 11803471
    Abstract: An integrated circuit (IC) including a plurality of processor cores, a plurality of graphics processing units, a plurality of peripheral circuits, and a plurality of memory controllers is configured to support scaling of the system using a unified memory architecture. For example, the IC may include an interconnect fabric configured to provide communication between the one or more memory controller circuits and the processor cores, graphics processing units, and peripheral devices; and an off-chip interconnect coupled to the interconnect fabric and configured to couple the interconnect fabric to a corresponding interconnect fabric on another instance of the integrated circuit, wherein the interconnect fabric and the off-chip interconnect provide an interface that transparently connects the one or more memory controller circuits, the processor cores, graphics processing units, and peripheral devices in either a single instance of the integrated circuit or two or more instances of the integrated circuit.
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: October 31, 2023
    Assignee: Apple Inc.
    Inventors: Per H. Hammarlund, Lior Zimet, Sergio Kolor, Sagi Lahav, James Vash, Gaurav Garg, Tal Kuzi, Jeffry E. Gonion, Charles E. Tucker, Lital Levy-Rubin, Dany Davidov, Steven Fishwick, Nir Leshem, Mark Pilip, Gerard R. Williams, III, Harshavardhan Kaushikkar, Srinivasa Rangan Sridharan
  • Publication number: 20230239252
    Abstract: In an embodiment, a system includes a plurality of integrated circuits have subsets of a plurality of agents. The plurality of integrated circuits may have network segments implemented wholly (e.g., entirely) within the respective integrated circuits and may have segment to segment (S2S) network interface circuits to couple to other network segments of a plurality of network segment forming a network among the plurality of agents.
    Type: Application
    Filed: July 19, 2022
    Publication date: July 27, 2023
    Inventors: Sergio Kolor, Lior Zimet, Opher D. KAHN, Eran Tamari, Tzach Zemer, Per H. Hammarlund
  • Patent number: 11706150
    Abstract: An apparatus includes an interface circuit and an encoder circuit. The interface circuit is configured to send a data packet via a plurality of segments, and to send an idle value via the plurality of segments when no data packet is available. The idle value is configured to cause a segment in a receiving apparatus to idle. The encoder circuit is configured to receive a particular data packet, and, if a portion of the particular data packet has a same value as the idle value for a subset of the plurality of segments, to replace at least a portion of the data packet with a mask value to generate a modified data packet. The mask value indicates how to recreate the particular data packet. The encoder circuit is further configured to send the modified data packet to the receiving apparatus via the plurality of segments of the interface circuit.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: July 18, 2023
    Assignee: Apple Inc.
    Inventors: Dany Davidov, Nir Leshem, Mark Pilip, Sergio Kolor
  • Patent number: 11675722
    Abstract: In an embodiment, a system on a chip (SOC) comprises a semiconductor die on which circuitry is formed, wherein the circuitry comprises a plurality of agents and a plurality of network switches coupled to the plurality of agents. The plurality of network switches are interconnected to form a plurality of physical and logically independent networks. A first network of the plurality of physically and logically independent networks is constructed according to a first topology and a second network of the plurality of physically and logically independent networks is constructed according to a second topology that is different from the first topology. For example, the first topology may a ring topology and the second topology may be a mesh topology. In an embodiment, coherency may be enforced on the first network and the second network may be a relaxed order network.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: June 13, 2023
    Assignee: Apple Inc.
    Inventors: Sergio Kolor, Sergio V. Tota, Tzach Zemer, Sagi Lahav, Jonathan M. Redshaw, Per H. Hammarlund, Eran Tamari, James Vash, Gaurav Garg, Lior Zimet, Harshavardhan Kaushikkar, Steven Fishwick, Steven R. Hutsell, Shawn M. Fukami
  • Patent number: 11609878
    Abstract: In an embodiment, a system on a chip (SOC) comprises a semiconductor die on which circuitry is formed, wherein the circuitry comprises a memory controller circuit and a plurality of networks formed from a plurality of individual network component circuits. The memory controller includes a PIO message control circuit that is configured to receive PIO messages addressed to individual network component circuits and determine whether to send the PIO messages to the individual network component circuits based on determine whether previous PIO messages are pending for the individual network component circuits. The PIO message control circuit is configured to delay a first PIO message at the PIO message control circuit in response to determining that previous PIO message is pending for the addressee of the first PIO message.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: March 21, 2023
    Assignee: Apple Inc.
    Inventors: Sergio Kolor, Oren Bar, Ilya Granovsky
  • Publication number: 20230058989
    Abstract: An integrated circuit (IC) including a plurality of processor cores, a plurality of graphics processing units, a plurality of peripheral circuits, and a plurality of memory controllers is configured to support scaling of the system using a unified memory architecture. For example, the IC may include an interconnect fabric configured to provide communication between the one or more memory controller circuits and the processor cores, graphics processing units, and peripheral devices; and an off-chip interconnect coupled to the interconnect fabric and configured to couple the interconnect fabric to a corresponding interconnect fabric on another instance of the integrated circuit, wherein the interconnect fabric and the off-chip interconnect provide an interface that transparently connects the one or more memory controller circuits, the processor cores, graphics processing units, and peripheral devices in either a single instance of the integrated circuit or two or more instances of the integrated circuit.
    Type: Application
    Filed: August 22, 2022
    Publication date: February 23, 2023
    Inventors: Per H. Hammarlund, Lior Zimet, Sergio Kolor, Sagi Lahav, James Vash, Gaurav Garg, Tal Kuzi, Jeffry E. Gonion, Charles E. Tucker, Lital Levy-Rubin, Dany Davidov, Steven Fishwick, Nir Leshem, Mark Pilip, Gerard R. Williams, III, Harshavardhan Kaushikkar, Srinivasan Rangan Sridharan
  • Publication number: 20230053530
    Abstract: A system including a plurality of processor cores, a plurality of graphics processing units, a plurality of peripheral circuits, and a plurality of memory controllers is configured to support scaling of the system using a unified memory architecture.
    Type: Application
    Filed: August 22, 2022
    Publication date: February 23, 2023
    Inventors: Per H. Hammarlund, Eran Tamari, Lior Zimet, Sergio Kolor, Sergio V. Tota, Sagi Lahav, James Vash, Gaurav Garg, Jonathan M. Redshaw, Steven R. Hutsell, Harshavardhan Kaushikkar, Shawn M. Fukami
  • Publication number: 20230056044
    Abstract: A system including a plurality of processor cores, a plurality of graphics processing units, a plurality of peripheral circuits, and a plurality of memory controllers is configured to support scaling of the system using a unified memory architecture.
    Type: Application
    Filed: August 22, 2022
    Publication date: February 23, 2023
    Inventors: Per H. Hammarlund, Lior Zimet, James Vash, Gaurav Garg, Sergio Kolor, Harshavardhan Kaushikkar, Ramesh B. Gunna, Steven R. Hutsell
  • Publication number: 20220365900
    Abstract: In an embodiment, a system on a chip (SOC) comprises a semiconductor die on which circuitry is formed, wherein the circuitry comprises a memory controller circuit and a plurality of networks formed from a plurality of individual network component circuits. The memory controller includes a PIO message control circuit that is configured to receive PIO messages addressed to individual network component circuits and determine whether to send the PIO messages to the individual network component circuits based on determine whether previous PIO messages are pending for the individual network component circuits. The PIO message control circuit is configured to delay a first PIO message at the PIO message control circuit in response to determining that previous PIO message is pending for the addressee of the first PIO message.
    Type: Application
    Filed: May 13, 2021
    Publication date: November 17, 2022
    Inventors: Sergio Kolor, Oren Bar, Ilya Granovsky
  • Publication number: 20220334997
    Abstract: In an embodiment, a system on a chip (SOC) comprises a semiconductor die on which circuitry is formed, wherein the circuitry comprises a plurality of agents and a plurality of network switches coupled to the plurality of agents. The plurality of network switches are interconnected to form a plurality of physical and logically independent networks. A first network of the plurality of physically and logically independent networks is constructed according to a first topology and a second network of the plurality of physically and logically independent networks is constructed according to a second topology that is different from the first topology. For example, the first topology may a ring topology and the second topology may be a mesh topology. In an embodiment, coherency may be enforced on the first network and the second network may be a relaxed order network.
    Type: Application
    Filed: June 3, 2021
    Publication date: October 20, 2022
    Inventors: Sergio Kolor, Sergio V. Tota, Tzach Zemer, Sagi Lahav, Jonathan M. Redshaw, Per H. Hammarlund, Eran Tamari, James Vash, Gaurav Garg
  • Publication number: 20220321490
    Abstract: An apparatus includes an interface circuit and an encoder circuit. The interface circuit is configured to send a data packet via a plurality of segments, and to send an idle value via the plurality of segments when no data packet is available. The idle value is configured to cause a segment in a receiving apparatus to idle. The encoder circuit is configured to receive a particular data packet, and, if a portion of the particular data packet has a same value as the idle value for a subset of the plurality of segments, to replace at least a portion of the data packet with a mask value to generate a modified data packet. The mask value indicates how to recreate the particular data packet. The encoder circuit is further configured to send the modified data packet to the receiving apparatus via the plurality of segments of the interface circuit.
    Type: Application
    Filed: April 6, 2021
    Publication date: October 6, 2022
    Inventors: Dany Davidov, Nir Leshem, Mark Pilip, Sergio Kolor
  • Publication number: 20220284163
    Abstract: A system includes a first instance and a second instance of an integrated circuit. The integrated circuits include respective external interfaces with a physical pin layout having transmit and receive pins for a particular bus located in complementary positions relative to an axis of symmetry. The external interfaces of the first and second instances of the integrated circuit are positioned such that the transmit and receive pins for the given I/O signal on the first instance are aligned, respectively, with the receive and transmit pins for the given I/O signal on the second instance.
    Type: Application
    Filed: March 5, 2021
    Publication date: September 8, 2022
    Inventors: Sergio Kolor, Dany Davidov, Nir Leshem, Mark Pilip
  • Patent number: 10324873
    Abstract: A device and method for communicating, via a memory-mapped communication path, between a host processor and a cellular-communication modem are disclosed. The method includes providing logical channels over the memory-mapped communication path and transporting data organized according to one or more cellular communication protocols over at least one of the logical channels. In addition, the method includes acknowledging when data transfer occurs between the host processor and the cellular-communication modem, issuing commands between the host processor and the cellular-communication modem, and communicating and managing a power state via one or more of the logical channels.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: June 18, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Vinod H. Kaushik, Igor Malamant, Sergio Kolor
  • Publication number: 20170185545
    Abstract: A device and method for communicating, via a memory-mapped communication path, between a host processor and a cellular-communication modem are disclosed. The method includes providing logical channels over the memory-mapped communication path and transporting data organized according to one or more cellular communication protocols over at least one of the logical channels. In addition, the method includes acknowledging when data transfer occurs between the host processor and the cellular-communication modem, issuing commands between the host processor and the cellular-communication modem, and communicating and managing a power state via one or more of the logical channels.
    Type: Application
    Filed: March 9, 2017
    Publication date: June 29, 2017
    Inventors: Vinod H. Kaushik, Igor Malamant, Sergio Kolor
  • Patent number: 9645959
    Abstract: Fast link training in embedded systems is disclosed. In one aspect, a host takes advantage of situations in which the host is coupled to one or more static devices through a communication bus. In particular, because the one or more devices are static, the host may be provided with information about the one or more devices before start up, so that when the host does perform a start up, the host already knows which device(s) to expect. Accordingly, the host may directly query the expected device(s), and after receipt of response(s) from the expected device(s), may begin link training the expected device(s). By using the provided information about the expected device(s) in this fashion, the host may bypass or skip an initial signal detection step used by conventional link training processes. Bypassing the initial signal detection step may save time, which in turn saves power.
    Type: Grant
    Filed: January 16, 2015
    Date of Patent: May 9, 2017
    Assignee: QULACOMM Incorporated
    Inventors: Nabeel Achlaug, Nir Gerber, Sergio Kolor, Dan Vardi
  • Patent number: 9594718
    Abstract: A device and method for communicating, via a memory-mapped communication path, between a host processor and a cellular-communication modem are disclosed. The method includes providing logical channels over the memory-mapped communication path and transporting data organized according to one or more cellular communication protocols over at least one of the logical channels. In addition, the method includes acknowledging when data transfer occurs between the host processor and the cellular-communication modem, issuing commands between the host processor and the cellular-communication modem, and communicating and managing a power state via one or more of the logical channels.
    Type: Grant
    Filed: January 24, 2014
    Date of Patent: March 14, 2017
    Assignee: Qualcomm Innovation Center, Inc.
    Inventors: Vinod H. Kaushik, Igor Malamant, Sergio Kolor
  • Publication number: 20160210254
    Abstract: Fast link training in embedded systems is disclosed. In one aspect, a host takes advantage of situations in which the host is coupled to one or more static devices through a communication bus. In particular, because the one or more devices are static, the host may be provided with information about the one or more devices before start up, so that when the host does perform a start up, the host already knows which device(s) to expect. Accordingly, the host may directly query the expected device(s), and after receipt of response(s) from the expected device(s), may begin link training the expected device(s). By using the provided information about the expected device(s) in this fashion, the host may bypass or skip an initial signal detection step used by conventional link training processes. Bypassing the initial signal detection step may save time, which in turn saves power.
    Type: Application
    Filed: January 16, 2015
    Publication date: July 21, 2016
    Inventors: Nabeel Achlaug, Nir Gerber, Sergio Kolor, Dan Vardi