Patents by Inventor Seri Lee
Seri Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10390991Abstract: A temperature control system may include a thermoelectric device, a controller electrically coupled to the thermoelectric device, a heat transfer structure thermally coupled to the thermoelectric device, a temperature controlled medium thermally coupled to the thermoelectric device and a temperature feedback sensor. The controller may be configured to sense a first value of an electrical characteristic of the thermoelectric device and to generate a first electrical control to activate the thermoelectric device in response to sensing the first value of the electrical characteristic of the thermoelectric device. The controller may be further configured to sense a second value of the electrical characteristic of the thermoelectric device and to generate a second electrical control signal to activate the thermoelectric device in response to sensing the second value of the electrical characteristic of the thermoelectric device.Type: GrantFiled: August 14, 2012Date of Patent: August 27, 2019Assignee: SCION NEUROSTIM, LLCInventors: Lesco L. Rogers, Jesko von Windheim, Seri Lee
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Patent number: 9930842Abstract: According to embodiments of the present invention, a bioreactor for growing photoautotrophic organisms is provided. The bioreactor includes a vessel configured to receive the photoautotrophic organisms, the vessel having a longitudinal axis, which a circumferential wall extends around said axis, wherein said circumferential wall is translucent so as to enable light to enter the vessel from the outside for acting on the photoautotrophic organisms, wherein a device for providing an uneven distribution of the light intensity within said vessel along said axis is provided.Type: GrantFiled: December 12, 2012Date of Patent: April 3, 2018Assignee: NANYANG TECHNOLOGICAL UNIVERSITYInventors: Wai Man Lau, Seri Lee
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Publication number: 20150000886Abstract: There is provided an apparatus for heat dissipation and a method for fabricating the apparatus for heat dissipation. The apparatus for heat dissipation is for either single or two phase heat exchange, depending on a construction of the apparatus. A channel of the apparatus is defined by the joined bent first ends of each of a plurality of fins of the apparatus.Type: ApplicationFiled: December 7, 2012Publication date: January 1, 2015Inventor: Seri Lee
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Publication number: 20140331552Abstract: According to embodiments of the present invention, a bioreactor for growing photoautotrophic organisms is provided. The bioreactor includes a vessel configured to receive the photoautotrophic organisms, the vessel having a longitudinal axis, which a circumferential wall extends around said axis, wherein said circumferential wall is translucent so as to enable light to enter the vessel from the outside for acting on the photoautotrophic organisms, wherein a device for providing an uneven distribution of the light intensity within said vessel along said axis is provided.Type: ApplicationFiled: December 12, 2012Publication date: November 13, 2014Inventors: Wai Man Lau, Seri Lee
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Patent number: 8833435Abstract: A method and system for providing a heat sink assembly are described. The assembly includes a two-phase heat sink, a condenser, and a pump. The two-phase heat sink may include flow micro-channels that accommodate the flow of boiling coolant and cross-connect channel(s) that at least partially equilibrate a pressure field for the boiling coolant. The condenser receives coolant from the heat sink and removes heat. The pump drives coolant through the assembly. In one aspect, the assembly is a closed system for the coolant. In another aspect, the condenser includes first and second plates and a heat exchange surface there between. Coolant flows from the heat sink and through the plates. The gaseous coolant passes the heat exchange surface. In one aspect the gaseous coolant flows opposite to the direction coolant flows. In one aspect, at least one of the plates includes dummy channel(s) for insulating part of the plate(s).Type: GrantFiled: July 29, 2009Date of Patent: September 16, 2014Assignee: Pipeline Micro, Inc.Inventors: Matthew Determan, Scott W. C. H. Lee, Abel Manuel Siu Ho, Seri Lee
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Publication number: 20120310313Abstract: A temperature control system may include a thermoelectric device, a controller electrically coupled to the thermoelectric device, a heat transfer structure thermally coupled to the thermoelectric device, a temperature controlled medium thermally coupled to the thermoelectric device and a temperature feedback sensor. The controller may be configured to sense a first value of an electrical characteristic of the thermoelectric device and to generate a first electrical control to activate the thermoelectric device in response to sensing the first value of the electrical characteristic of the thermoelectric device. The controller may be further configured to sense a second value of the electrical characteristic of the thermoelectric device and to generate a second electrical control signal to activate the thermoelectric device in response to sensing the second value of the electrical characteristic of the thermoelectric device.Type: ApplicationFiled: August 14, 2012Publication date: December 6, 2012Inventors: Lesco L. Rogers, Jesko von Windheim, Seri Lee
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Patent number: 8267983Abstract: A temperature control system may include a thermoelectric device, a controller electrically coupled to the thermoelectric device, a heat transfer structure thermally coupled to the thermoelectric device, and a temperature controlled medium thermally coupled to the thermoelectric device. The controller may be configured to sense a first value of an electrical characteristic of the thermoelectric device and to generate a first electrical control signal to pump heat through the thermoelectric device in response to sensing the first value of the electrical characteristic of the thermoelectric device. The controller may be further configured to sense a second value of the electrical characteristic of the thermoelectric device and to generate a second electrical control signal to pump heat through the thermoelectric device in response to sensing the second value of the electrical characteristic of the thermoelectric device.Type: GrantFiled: January 25, 2010Date of Patent: September 18, 2012Assignee: Scion Neurostim, LLC.Inventors: Lesco L. Rogers, Jesko von Windheim, Seri Lee
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Publication number: 20120087088Abstract: This disclosure concerns micro-scale heat transfer systems. Some systems relate to electronics cooling. As one example a microscale heat transfer system can comprise a microchannel heat exchanger defining a plurality of flow microchannels fluidicly coupled to each other by a plurality of cross-connect channels. The cross-connect channels can be spaced apart along a streamwise flow direction defined by the flow microchannels. Such a configuration of flow microchannels and cross-connect channels can enable the microchannel heat exchanger to stably vaporize a portion of a working fluid when the microchannel heat exchanger is thermally coupled to a heat source. Microscale heat transfer systems can also comprise a condenser fluidicly coupled to the microchannel heat exchanger and configured to condense the vaporized portion of the working fluid. A pump can circulate the working fluid between the microchannel heat exchanger and the condenser.Type: ApplicationFiled: March 1, 2010Publication date: April 12, 2012Applicant: PIPELINE MICRO, INC.Inventors: Jesse David Killion, Seri Lee, Matthew Determan, Scott W.C.H. Lee, Abel Manual Siu Ho
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Publication number: 20100149719Abstract: In some embodiments a thermal device such as a heat sink cools an electronic device. An electrokinetic airflow generating device uses a positively charged source and also uses at least a portion of the thermal device as a negatively charged or grounded probe to provide electrokinetically driven airflow. Other embodiments are described and claimed.Type: ApplicationFiled: December 31, 2009Publication date: June 17, 2010Inventors: Johan F. Ploeg, Seri Lee
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Publication number: 20100032150Abstract: A method and system for providing a heat sink assembly are described. The assembly includes a two-phase heat sink, a condenser, and a pump. The two-phase heat sink may include flow micro-channels that accommodate the flow of boiling coolant and cross-connect channel(s) that at least partially equilibrate a pressure field for the boiling coolant. The condenser receives coolant from the heat sink and removes heat. The pump drives coolant through the assembly. In one aspect, the assembly is a closed system for the coolant. In another aspect, the condenser includes first and second plates and a heat exchange surface there between. Coolant flows from the heat sink and through the plates. The gaseous coolant passes the heat exchange surface. In one aspect the gaseous coolant flows opposite to the direction coolant flows. In one aspect, at least one of the plates includes dummy channel(s) for insulating part of the plate(s).Type: ApplicationFiled: July 29, 2009Publication date: February 11, 2010Applicant: PIPELINE MICRO, INC.Inventors: Matthew Determan, Scott W.C.H. Lee, Abel Manuel Siu Ho, Seri Lee
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Publication number: 20090205696Abstract: An electronic device may include a heat generating component and a surface adjacent the heat generating component. A temperature of the heat generating component may be greater than a temperature of the surface adjacent the heat generating component during operation of the electronic device. A thermoelectric heat pump between the surface and the heat generating component may be configured to pump heat from a cold side of the thermoelectric heat pump adjacent the surface toward the heat generating component. Related methods are also discussed.Type: ApplicationFiled: February 13, 2009Publication date: August 20, 2009Inventors: David Koester, Seri Lee, Ramaswamy Mahadevan
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Publication number: 20090168344Abstract: In some embodiments a thermal device such as a heat sink cools an electronic device. An electrokinetic airflow generating device uses a positively charged source and also uses at least a portion of the thermal device as a negatively charged or grounded probe to provide electrokinetically driven airflow. Other embodiments are described and claimed.Type: ApplicationFiled: December 31, 2007Publication date: July 2, 2009Inventors: Johan F. Ploeg, Seri Lee
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Patent number: 7535708Abstract: A fan integrated thermal management device, such as a heat sink, may include an integrated fan to facilitate air flow through the device. One embodiment of the thermal management device may include a heat-conductive base and a plurality of heat-conductive extensions extending from the base and defining one or more fan blade regions. One or more fans may be mounted relative to the heat-conductive extensions such that at least one fan blade is located in the fan blade region and is configured to rotate through the fan blade region. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.Type: GrantFiled: September 19, 2006Date of Patent: May 19, 2009Assignee: Intel CorporationInventor: Seri Lee
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Patent number: 7499274Abstract: In some embodiments, a method, apparatus and system are described for enhancing an enclosure of a device, such as a computing device. The system may include a frame and an apparatus, wherein the apparatus includes the enclosure, which may form a cover of a computing device, and a base. In some embodiments, the enclosure may be composed of materials with different thermal properties when compared to the base. In some embodiments, the enclosure may include vents or openings of various configurations. In some embodiments, the base may be a heat spreader or a heat sink. Other embodiments may be described.Type: GrantFiled: June 8, 2006Date of Patent: March 3, 2009Assignee: Intel CorporationInventors: Scott Noble, Seri Lee
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Patent number: 7495922Abstract: Methods and apparatus to provide a spring loaded heat dissipative device retention mechanism are described. In one embodiment, one or more pins with spring portions are used to maintain a spring force between a heat dissipative device and a printed circuit board. Other embodiments are also described.Type: GrantFiled: March 29, 2007Date of Patent: February 24, 2009Assignee: Intel CorporationInventors: Johan F. Ploeg, Seri Lee
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Publication number: 20090004034Abstract: A piezoelectric fan comprising two or more prongs and a bulk flow portion.Type: ApplicationFiled: June 29, 2007Publication date: January 1, 2009Inventor: Seri Lee
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Publication number: 20080264464Abstract: A temperature control system may include a thermoelectric device, and a controller electrically coupled to the thermoelectric device. The controller may be configured to apply an AC signal to the thermoelectric device, and to sense an electrical characteristic of the thermoelectric device using the AC signal. The controller may also be configured to generate an electrical control signal to pump heat through the thermoelectric device responsive to sensing the electrical characteristic of the thermoelectric device using the AC signal. Related methods are also discussed.Type: ApplicationFiled: July 2, 2008Publication date: October 30, 2008Inventors: SERI LEE, JESKO VON WINDHEIM, RAMASWAMY MAHADEVAN
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Publication number: 20080239678Abstract: Methods and apparatus to provide a spring loaded heat dissipative device retention mechanism are described. In one embodiment, one or more pins with spring portions are used to maintain a spring force between a heat dissipative device and a printed circuit board. Other embodiments are also described.Type: ApplicationFiled: March 29, 2007Publication date: October 2, 2008Inventors: Johan F. Ploeg, Seri Lee
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Publication number: 20080218972Abstract: A cooling device includes a heat sink (110) having a plurality of fins (111) and a piezoelectric assembly (120) having an actuator (121) and a plurality of blades (122) coupled to the actuator. The actuator includes a plurality of metal electrodes (227) and a plurality of piezoelectric layers (228). The fins of the heat sink are intertwined with the blades of the piezoelectric assembly.Type: ApplicationFiled: March 6, 2007Publication date: September 11, 2008Inventors: Ioan Sauciuc, Seri Lee, Alin Ila, Steven Girouard, Javier Leija, Behre Mulugeta
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Publication number: 20080168775Abstract: A temperature control system may include a thermoelectric device and a controller electrically coupled to the thermoelectric device. The controller may be configured to sense a first value of an electrical characteristic of the thermoelectric device, and to generate a first electrical control signal to pump heat through the thermoelectric device in response to sensing the first value of the electrical characteristic of the thermoelectric device. The controller may be further configured to sense a second value of the electrical characteristic of the thermoelectric device wherein the first and second values of the electrical characteristic are different, and to generate a second electrical control signal to pump heat through the thermoelectric device in response to sensing the second electrical characteristic of the thermoelectric device with the first and second electrical control signals being different. Related methods are also discussed.Type: ApplicationFiled: January 10, 2008Publication date: July 17, 2008Inventors: Jesko von Windheim, Seri Lee