Patents by Inventor Seri Lee
Seri Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20080068790Abstract: A fan integrated thermal management device, such as a heat sink, may include an integrated fan to facilitate air flow through the device. One embodiment of the thermal management device may include a heat-conductive base and a plurality of heat-conductive extensions extending from the base and defining one or more fan blade regions. One or more fans may be mounted relative to the heat-conductive extensions such that at least one fan blade is located in the fan blade region and is configured to rotate through the fan blade region. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.Type: ApplicationFiled: September 19, 2006Publication date: March 20, 2008Applicant: INTEL CORPORATIONInventor: Seri Lee
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Patent number: 7321184Abstract: In some embodiments, a piezoelectric actuator is coupled to a blade having a rake shape. The blade may include a base with two or more prongs extending therefrom. At least a portion of one or more prongs may be positioned between the fins of a heat sink. Other embodiments are disclosed and claimed.Type: GrantFiled: August 9, 2005Date of Patent: January 22, 2008Assignee: Intel CorporationInventors: Seri Lee, Ioan Sauciuc
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Publication number: 20070285891Abstract: In some embodiments, a method, apparatus and system are described for enhancing an enclosure of a device, such as a computing device. The system may include a frame and an apparatus, wherein the apparatus includes the enclosure, which may form a cover of a computing device, and a base. In some embodiments, the enclosure may be composed of materials with different thermal properties when compared to the base. In some embodiments, the enclosure may include vents or openings of various configurations. In some embodiments, the base may be a heat spreader or a heat sink. Other embodiments may be described.Type: ApplicationFiled: June 8, 2006Publication date: December 13, 2007Inventors: Scott Noble, Seri Lee
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Publication number: 20070037506Abstract: In some embodiments, a piezoelectric actuator is coupled to a blade having a rake shape. The blade may include a base with two or more prongs extending therefrom. At least a portion of one or more prongs may be positioned between the fins of a heat sink. Other embodiments are disclosed and claimed.Type: ApplicationFiled: August 9, 2005Publication date: February 15, 2007Inventors: Seri Lee, Ioan Sauciuc
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Patent number: 7019977Abstract: Securing a heat sink to an electronic device, such as an integrated circuit package, includes applying an adhesive layer to only a periphery of a surface on a thermal interface material. The thermal interface material is applied to the heat sink and/or integrated circuit package using the adhesive layer. The heat sink is in thermal contact with the integrated circuit package to extract heat during operation.Type: GrantFiled: December 17, 2003Date of Patent: March 28, 2006Assignee: Intel CorporationInventors: Seri Lee, Seung M. You, Jae W. Chang
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Publication number: 20050135066Abstract: Securing a heat sink to an electronic device, such as an integrated circuit package, includes applying an adhesive layer to only a periphery of a surface on a thermal interface material. The thermal interface material is applied to the heat sink and/or integrated circuit package using the adhesive layer. The heat sink is in thermal contact with the integrated circuit package to extract heat during operation.Type: ApplicationFiled: December 17, 2003Publication date: June 23, 2005Inventors: Seri Lee, Seung You, Jae Chang
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Patent number: 6870736Abstract: An electronic assembly that includes a heat sink, a thermal interface material, integrated circuit, and a package connected to the integrated circuit. The thermal interface material is positioned between a first surface on the package and a second surface on the heat sink to improve thermal conductivity between the package and heat sink. At least one of the first and second surfaces includes either a cavity that traps excess thermal interface material when the heat sink is compressed against the package.Type: GrantFiled: May 28, 2004Date of Patent: March 22, 2005Assignee: Intel CorporationInventors: Seri Lee, Phillip H. Chen
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Patent number: 6845010Abstract: An enhanced heat dissipation device to extract heat from an integrated circuit device includes a thermally conductive core having upper and lower outer surface areas. The device further includes a first array of radially extending pin fin structures. The first array is thermally coupled to the upper surface area such that a cooling medium introduced around the core and the first array creates an omni-directional flow around the first array and the core to enhance heat dissipation from the integrated circuit device. The core including the first array and the lower surface area are of sufficient size to allow components on a motherboard to encroach onto the integrated circuit device when the heat dissipation device is mounted onto the integrated circuit device.Type: GrantFiled: March 14, 2003Date of Patent: January 18, 2005Assignee: Intel CorporationInventor: Seri Lee
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Publication number: 20040218354Abstract: An electronic assembly that includes a heat sink, a thermal interface material, integrated circuit, and a package connected to the integrated circuit. The thermal interface material is positioned between a first surface on the package and a second surface on the heat sink to improve thermal conductivity between the package and heat sink. At least one of the first and second surfaces includes either a cavity that traps excess thermal interface material when the heat sink is compressed against the package.Type: ApplicationFiled: May 28, 2004Publication date: November 4, 2004Applicant: Intel CorporationInventors: Seri Lee, Phillip H. Chen
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Publication number: 20040190245Abstract: A radial-fin heat sink includes a heat sink substrate and a radial fin that extends from the heat sink substrate. The radial fin is formed from the heat sink substrate by a skiving process.Type: ApplicationFiled: March 31, 2003Publication date: September 30, 2004Inventors: Murli Tirumala, Seri Lee
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Patent number: 6757170Abstract: An electronic assembly that includes a heat sink, a thermal interface material, integrated circuit, and a package connected to the integrated circuit. The thermal interface material is positioned between a first surface on the package and a second surface on the heat sink to improve thermal conductivity between the package and heat sink. At least one of the first and second surfaces includes either a cavity that traps excess thermal interface material when the heat sink is compressed against the package, or a protrusion that maintains bond line thickness between the heat sink and package.Type: GrantFiled: July 26, 2002Date of Patent: June 29, 2004Assignee: Intel CorporationInventors: Seri Lee, Phillip H. Chen
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Publication number: 20040017656Abstract: An electronic assembly that includes a heat sink, a thermal interface material, integrated circuit, and a package connected to the integrated circuit. The thermal interface material is positioned between a first surface on the package and a second surface on the heat sink to improve thermal conductivity between the package and heat sink. At least one of the first and second surfaces includes either a cavity that traps excess thermal interface material when the heat sink is compressed against the package, or a protrusion that maintains bond line thickness between the heat sink and package.Type: ApplicationFiled: July 26, 2002Publication date: January 29, 2004Applicant: Intel CorporationInventors: Seri Lee, Phillip H. Chen
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Patent number: 6633484Abstract: An enhanced heat dissipation system and a method to extract heat from an integrated circuit device include a thermally conductive core having upper and lower outer surface areas. The system further includes a first conductive ring having a first array of radially extending fins. The first conductive ring is thermally coupled to the upper outer surface area. The first array and the lower outer surface area of the thermally conductive core are of sufficient size to allow components on a motherboard to encroach around and onto the integrated circuit device when the heat dissipation device is mounted onto the integrated circuit device.Type: GrantFiled: November 20, 2000Date of Patent: October 14, 2003Assignee: Intel CorporationInventors: Seri Lee, Lloyd L. Pollard, II
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Publication number: 20030189813Abstract: An enhanced heat dissipation device to extract heat from an integrated circuit device includes a thermally conductive core having upper and lower outer surface areas. The device further includes a first array of radially extending pin fin structures. The first array is thermally coupled to the upper surface area such that a cooling medium introduced around the core and the first array creates an omni-directional flow around the first array and the core to enhance heat dissipation from the integrated circuit device. The core including the first array and the lower surface area are of sufficient size to allow components on a motherboard to encroach onto the integrated circuit device when the heat dissipation device is mounted onto the integrated circuit device.Type: ApplicationFiled: March 14, 2003Publication date: October 9, 2003Applicant: Intel CorporationInventor: Seri Lee
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Patent number: 6535385Abstract: An enhanced heat dissipation device to extract heat from an integrated circuit device includes a thermally conductive core having upper and lower outer surface areas. The device further includes a first array of radially extending pin fin structures. The first array is thermally coupled to the upper surface area such that a cooling medium introduced around the core and the first array creates an omni-directional flow around the first array and the core to enhance heat dissipation from the integrated circuit device. The core including the first array and the lower surface area are of sufficient size to allow components on a motherboard to encroach onto the integrated circuit device when the heat dissipation device is mounted onto the integrated circuit device.Type: GrantFiled: January 22, 2001Date of Patent: March 18, 2003Assignee: Intel CorporationInventor: Seri Lee
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Patent number: 6501655Abstract: A heat dissipation system and method for extracting heat from an integrated circuit device includes, in one example embodiment, a thermally conductive base plate. The heat dissipation system and method further includes an array of substantially parallel fin structures having top and bottom portions. The thermally conductive base plate is attached to the array such that the thermally conductive base plate is in close proximity to the bottom portion. The top and bottom portions extend outwardly from the thermally conductive base plate. The top portion of the array further extends laterally beyond the bottom portion of the array. The top and bottom portions of the array are of sufficient size so as to allow components on a motherboard to encroach around the integrated circuit device.Type: GrantFiled: November 20, 2000Date of Patent: December 31, 2002Assignee: Intel CorporationInventors: Seri Lee, Lloyd L. Pollard, II
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Publication number: 20020171139Abstract: A heat dissipation system and method for extracting heat from an integrated circuit device includes a thermally conductive post having substantially planar upper and lower surfaces, wherein the upper surface is disposed across from the lower surface, and wherein the lower surface is adapted to contact an integrated circuit device. A conductive heat exchange portion including an array of fins extends upwardly from the upper surface of the post where possible to allow components mounted on a printed circuit board to be positioned around the integrated circuit device. The heat exchange portion including the array has a chamber within to receive and house an air movement device so that the air introduced around the fins by the air movement device enhances the heat dissipation from the heat dissipation device.Type: ApplicationFiled: May 18, 2001Publication date: November 21, 2002Applicant: Intel CorporationInventors: Seri Lee, Lloyd L. Pollard, Craig M. Randleman
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Patent number: 6479895Abstract: A heat dissipation system and method for extracting heat from an integrated circuit device includes a thermally conductive post having substantially planar upper and lower surfaces, wherein the upper surface is disposed across from the lower surface, and wherein the lower surface is adapted to contact an integrated circuit device. A conductive heat exchange portion including an array of fins extends upwardly from the upper surface of the post where possible to allow components mounted on a printed circuit board to be positioned around the integrated circuit device. The heat exchange portion including the array has a chamber within to receive and house an air movement device so that the air introduced around the fins by the air movement device enhances the heat dissipation from the heat dissipation device.Type: GrantFiled: May 18, 2001Date of Patent: November 12, 2002Assignee: Intel CorporationInventors: Seri Lee, Lloyd L. Pollard, II, Craig M. Randleman
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Publication number: 20020079097Abstract: A wire is swaged into a grooved base to provide surface area to a heat sink. The heat sink has a thermally conductive base having a surface with at least one groove formed therein. At least one thermally conductive wire has a first portion secured into the at least one groove and a second portion extending from the surface.Type: ApplicationFiled: December 21, 2000Publication date: June 27, 2002Inventors: Seri Lee, Lloyd L. Pollard
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Publication number: 20020060902Abstract: An enhanced heat dissipation device to extract heat from an integrated circuit device includes a thermally conductive core having upper and lower outer surface areas. The device further includes a first array of radially extending pin fin structures. The first array is thermally coupled to the upper surface area such that a cooling medium introduced around the core and the first array creates an onmi-directional flow around the first array and the core to enhance heat dissipation from the integrated circuit device. The core including the first array and the lower surface area are of sufficient size to allow components on a motherboard to encroach onto the integrated circuit device when the heat dissipation device is mounted onto the integrated circuit device.Type: ApplicationFiled: January 22, 2001Publication date: May 23, 2002Applicant: Intel CorporationInventor: Seri Lee