Abstract: An aerial vehicle includes a body and a wireless charging receiver pad connected to the body, whereby the aerial vehicle is configured to be wirelessly charged when parked above a wireless charging transmitter pad. The aerial vehicle includes landing gear connected to the body and extending underneath the body. The landing gear is configured for actuation to control the location of the receiver pad with respect to the transmitter pad.

Abstract: Methods, systems, and apparatus for a module electronics package. The modular electronics package includes a main circuit. The first main circuit board is configured to provide electrical interconnections to form an electric circuit. The modular electronics package includes a first power module. The first power module includes a first power device card and a first expansion slot. The first power device card is configured to be inserted into the first expansion slot and to be electrically coupled to the main circuit board via the first expansion slot.

Abstract: Systems, methods, computer-readable media, techniques, and methodologies are disclosed for performing fault detection and prediction for power electronics and switching devices for power electronics. Systems and methods can determine, using a machine learning model, a prediction for a value of a first switching parameter of a switching device, the prediction based on the present value of a second switching parameter of a switching device and a prior value of the first switching parameter. Systems and methods disclosed herein can further determine a residual comprising the difference between the prediction and an actual value of the switching parameter, generate a test statistic based on the residual, and compare the test statistic to a first threshold value. Systems and methods disclosed herein can determine the presence of a fault in the switching device based on a comparison of the test statistic to a threshold value.

Abstract: Systems and methods are disclosed for performing fault detection and prediction for power electronics and switching devices for power electronics, such as power inverters. Systems and methods disclosed herein can include determining, by a partial least squares model that evaluates values for one or more switching parameters for a switching device, the one or more switching parameters selected from a first set of switching parameters, a predicted value for the on-state current Ids of the switching device. The predicted value for the on-state current Ids can be based on the values of the one or more switching parameters for the switching device. Systems and methods disclosed herein can determine a residual comprising the difference between the predicted value for the another switching parameter of the switching device and an actual value of the predicted value for the another switching parameter, and generate a test statistic based on the residual.

Abstract: A method of fabricating a carbon nanotube (“CNT”) array includes providing a substrate with a CNT catalyst disposed on a surface of the substrate, heating the CNT catalyst to an annealing temperature, exposing the CNT catalyst to a CNT precursor for an exposure period to pre-load the CNT catalyst, and exposing the pre-loaded CNT catalyst to a carbon source for a growth period to form the CNT array. The formed CNT array comprises a plurality of CNT bundles that are aligned with one another in an alignment direction. At least one of the plurality of bundles comprises an average structural factor of 1.5 or less along an entirety of the length thereof.

Abstract: Systems, apparatus, methods, and computer program products to enhance the operation of a light system. A light apparatus includes an optical member to project light, one or more elastically deformable position adjustment members, and one or more light sources. The elastically deformable position adjustment members are operable to adjust a mounting position of the optical member, and include one or more photochromatic regions to facilitate movement of the one or more elastically deformable position adjustment members from a contracted state to an expanded state in response to exposure to UV light. The one or more light sources operable to selectively emit illuminating UV light in a direction that contacts the one or more photochromatic regions to thereby adjust a mounting position of the optical member and change a direction of light emitted by the lighting apparatus.

Abstract: A cold plate includes a first cooling surface comprising a first cooling structure bonded to an inner surface of the first cooling surface, a second cooling surface comprising a second cooling structure bonded to an inner surface of the second cooling surface, a manifold comprising an internal cavity defined by a first length, a first width, and a first height, and a flow divider defined by a second length, a second width, and a second height. The manifold is enclosed by the first cooling surface and the second cooling surface on opposing surfaces of the manifold separated by the first height. The flow divider is positioned within the internal cavity of the manifold. The flow divider supports and separates the first cooling structure and the second cooling structure by a portion of the second height of the flow divider.

Abstract: A method of decomposing a cured aromatic epoxy resin uses a molten salt bath at less than about 350° C. The molten salt bath includes a plurality of alkali metal hydroxides. The cured aromatic epoxy resin can be in intimate physical contact with a metal or alloy. The cured aromatic epoxy resin can be patterned by a lithographic method. The lithographic method can be multibeam interference lithography to form a three-dimensional photonic crystal template on a conductive substrate for electrodeposition of metal. Contacting the three-dimensional photonic crystal template with the electrodeposited metal with the molten salt bath can form a metal matrix device displaying a periodic pattern that is the inverse of the periodic pattern of the decomposed three-dimensional photonic crystal template.

Abstract: A method to form a three-dimensional photonic crystal template with a gradient structure involves irradiating a photoresist composition of a thickness of at least 15 ?m from at least four laser beams to yield a periodic patterned with a percolating matrix of mass in constructive volumes of a cured photoresist composition and destructive volumes of voids free of condensed matter where the proportion of constructive volume displays a gradient from the irradiated surface to the substrate after development. For a given light intensity, photoinitiator concentration in the photoresist composition, and a given thickness, by irradiating for a relatively short period, a three-dimensional photonic crystal template displaying a gradient having greater constructive volume proximal the air interface forms and a relatively long irradiation period results in a gradient having greater constructive volume proximal the substrate.

Abstract: A three-dimensional photonic crystal template on a reflective substrate displays a periodic patterned from multibeam interference lithography with constructive volumes of a cured photoresist composition and destructive volumes that are voids free of mass containing defects and where the reflective substrate is conductive. A method to generate the three-dimensional photonic crystal template includes using at least four laser beams of unequal intensity, oriented such that a dose of light controlled by the irradiation time generates the periodic pattern with a small dose, where the light reflected from the substrate is insufficient to activate a threshold quantity of photoinitiator in the destructive volumes for the formation of any anomalous condensed matter in the intended void volume.

Abstract: A method to control the density of a three-dimensional photonic crystal template involves changing the irradiation time from at least four laser beams to yield a periodic percolating matrix of mass and voids free of condensed matter from a photoresist composition. The photoresist composition includes a photoinitiator at a concentration where the dose or irradiation is controlled by the irradiation time and is less than the irradiation time that would convert all photoinitiator to initiating species such that the density of the three-dimensional photonic crystal template differs for different irradiation times. A deposition of reflecting or absorbing particles can be patterned on the surface of the photoresist composition to form a template with varying densities above different areas of the substrate.

Abstract: Systems and methods for detecting an anomaly in a power semiconductor device are disclosed. A system includes a server computing device and one or more local components communicatively coupled to the server computing device. Each local component includes sensors positioned adjacent to the power semiconductor device for sensing properties thereof. Each local component receives data corresponding to one or more sensed properties of the power semiconductor device from the sensors and transmits the data to the server computing device. The server computing device utilizes the data, via a machine learning algorithm, to generate a set of eigenvalues and associated eigenvectors and select a selected set of eigenvalues and associated eigenvectors. Each local component conducts a statistical analysis of the selected set of eigenvalues and associated eigenvectors to determine that the data is indicative of the anomaly.

Abstract: Embodiments described herein generally relate a multi-mode heat transfer system. The heat transfer system includes an emitter device. The emitter device includes an inner core, a composite material pattern, and a surface coating pattern. The inner core is surrounded by an outer core having a thickness and an outer surface. The composite material pattern extends through at least a portion of the outer surface and at least a portion of the thickness of the outer core and is thermally coupled to the inner core. The surface coating pattern is on the outer surface and is changeable between a low emissivity state and a high emissivity state based on a surface temperature of the emitter device. In the low emissivity state, the emitter device transmits an omni-directional radiation and, in the high emissivity state, the emitter device transmits a focused radiation via the composite material pattern.

Abstract: An electronic assembly includes a flexible printed circuit board (PCB) circumferentially disposed around a motor and a thermal management assembly (TMA) thermally connected to the flexible PCB. One or more switching semiconductor devices are disposed on a first surface of the flexible PCB. The TMA includes a cooling jacket, at least one jacket manifold formed through the cooling jacket and a thermal compensation base layer thermally coupled to the cooling jacket. The cooling jacket is mounted around a circumference of the motor and has a mounting surface concentric with the circumference of the motor. The mounting surface is coupled to the first surface of the flexible PCB. The at least one jacket manifold has a fluid inlet and a fluid outlet defining a fluid flow area therebetween. The thermal compensation base layer is thermally coupled to the cooling jacket and the one or more switching semiconductor devices.

Abstract: An integrated power control assembly mounted on an axial end of a three-phase motor includes a substrate, two input busbars each of positive and negative polarities alternatively spaced apart on the substrate, a plurality of sets of paired devices, and three output busbars corresponding to the three phases of the motor, wherein a set of paired devices includes a switching semiconductor and a diode. An inner input busbar has edges adjacent to an inner input busbar of opposite polarity and an outer input busbar of opposite polarity and configured to have at least twice as many devices as the outer input busbars. One or more sets of paired devices are disposed axially on outer input busbars and on inner input busbars along the edges. An individual output busbar is disposed over and electrically coupled to one or more sets of paired devices disposed on adjacent input busbars of opposite polarity.

Abstract: A 2-in-1 power electronics assembly includes a frame with a lower dielectric layer, an upper dielectric layer spaced apart from the lower dielectric layer, and a sidewall disposed between and coupled to the lower dielectric layer and the upper dielectric layer. The lower dielectric layer includes a lower cooling fluid inlet and the upper dielectric layer includes an upper cooling fluid outlet. A first semiconductor device assembly and a second semiconductor device assembly are included and disposed within the frame. The first semiconductor device is disposed between a first lower metal inverse opal (MIO) layer and a first upper MIO layer, and the second semiconductor device is disposed between a second lower MIO layer and a second upper MIO layer. An internal cooling structure that includes the MIO layers provides double sided cooling for the first semiconductor device and the second semiconductor device.

Abstract: Methods, systems, and apparatus for a module electronics package. The modular electronics package includes a main circuit. The first main circuit board is configured to provide electrical interconnections to form an electric circuit. The modular electronics package includes a first power module. The first power module includes a first power device card and a first expansion slot. The first power device card is configured to be inserted into the first expansion slot and to be electrically coupled to the main circuit board via the first expansion slot.

Abstract: A cooling system that includes an expandable vapor chamber having a condenser side opposite an evaporator side, a condenser side wick coupled to a condenser side wall, an evaporator side wick coupled to an evaporator side wall, and a vapor core positioned between the evaporator side wick and the condenser side wick. The cooling system also includes a vapor pressure sensor communicatively coupled to a controller and a bellow actuator disposed in the vapor core and communicatively coupled to the controller. The bellow actuator is expandable based on a vapor pressure measurement of the vapor pressure sensor.

Abstract: A method for forming an assembly is provided. The method includes depositing a colloidal template onto a substrate, wherein the colloidal template is porous, depositing a metal layer onto and within the colloidal template, depositing a cap structure onto the colloidal template opposite of the substrate, and removing the colloidal template from between the substrate and the cap structure to form a metal inverse opal structure disposed therebetween. The method continues by depositing an electrical isolation layer in contact with the cap structure opposite the metal inverse opal structure, and attaching the electrical isolation layer to a cooling device.

Abstract: An integrated power control assembly configured as an inverter for a motor is mounted directly on an axial end of the motor. The integrated power control assembly includes one or more power plates, one or more cooling plates coaxially disposed on and thermally connected to the one or more power plates, and one or more circuit boards circumferentially disposed around the one or more power plates. An individual power plate has a power card having one or more switching semiconductor devices corresponding to individual phases of the motor. The individual power card is electrically coupled to the motor through one or more busbars. An individual circuit board is electrically coupled to an individual power card corresponding to an individual phase of the motor. The individual circuit board has a first surface electrically coupled to the one or more power plates and a second surface opposite to the first surface.