Abstract: Methods, apparatuses and systems to provide for technology to that includes a first power electronics module including a plurality of first transistors that are diagonally offset from each other, and a second power electronics module stacked on the first power electronics module. The second power electronics module includes second transistors that are diagonally offset from each other. The second transistors are staggered relative to the first transistors.

Abstract: Embodiments of the disclosure relate to methods for forming a flat surface MIO structure for bonding and cooling electronic assemblies. In one embodiment, the method includes providing a plurality of particles on a surface of a base substrate. A metal is then deposited onto the plurality of particles up to a desired level to form a metal layer such that the plurality of particles is partially covered by the metal layer. An adhesive member is then applied to the plurality of particles exposed above the metal layer. Finally the adhesive member is pulled to remove individual particles of the plurality of particles that are exposed above the metal layer.

Abstract: In one or more embodiments of the present disclosure, a power electronic module may be described. The power electronic module may comprise a power semiconductor device, a substrate coupled to the power semiconductor device, and a base plate coupled to the substrate. The substrate may include from 50 weight percent (wt. %) to 99.9 wt. % of a poly(dicyclopentadiene) polymer. In one or more other embodiments of the present disclosure, a method for manufacturing a power electronic module may be described. The method may include disposing a solution on a base plate. The solution may include dicyclopentadiene monomer, a ruthenium-based catalyst, and a trialkyl phosphite initiator. The method may further include initiating a polymerization front within the solution to produce a substrate formed directly on the base plate. Furthermore, the method may include coupling a power semiconductor device on the substrate to produce the power electronic module.

Abstract: Methods, apparatuses and systems provide for technology that includes a transistor assembly for a power electronics apparatus having a plurality of transistor pairs arranged in a common plane, where for each pair of transistors one transistor is flipped relative to the other transistor. The technology further includes a first lead frame arranged parallel to and electrically coupled to the first transistor in each transistor pair, a second lead frame coplanar to the first lead frame and arranged parallel to and electrically coupled to the second transistor in each transistor pair, and a plurality of output lead frames arranged coplanar to each other, where each respective output lead frame is arranged parallel to and electrically coupled to a respective one pair of the plurality of transistor pairs.

Abstract: Systems and methods of testing the health of vehicular power devices are disclosed herein. A method may include producing operating points as a function of cycling current (Ids) and voltage drain to source (Vds) when a subject device is conducting current. The method may further include determining a mean of moving distribution to adapt a center of the moving distribution contrasted with a plurality of known healthy devices. The method may also include indicating an imminent fault in the subject device based upon a discontinuity among operating points above a threshold.

Abstract: Aspects of the disclosure provide a method including determining a measurement configuration for one or more piezoelectric devices in an electronic apparatus. The electronic apparatus includes an electronic device mounted on a substrate block using a bonding layer. The one or more piezoelectric devices including a first subset and a second subset are attached to one of the electronic device and the bonding layer. The method includes performing, based on the measurement configuration, a defect measurement on the electronic apparatus by causing the first subset to transmit and the second subset to receive one or more acoustic signals. The method includes determining whether at least one mechanical defect is located in at least one of (i) the bonding layer, (ii) the electronic device, (iii) the substrate block, (iv) interfaces of the electronic device, the bonding layer, and the substrate block based on the received one or more acoustic signals.

Abstract: In one or more embodiments of the present disclosure, a power electronic module may be described. The power electronic module may comprise a power semiconductor device, a substrate coupled to the power semiconductor device, and a base plate coupled to the substrate. The substrate may include from 50 weight percent (wt. %) to 99.9 wt. % of a poly(dicyclopentadiene) polymer. In one or more other embodiments of the present disclosure, a method for manufacturing a power electronic module may be described. The method may include disposing a solution on a base plate. The solution may include dicyclopentadiene monomer, a ruthenium-based catalyst, and a trialkyl phosphite initiator. The method may further include initiating a polymerization front within the solution to produce a substrate formed directly on the base plate. Furthermore, the method may include coupling a power semiconductor device on the substrate to produce the power electronic module.

Abstract: A cooling assembly includes a housing defining a fluid chamber, wick structures arranged on an interior surface of the fluid chamber such that one or more flow channels are present therebetween, and a divider. The divider includes an outer frame comprising a first side and a second side and one or more bridging supports extending between and connecting the first side and the second side of the outer frame. The one or more bridging supports are aligned with the one or more flow channels between the wick structures. Each one of the one or more bridging supports define a plurality of vapor flow paths extending therethrough. The one or more bridging supports further define a plurality of vapor spaces between the one or more bridging supports that are aligned with the wick structures. The plurality of vapor flow paths are fluidly coupled to the vapor spaces.

Abstract: Systems and methods for providing heating and cooling to a cabin of an autonomous or semiautonomous electric vehicle. A system includes one or more autonomous or semiautonomous electric vehicle components generating thermal energy as a byproduct of operation, a radiator fluidly coupled to the one or more vehicle components and positioned downstream from the one or more vehicle components such that the radiator receives at least a portion of the thermal energy, a thermoelectric cooler thermally coupled to and located downstream from the radiator, and one or more bypass valves that control fluid flow from the radiator such that fluid flows directly to a cabin of the vehicle or flows through the thermoelectric cooler before flowing into the cabin.

Abstract: A method for forming a flow channel in a MIO structure includes positioning a plurality of sacrificial spheres along a base substrate, heating a region of the plurality of sacrificial spheres above a melting point of the plurality of sacrificial spheres, thereby fusing the plurality of sacrificial spheres together and forming a solid channel, electrodepositing material between the plurality of sacrificial spheres and around the solid channel, removing the plurality of sacrificial spheres to form the MIO structure, and removing the solid channel to form the flow channel extending through the MIO structure.

Abstract: A transient liquid phase (TLP) composition includes a plurality of first high melting temperature (HMT) particles, a plurality of second HMT particles, and a plurality of low melting temperature (LMT) particles. Each of the plurality of first HMT particles have a core-shell structure with a core formed from a first high HMT material and a shell formed from a second HMT material that is different than the first HMT material. The plurality of second HMT particles are formed from a third HMT material that is different than the second HMT material and the plurality of LMT particles are formed from a LMT material. The LMT particles have a melting temperature less than a TLP sintering temperature of the TLP composition and the first, second, and third HMT materials have a melting point greater than the TLP sintering temperature.

Abstract: A method of detecting sub-surface voids in a sample comprises positioning a probe adjacent to a first point on the sample, emitting an ultrasonic wave from the probe towards the sample, moving the probe towards the sample, measuring a shear force amplitude of a reflection of the ultrasonic wave at the probe as the probe moves towards the sample, creating an approach curve by plotting the measured shear force amplitude of the reflection of the ultrasonic wave as a function of a distance between the probe and the sample, and determining whether a sub-surface void exists at the first point on the sample based on a slope of the approach curve.

Abstract: In various embodiments, a cooling assembly includes a heat-generating device, a metal inverse opal (MIO) layer, a shared coolant reservoir, a passive heat exchange circuit, and an active heat exchange circuit. The MIO layer is bonded to the heat-generating device. The shared coolant reservoir contains a coolant fluid. The passive heat exchange circuit directs coolant fluid from the shared coolant reservoir through the MIO layer and back to the shared coolant reservoir. The active heat exchange circuit includes a pump and a heat exchanger, wherein the active heat exchange circuit draws the coolant fluid from the shared coolant reservoir through the heat exchanger and returns the coolant fluid to the shared coolant reservoir.

Abstract: A method, system, and non-transitory computer readable medium describing an autoencoder that creates a reduced feature space from healthy power electronics devices for training. Devices under test are then encoded and compared to the encoded features of the healthy devices to determine health of the other devices. Contextual information is used to build multiple models that compare power electronics devices from similarly operated vehicles with one another.

Abstract: An electronic assembly includes a PCB disposed on an end-face of a motor proximate to a first surface thereof and a thermal management assembly (TMA) thermally connected to the PCB. One or more switching semiconductor devices are disposed on the first surface. The TMA includes a cooling jacket disposed around a circumference of the motor, at least one jacket manifold formed through the cooling jacket, a thermal compensation base layer thermally coupled to the cooling jacket and the one or more switching semiconductor devices, and a cooling manifold disposed through the PCB to form a fluid flow path therethrough. The at least one jacket manifold has a fluid inlet and a fluid outlet. Two or more electrically insulated posts, each having a cooling channel, are disposed between the at least one jacket manifold and the cooling manifold and form a fluid circuit between the fluid inlet and the fluid outlet.

Abstract: A thermal compensation layer includes a metal inverse opal (MIO) layer that includes a plurality of core-shell phase change (PC) particles encapsulated within a metal of the MIO layer. Each of the core-shell PC particles includes a core that includes a PCM having a PC temperature in a range of from 100° C. to 250° C., and a shell that includes a shell material having a melt temperature greater than the PC temperature of the PCM. A power electronics assembly includes a substrate having a thermal compensation layer formed proximate a surface of the substrate, the thermal compensation layer comprising an MIO layer that includes a plurality of core-shell PC particles encapsulated within a metal of the MIO layer. The power electronics assembly further includes an electronic device bonded to the thermal compensation layer at a first surface of the electronic device.

Abstract: Fan performance can be adjusted based on real-time operating conditions. The fan can include a plurality of blades operatively connected to a rotor. The blades can extend radially outward from the rotor to a tip. A housing can substantially surround the fan. The housing can have an inner peripheral surface that defines an inner diameter. The inner peripheral surface can include a first portion and a second portion downstream of the first portion. The first portion can be adjacently upstream of the plurality of blades, and the second portion can be substantially aligned with the plurality of blades. A plurality of actuators being distributed in a circumferential direction of the housing. The actuators can be operatively positioned to cause the inner diameter of the first portion or the second portion to be altered. As a result, one or more performance characteristics of the fan can be changed.

Abstract: An integrated power control assembly configured as an inverter for a motor is mounted directly on an axial end of the motor. The integrated power control assembly includes one or more power plates, one or more cooling plates coaxially disposed on and thermally connected to the one or more power plates, and one or more circuit boards circumferentially disposed around the one or more power plates. An individual power plate has a power card having one or more switching semiconductor devices corresponding to individual phases of the motor. The individual power card is electrically coupled to the motor through one or more busbars. An individual circuit board is electrically coupled to an individual power card corresponding to an individual phase of the motor. The individual circuit board has a first surface electrically coupled to the one or more power plates and a second surface opposite to the first surface.

Abstract: Embodiments described herein generally relate to an electronics assembly that includes a semiconductor device, a substrate layer, a first mesh layer and a second mesh layer. Jet channels that have a first inner diameter are disposed within the substrate layer. The first mesh layer includes a first plurality of pores that have a perimeter opening. The second mesh layer includes a second plurality of pores that have a second inner diameter. The jet channels, the first and the second plurality of pores are concentric to create a fluid path for a fluid to impinge a first device surface of the semiconductor device. The second inner diameter is smaller than the perimeter opening and the first inner diameter of the substrate layer such that a cooling fluid velocity increases when flowing from the substrate layer through the second mesh layer.

Abstract: Systems and methods for detecting an anomaly in a power semiconductor device are disclosed. A system includes a server computing device and one or more local components communicatively coupled to the server computing device. Each local component includes sensors positioned adjacent to the power semiconductor device for sensing properties thereof. Each local component receives data corresponding to one or more sensed properties of the power semiconductor device from the sensors and transmits the data to the server computing device. The server computing device utilizes the data, via a machine learning algorithm, to generate a set of eigenvalues and associated eigenvectors and select a selected set of eigenvalues and associated eigenvectors. Each local component conducts a statistical analysis of the selected set of eigenvalues and associated eigenvectors to determine that the data is indicative of the anomaly.