Patents by Inventor Sheng Han

Sheng Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11988847
    Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a fixed portion, a first movable portion, a second movable portion, a first driving assembly, and a second driving assembly. The first movable portion is movable relative to the fixed portion. The second movable portion is used for holding an optical element having a main axis, and is movable relative to the first movable portion. The first driving assembly is used for driving the first movable portion to move in a first dimension relative to the fixed portion, and the second driving assembly is used for driving the second movable portion to move in a second dimension relative to the fixed portion. The first dimension and the second dimension are different.
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: May 21, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Yun-Fei Wang, Yu-Huai Liao, Sheng-Zong Chen, Wei-Han Hsia, Kun-Shih Lin
  • Patent number: 11991886
    Abstract: A method of forming a ferroelectric random access memory (FeRAM) device includes: forming a first layer stack and a second layer stack successively over a substrate, where the first layer stack and the second layer stack have a same layered structure that includes a layer of a first electrically conductive material over a layer of a first dielectric material, where the first layer stack extends beyond lateral extents of the second layer stack; forming a trench that extends through the first layer stack and the second layer stack; lining sidewalls and a bottom of the trench with a ferroelectric material; conformally forming a channel material in the trench over the ferroelectric material; filling the trench with a second dielectric material; forming a first opening and a second opening in the second dielectric material; and filling the first opening and the second opening with a second electrically conductive material.
    Type: Grant
    Filed: January 9, 2023
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Meng-Han Lin, Bo-Feng Young, Han-Jong Chia, Sheng-Chen Wang, Feng-Cheng Yang, Sai-Hooi Yeong, Yu-Ming Lin
  • Publication number: 20240164109
    Abstract: In an embodiment, a device includes: a word line extending in a first direction; a data storage layer on a sidewall of the word line; a channel layer on a sidewall of the data storage layer; a back gate isolator on a sidewall of the channel layer; and a bit line having a first main region and a first extension region, the first main region contacting the channel layer, the first extension region separated from the channel layer by the back gate isolator, the bit line extending in a second direction, the second direction perpendicular to the first direction.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 16, 2024
    Inventors: Meng-Han Lin, Han-Jong Chia, Sheng-Chen Wang, Feng-Cheng Yang, Yu-Ming Lin, Chung-Te Lin
  • Patent number: 11985825
    Abstract: A memory array device includes a stack of transistors over a semiconductor substrate, a first transistor of the stack being disposed over a second transistor of the stack. The first transistor includes a first memory film along a first word line and a first channel region along a source line and a bit line, the first memory film being disposed between the first channel region and the first word line. The second transistor includes a second memory film along a second word line and a second channel region along the source line and the bit line, the second memory film being disposed between the second channel region and the second word line. The memory array device includes a first via electrically connected to the first word line and a second via electrically connected to the second word line, the second staircase via and the first staircase via having different widths.
    Type: Grant
    Filed: April 15, 2021
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Meng-Han Lin, Feng-Cheng Yang, Sheng-Chen Wang, Sai-Hooi Yeong, Yu-Ming Lin, Han-Jong Chia
  • Patent number: 11983245
    Abstract: Various embodiments a method and apparatus for unmanned driving behavior decision-making and model training, and an electronic device. The method includes: acquiring sample data, wherein the sample data includes a sample image; extracting a sample feature vector corresponding to the sample data, wherein a feature vector of the sample image is extracted by manifold dimension reduction; and based on the sample feature vector, training by semi-supervised learning to obtain a target decision-making model, wherein the target decision-making model is used for decision-making classification.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: May 14, 2024
    Assignee: Beijing Sankuai Online Technology Co., Ltd
    Inventors: Shuguang Ding, Qin Han, Dongchun Ren, Sheng Fu, Deheng Qian
  • Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Patent number: 11985830
    Abstract: A semiconductor device and method of manufacture are provided. In embodiments a memory array is formed by manufacturing portions of a word line during different and separate processes, thereby allowing the portions formed first to act as a structural support during later processes that would otherwise cause undesired damage to the structures.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Feng-Cheng Yang, Meng-Han Lin, Han-Jong Chia, Sheng-Chen Wang, Chung-Te Lin
  • Patent number: 11979620
    Abstract: A system for automatically placing virtual advertisements in sports videos, which includes a shot detection module, background extraction module, a calibration module and an asset placement module. The shot detection module detects the target shot of a sports video via a first trained model. The background extraction module performs a background extraction to extract the background of the first frame of the target shot to obtain a first background mask. The calibration module performs a camera calibration to detect a first transformation relation, between the first frame and a sport field template, via a second trained model. The asset placement module transforms an advertisement asset according to the first transformation relation to obtain a first transformed asset, and execute an asset placement to place the first transformed asset onto the first frame according to the first background mask to obtain a first image frame with placed advertisement.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: May 7, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Sheng-Han Wu, Feng-Sheng Lin, Ruen-Rone Lee
  • Publication number: 20240143529
    Abstract: A method for a host computer to access a target device via a remote extender. The target device is connected to the remote extender, and a target device driver corresponding to the target device is installed on the host computer. The method includes setting up a logic transmission pipe between the host computer and the remote extender with a network connection as the underlying transmission path, and handling an I/O request from the target device driver to access the target device via the logic transmission pipe. The method is used to allow the target device to be treated by the host computer as a local resource. Additionally, the disclosure provides a system for accessing the remote target device and a remote extender thereof.
    Type: Application
    Filed: March 9, 2023
    Publication date: May 2, 2024
    Inventors: YU-HAN LIU, SHENG-CHE CHUEH, CHONG-LI HUANG
  • Publication number: 20240138152
    Abstract: In accordance with embodiments, a memory array is formed with a multiple patterning process. In embodiments a first trench is formed within a multiple layer stack and a first conductive material is deposited into the first trench. After the depositing the first conductive material, a second trench is formed within the multiple layer stack, and a second conductive material is deposited into the second trench. The first conductive material and the second conductive material are etched.
    Type: Application
    Filed: January 2, 2024
    Publication date: April 25, 2024
    Inventors: Feng-Cheng Yang, Meng-Han Lin, Sheng-Chen Wang, Han-Jong Chia, Chung-Te Lin
  • Publication number: 20240124163
    Abstract: A magnetic multi-pole propulsion array system is applied to at least one external cathode and includes a plurality of magnetic multi-pole thrusters connected adjacent to each other. Each magnetic multi-pole thruster includes a propellant provider, a discharge chamber, an anode and a plurality of magnetic components. The propellant provider outputs propellant. The discharge chamber is connected with the propellant provider to accommodate the propellant. The anode is disposed inside the discharge chamber to generate an electric field. The plurality of magnetic components is respectively disposed on several sides of the discharge chamber. One of the several sides of the discharge chamber of the magnetic multi-pole thruster is applied for one side of a discharge chamber of another magnetic multi-pole thruster.
    Type: Application
    Filed: December 19, 2022
    Publication date: April 18, 2024
    Applicant: National Cheng Kung University
    Inventors: Yueh-Heng Li, Yu-Ting Wu, Chao-Wei Huang, Wei-Cheng Lo, Hsun-Chen Hsieh, Ping-Han Huang, Yi-Long Huang, Sheng-Wen Liu, Wei-Cheng Lien
  • Patent number: 11961770
    Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.
    Type: Grant
    Filed: November 4, 2021
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Han Lin, Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai, Sheng-Hsiang Chuang, Surendra Kumar Soni, Shou-Wen Kuo, Wu-An Weng, Gary Tsai, Chien-Ko Liao, Ya Hsun Hsueh, Becky Liao, Ethan Yu, Ming-Chi Tsai, Kuo-Yi Liu
  • Publication number: 20240120277
    Abstract: A chip structure is provided. The chip structure includes a substrate, a redistribution layer over the substrate, a bonding pad over the redistribution layer, a shielding pad over the redistribution layer and surrounding the bonding pad, an insulating layer over the redistribution layer and the shielding pad, and a bump over the bonding pad and the insulating layer. The insulating layer includes a first part and a second part surrounded by the first part, the first part has first thickness, the second part has a second thickness, and the first thickness and the second thickness are different.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Inventors: Hong-Seng SHUE, Sheng-Han TSAI, Kuo-Chin CHANG, Mirng-Ji LII, Kuo-Ching HSU
  • Patent number: 11954441
    Abstract: A device and method for generating article markup information are provided. The method for generating article markup information includes the following. Segmentation processing is performed on an article to generate a segmentation result. Name entity recognition is performed on the segmentation result to generate a first recognition result. Whether the segmentation result includes any word in an expansion list is determined. Expanded entity classification conversion is performed on the first recognition result to generate a second recognition result. The second recognition result and the segmentation result are used as markup information.
    Type: Grant
    Filed: January 4, 2022
    Date of Patent: April 9, 2024
    Assignee: Acer Incorporated
    Inventors: Yi-Chun Lin, Yueh-Yarng Tsai, Pin-Cyuan Lin, Ke-Han Pan, Sheng-Wei Chu
  • Patent number: 11950428
    Abstract: A memory device includes a first stacking structure, a second stacking structure, a plurality of first isolation structures, gate dielectric layers, channel layers and conductive pillars. The first stacking structure includes a plurality of first gate layers, and a second stacking structure includes a plurality of second gate layers, where the first stacking structure and the second stacking structure are located on a substrate and separated from each other through a trench. The first isolation structures are located in the trench, where a plurality of cell regions are respectively confined between two adjacent first isolation structures of the first isolation structures in the trench, where the first isolation structures each includes a first main layer and a first liner surrounding the first main layer, where the first liner separates the first main layer from the first stacking structure and the second stacking structure.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sheng-Chen Wang, Meng-Han Lin, Sai-Hooi Yeong, Yu-Ming Lin, Han-Jong Chia
  • Publication number: 20240091569
    Abstract: Methods, apparatuses, systems, and/or the like are provided. An example method may include installing one or more filter cartridges in a blower device. An example blower device may include a housing defining at least one air inlet. An example filter cartridge may include a first filter cartridge defining a first outlet opening. The first filter cartridge may be configured to slidably engage the blower device to align the first outlet opening with at least a first portion of the at least one air inlet of the blower device in a first installed position. The one or more filter cartridges my include a second filter cartridge. The second filter cartridge may include a second outlet opening. The example method may include aligning the first outlet opening of the first filter cartridge with at least the first portion of the at least one air inlet of the blower device.
    Type: Application
    Filed: September 13, 2023
    Publication date: March 21, 2024
    Inventors: Siwei WANG, Xiaojin HAN, Hongbing XIANG, Sheng ZHOU, Anker CHEN
  • Publication number: 20240088255
    Abstract: A method includes forming source/drain regions in a semiconductor substrate; depositing a zirconium-containing oxide layer over a channel region in the semiconductor substrate and between the source/drain region; forming a titanium oxide layer in contact with the zirconium-containing oxide layer; forming a top electrode over the zirconium-containing oxide layer, wherein no annealing is performed after depositing the zirconium-containing oxide layer and prior to forming the top electrode.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 14, 2024
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., NATIONAL TAIWAN UNIVERSITY
    Inventors: Miin-Jang CHEN, Sheng-Han YI, Chen-Hsuan LU
  • Patent number: 11924304
    Abstract: A computer system accesses a storage device. Contents of an object of a request are sorted. The contents of an object of a request are sorted. A hash key is generated to access information in the storage device based on the sorted contents of the object, wherein objects with non-critical differences are mapped to the same hash key. The information in the storage device is accessed based on the generated hash key to produce a response to the request. Embodiments of the present invention further include a method and program product for accessing a storage device in substantially the same manner described above.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: March 5, 2024
    Assignee: International Business Machines Corporation
    Inventors: Brian S. Dreher, Sheng Hua Bao, Xiaoyang Gao, Yanyan Han
  • Patent number: D1016074
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: February 27, 2024
    Assignee: GETAC TECHNOLOGY CORPORATION
    Inventors: Sheng-Han Fan, Wei-Sen Lu
  • Patent number: D1027166
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: May 14, 2024
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Sheng Zhou, Xiaojin Han, Hongbing Xiang, Weifeng Shen, Teicheng Qu, ZhaoXia Jin