Patents by Inventor Shi Chen

Shi Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190020172
    Abstract: A solid-state laser amplifier includes a core material providing an active gain medium. A cladding material is on the core material that is the same material as the core material that further comprises a broadband absorber material. The cladding material suppresses transverse oscillations in solid-state, single-crystal or ceramic laser amplifiers by employing a native-material, solid-state, index-matched cladding containing an appropriate broadband absorber.
    Type: Application
    Filed: September 14, 2018
    Publication date: January 17, 2019
    Inventors: ROMAIN GAUME, ERIC CUNNINGHAM, SHI CHEN
  • Publication number: 20180369923
    Abstract: A clamp for a tool holder is disclosed. The clamping tool holder includes a body having an insert-receiving pocket and a threaded clamp-receiving bore with a coolant opening for receiving pressurized coolant from a coolant source. A clamp includes a threaded aperture extending from a top surface to a bottom surface and coolant passages in fluid communication with a coolant header. A clamp screw is threaded into the threaded aperture of the clamp. The clamp screw includes a plurality of coolant passages in fluid communication with the coolant opening of the body, and at least one coolant channel in fluid communication with the coolant passage. Coolant from the coolant source enters the coolant opening of the body, travels into the clamp screw, travels into each coolant passage of the clamp, and then exits the clamp in a direction toward a cutting insert-workpiece interface.
    Type: Application
    Filed: June 26, 2017
    Publication date: December 27, 2018
    Inventors: Shi Chen, Qi Wang, Igor Kaufmann, Jason Won Goldsmith, Yingwei Wu
  • Publication number: 20180321318
    Abstract: Apparatuses and methods for passively monitoring the integrity of current sensing devices and associated circuitry in protective devices such as Ground Fault Circuit Interrupters and Arc Fault Circuit Interrupters are provided. A protection circuit interrupter employs a capacitively coupled noise signal obtained by an arrangement of one or both of the line side arms relative to a Rogowski coil. The noise signal is monitored while the line and load sides of a protective circuit interrupter are disconnected, and the connection of the line and load sides disabled if the noise signal fails to correlate sufficiently to a reference noise cycle. When the line and load sides are connected, the RMS value of the observed current signal is monitored such that the line and load sides are disconnected if the observed current signal fails to meet an RMS threshold.
    Type: Application
    Filed: November 19, 2015
    Publication date: November 8, 2018
    Inventors: Gary Michael MILLER, William Vernon MILLER, III, Edward Shi CHEN
  • Publication number: 20180314554
    Abstract: An example method to provide fault tolerance in a virtualized computing environment with a first host in a first fault domain and a second host in a second fault domain may include determining whether a primary virtualized computing instance and a secondary virtualized computing instance are both in the first fault domain. The secondary virtualized computing instance may be configured as a backup for the primary virtualized computing instance and supported by the first host. The method may further include: in response to determination that the primary virtualized computing instance and secondary virtualized computing instance are both in the first fault domain, selecting, from the second fault domain, the second host based on comparing a resource availability of each of a plurality of hosts that include the first host and the second host; and migrating the secondary virtualized computing instance from the first fault domain to the second fault domain.
    Type: Application
    Filed: July 9, 2018
    Publication date: November 1, 2018
    Applicant: VMware, Inc.
    Inventors: Xiaojin WU, Pin XIE, Shi CHEN, Biwen LI, Yan SU
  • Publication number: 20180281074
    Abstract: A vibration absorber assembly which includes a cantilever beam component having a proximal end and a distal end, wherein the cantilever beam component extends along a longitudinal axis between the proximal end and the distal end. A distal support element supports the distal end of the cantilever beam component, and an absorber mass is movable in at least a radial direction with respect to the longitudinal axis. First and second support media support the absorber mass with respect to the cantilever beam component. The first support medium contacts the cantilever beam component at a first support region of the cantilever beam component, and the second support medium contacts the cantilever beam component at a second support region of the cantilever beam component, the first and second support regions being located at different longitudinal positions along the cantilever beam component. Other variants and embodiments are broadly contemplated herein.
    Type: Application
    Filed: March 31, 2017
    Publication date: October 4, 2018
    Inventors: Samuel Lawrence Eichelberger, Tony Schmitz, Shi Chen, Igor Kaufmann, Ruy Frota de Souza Filho, Jeremy Canonge
  • Patent number: 10064800
    Abstract: A transglutaminase activator containing at least one kind selected from the group consisting of an extract from Justicia procumbens, an extract from Peristrophe japonica, and a compound represented by Formula (1), as an active ingredient: wherein R1 and R2 represent a hydrogen atom, a hydroxyl group, or an alkoxy group having 1 to 4 carbon atoms; R3 represents a hydrogen atom, or a group for forming a methylenedioxy group by bonding with R2; R4 and R5 represent a hydrogen atom, or a group for forming a methylenedioxy group by bonding with each other; R6 represents a hydrogen atom, a hydroxyl group, an alkoxy group having 1 to 5 carbon atoms, an acyloxy group having 1 to 4 carbon atoms, or a specific sugar residue.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: September 4, 2018
    Assignee: Kao Corporation
    Inventors: Junko Ishikawa, Shino Mitsunaga, Shi Chen, Akiko Kawasaki, Yoshiya Sugai, Yoshie Shimotoyodome, Naoki Oya
  • Patent number: 10031778
    Abstract: An example method is described to provide fault tolerance in a virtualized computing environment with a first fault domain and a second fault domain. The method may comprise determining whether a first primary virtualized computing instance and a first secondary virtualized computing instance are both in the first fault domain. The method may comprise: in response to determination that the first primary virtualized computing instance and first secondary virtualized computing instance are both in the first fault domain, selecting a second secondary virtualized computing instance from the second fault domain; migrating the first secondary virtualized computing instance from a first host to a second host; and migrating the second secondary virtualized computing instance from the second host to the first host, thereby swapping the first secondary virtualized computing instance in the first fault domain with the second secondary virtualized computing instance in the second fault domain.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: July 24, 2018
    Assignee: VMware, INC.
    Inventors: Xiaojin Wu, Pin Xie, Shi Chen, Biwen Li, Yan Su
  • Patent number: 10019330
    Abstract: An example method is described to provide fault tolerance in a virtualized computing environment with a first fault domain and a second fault domain. The method may comprise determining whether a primary virtualized computing instance and a secondary virtualized computing instance are both in the first fault domain. The secondary virtualized computing instance may be configured as a backup for the primary virtualized computing instance and supported by a first host. The method may further comprise: in response to determination that the primary virtualized computing instance and secondary virtualized computing instance are both in the first fault domain, selecting, from the second fault domain, a second host based on a resource availability of the second host; and migrating the secondary virtualized computing instance from the first host to the second host, thereby migrating the secondary virtualized computing instance from the first fault domain to the second fault domain.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: July 10, 2018
    Assignee: VMWARE, INC.
    Inventors: Xiaojin Wu, Pin Xie, Shi Chen, Biwen Li, Yan Su
  • Patent number: 9993879
    Abstract: A cutting tool includes a cutting insert mounted to a head attached to a collar at a first end of the cutting tool. A shank is located at a second, opposite end of the cutting tool. A central cavity extends inwardly from the first end toward the shank. An eddy current vibration absorber assembly is disposed within the central cavity. The eddy current vibration absorber assembly includes an absorber mass made of an electrically conductive material, a magnetic material proximate the absorber mass, and a support member for supporting the absorber mass within the central cavity. The eddy current vibration absorber assembly is tuned by selectively adjusting a distance between the absorber mass and the magnetic material.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: June 12, 2018
    Assignee: KENNAMETAL INC
    Inventors: Samuel Eichelberger, Tony Schmitz, Shi Chen, Igor Kaufmann
  • Publication number: 20180154453
    Abstract: A cutting tool includes a cutting insert mounted to a head attached to a collar at a first end of the cutting tool. A shank is located at a second, opposite end of the cutting tool. A central cavity extends inwardly from the first end toward the shank. An eddy current vibration absorber assembly is disposed within the central cavity. The eddy current vibration absorber assembly includes an absorber mass made of an electrically conductive material, a magnetic material proximate the absorber mass, and a support member for supporting the absorber mass within the central cavity. The eddy current vibration absorber assembly is tuned by selectively adjusting a distance between the absorber mass and the magnetic material.
    Type: Application
    Filed: December 5, 2016
    Publication date: June 7, 2018
    Applicant: Kennametal Inc.
    Inventors: Samuel Eichelberger, Tony Schmitz, Shi Chen, Igor Kaufmann
  • Patent number: 9962837
    Abstract: A system for controlling a robot by brain electrical signal, includes a screen, an electronic signal detection device, and a host computer. The screen shows a plurality of icons thereon, and the plurality of icons flashes at different frequencies. The electrical signal detection device detects brain electrical signal when one of the plurality of icons is stared. The host computer stores a plurality of personal reference parameters corresponding to the plurality of icons of the screen. The host computer processes the brain electrical signal to get parameters of use, and compares the parameters of use with the plurality of personal reference parameters to choose and execute the icon which is stared.
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: May 8, 2018
    Assignees: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., I, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Tsung-Han Chen, Shou-Han Chung, Chin-Teng Lin, Li-Wei Ko, Shi-An Chen
  • Patent number: 9934735
    Abstract: A display control method and an electronic device are described. The electronic device includes a first body and a second body. Two sides of the first body include a first display area and a second display area respectively. The method includes: acquiring space position information of the first body and the second body, determining whether the space position information satisfies a first space predetermined condition, and obtaining a first determining result; detecting a first included angle between the first body and the second body if the first determining result indicates that the space position information satisfies the first space predetermined condition; determining whether the first included angle satisfies a first included angle predetermined condition, and switching an operating state of the electronic device to the triangle supporting state if the first included angle satisfies the first included angle predetermined condition.
    Type: Grant
    Filed: November 13, 2013
    Date of Patent: April 3, 2018
    Assignees: BEIJING LENOVO SOFTWARE LTD., LENOVO (BEIJING) CO., LTD.
    Inventors: Binbin Wei, Xueyuan Zhang, Haifang Tan, Shi Chen
  • Patent number: 9900975
    Abstract: A chip heater and heating air arrangement includes a circuit module including a circuit board, chip unit mounted on the circuit board and locating member mounted around the chip unit, heating aid including flat heat-transfer base panel, locating structure mounted in the flat heat-transfer base panel and attached to the chip unit and mounting structure outwardly extended from the flat heat-transfer base panel and fastened to the locating member, heater fastened to the locating structure of the heating aid, and heat dissipating mechanism including a heat-transfer holder plate attached to the heater. If the temperature of the chip unit goes below 0° C., the heater is turned on to generate heat and enabling generated heat to be transferred through the heating aid to heat the chip unit to the normal operating temperature level, enabling the computer device that uses the chip heater and heating air arrangement to work under cold environment.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: February 20, 2018
    Assignee: ADLINK TECHNOLOGY INC.
    Inventors: Jen-Shi Chen, Chih-Liang Fang
  • Patent number: 9887182
    Abstract: Methods for improving hybrid bond yield for semiconductor wafers forming 3DIC devices includes first and second wafers having dummy and main metal deposited and patterned during BEOL processing. Metal of the dummy metal pattern occupies from about 40% to about 90% of the surface area of any given dummy metal pattern region. High dummy metal surface coverage, in conjunction with utilization of slotted conductive pads, allows for improved planarization of wafer surfaces presented for hybrid bonding. Planarized wafers exhibit minimum topographic differentials corresponding to step height differences of less than about 400 ?. Planarized first and second wafers are aligned and subsequently hybrid bonded with application of heat and pressure; dielectric-to-dielectric, RDL-to-RDL. Lithography controls to realize WEE from about 0.5 mm to about 1.5 mm may be employed to promote topographic uniformity at wafer edges.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: February 6, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ju-Shi Chen, Cheng-Ying Ho, Chun-Chieh Chuang, Sheng-Chau Chen, Shih Pei Chou, Hui-Wen Shen, Dun-Nian Yaung, Ching-Chun Wang, Feng-Chi Hung, Shyh-Fann Ting
  • Patent number: 9855611
    Abstract: A toolholder includes a cutting tool mounted to a head attached to a collar at a first end of the toolholder. A shank is located at a second, opposite end of the toolholder. A central cavity extends inwardly from the first end toward the shank. A viscous fluid inertia mass damper is disposed within the central cavity. The viscous fluid inertia mass damper includes an absorber body having a first end, a second end opposite the first end, a fluid reservoir formed in the damper body for containing a viscous fluid, and a plurality of apertures formed in the damper body for allowing the viscous fluid to flow from the fluid reservoir and through the apertures to suppress vibration of the toolholder. A method for suppressing vibrations in a toolholder is also disclosed.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: January 2, 2018
    Assignee: KENNAMETAL INC.
    Inventors: Samuel Lawrence Eichelberger, Shi Chen, Ruy Frota de Souza Filho, Jason Won Goldsmith, Igor Kaufmann
  • Patent number: 9827614
    Abstract: A clamp assembly to secure a cutting insert to a holder that includes a clamp that has a distal end and a clamp projection depending from the distal end of the clamp. There is a coolant plate that has a top plate surface and a bottom plate surface wherein the top plate surface contains a recess that receives the clamp projection upon assembly of the clamp and the coolant plate. The bottom plate surface contains a bowl having an open bowl end wherein in operation the bowl directs coolant through the open bowl end toward the cutting insert. The assembly has a positioner extending between the clamp and the coolant plate so as to maintain a position of the clamp relative to the coolant plate upon the assembly of the clamp and the coolant plate.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: November 28, 2017
    Assignee: KENNAMETAL INC
    Inventors: Shi Chen, Nicholas J. Henry, Kent P. Mizgalski, Samuel L. Eichelberger
  • Publication number: 20170329546
    Abstract: Example methods are provided to perform power management for a distributed storage system accessible by a cluster in a virtualized computing environment. The method may comprise determining that a power-off requirement is satisfied for a first host from the cluster. The power-off requirement may be satisfied based on multiple second hosts from the cluster complying with a data placement policy configured for the cluster after the first host is powered off. The method may also comprise based on the data placement policy, placing virtual machine data stored on the first host onto one or more of the multiple second hosts. The method may further comprise migrating one or more virtual machines supported by the first host to one or more of the multiple second hosts; and powering off the first host.
    Type: Application
    Filed: May 10, 2016
    Publication date: November 16, 2017
    Applicant: VMware, Inc.
    Inventors: Shi CHEN, Pin XIE, Ting YIN
  • Publication number: 20170309603
    Abstract: Methods for improving hybrid bond yield for semiconductor wafers forming 3DIC devices includes first and second wafers having dummy and main metal deposited and patterned during BEOL processing. Metal of the dummy metal pattern occupies from about 40% to about 90% of the surface area of any given dummy metal pattern region. High dummy metal surface coverage, in conjunction with utilization of slotted conductive pads, allows for improved planarization of wafer surfaces presented for hybrid bonding. Planarized wafers exhibit minimum topographic differentials corresponding to step height differences of less than about 400 ?. Planarized first and second wafers are aligned and subsequently hybrid bonded with application of heat and pressure; dielectric-to-dielectric, RDL-to-RDL. Lithography controls to realize WEE from about 0.5 mm to about 1.5 mm may be employed to promote topographic uniformity at wafer edges.
    Type: Application
    Filed: May 17, 2017
    Publication date: October 26, 2017
    Inventors: Ju-Shi Chen, Cheng-Ying Ho, Chun-Chieh Chuang, Sheng-Chau Chen, Shih Pei Chou, Hui-Wen Shen, Dun-Nian Yaung, Ching-Chun Wang, Feng-Chi Hung, Shyh-Fann Ting
  • Publication number: 20170288521
    Abstract: The present invention provides a linear motor, wherein, a coil is fastened on a mass block that is suspended inside a housing, a first magnet and a second magnet that have opposite magnetic poles are symmetrically disposed at an upper side and at a lower side relative to the coil in the middle and positioned parallel to the centric plane of the coil, by arranging an upper magnetic steel and a lower magnetic steel at an upper side and at a lower side relative to the mass block in the middle and parallel to the mass block. In the linear motor of the present invention, the design route that utilizes coil motion to drive mass block motion is different from the traditional route that utilizes magnet motion to drive mass block motion.
    Type: Application
    Filed: February 24, 2017
    Publication date: October 5, 2017
    Inventors: Shaoping JIN, Shaobin FANG, Shi CHEN
  • Publication number: 20170288524
    Abstract: The present invention provides a linear motor, wherein, a coil is fastened on a mass block that is suspended inside a housing, and a magnet is fastened on the housing and thus does not move during use. In the linear motor of the present invention, the design route that utilizes coil motion to drive mass block motion is different from the traditional route that utilizes magnet motion to drive mass block motion, thereby the traditional “moving-magnet type” is changed into “moving-coil type” of the present invention. When the linear motor provided by the present invention is used in a highly magnetic environment, even if magnetic shield plates for shielding external magnetic induction lines are glued on both outer sides of the housing, because the magnet is fixed stationary itself, no vertical deviation of the magnet due to influence of the shield plates like in the prior art occurs.
    Type: Application
    Filed: February 24, 2017
    Publication date: October 5, 2017
    Inventors: Shaoping JIN, Shaobin FANG, Shi CHEN