Abstract: [Object] Provided is a magnetic sensor testing device capable of preventing performance of an electromagnet from greatly changing due to heat applied to a magnetic sensor. [Solving Means] A magnetic sensor testing device includes electromagnets 50 and 60 that apply a magnetic field to a magnetic sensor, temperature regulators 30 and 40 that regulate a temperature of the magnetic sensor by locally applying heat to the magnetic sensor, and a controller that controls the electromagnets 50 and 60 and the temperature regulators 30 and 40, in which the controller tests the magnetic sensor in a state in which the magnetic field is applied to the magnetic sensor by the electromagnets 50 and 60 while the heat is applied to the magnetic sensor by the temperature regulators 30 and 40.

Abstract: A lighting system includes: a wireless communication device that transmits a test signal; luminaires that measure a signal strength of the test signal upon receipt and transmit signal strength information on the signal strength to the wireless communication device; and a determining unit that determines a condition of the lighting system based on the signal strength or the signal strength information. The determining unit: determines the condition of the lighting system to be acceptable upon confirming transmission of the signal strength information by all luminaires and unacceptable upon failing to confirm transmission of the signal strength information by at least one luminaire; or determines the condition of the lighting system to be acceptable when each signal strength measured by all luminaires exceeds a reference value and unacceptable when the signal strength measured by at least one luminaire is less than or equal to the reference value.

Abstract: A heat assisted magnetic recording head gimbal assembly comprises a light source unit, a heat assisted magnetic recording head, a suspension, an actuator, and a slider. The light source unit comprises a light emitting element and a submount. The suspension comprises a load beam and a flexure movably coupled with the load beam. The actuator is deformably coupled to the flexure. The slider is supported by the suspension and coupled to the flexure and the light source unit. The slider includes the heat assisted magnetic recording head. First and second solders or conductive adhesives are positioned on opposite longitudinal sides of the light source unit, so that the first solder or conductive adhesive electrically and mechanically connects the submount to a wiring supplying power, while the second solder or conductive adhesive electrically and mechanically connects the light emitting element to the wiring.

Abstract: Resin sheets which includes a support and a resin composition layer in contact on the support, and which are characterized in that an extracted water conductivity A of a cured product of the resin composition layer when extracted at 120° C. for 20 hours is 50 ?S/cm or less and an extracted water conductivity B of the cured product of the resin composition layer when extracted at 160° C. for 20 hours is 200 ?S/cm or less, can provide a thin insulating layer having excellent insulating properties.

Abstract: Resin compositions containing (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler in which the content of (C) the inorganic filler is 55% by mass or higher with respect to 100% by mass of a non-volatile component within the resin composition, the average particle diameter of (C) the inorganic filler is 0.05 to 0.35 ?m, the product of the specific surface area (m2/g) of (C) the inorganic filler and the true density of (C) the inorganic filler is 1 to 77 m2/g and the moisture permeation of a cured product obtained by thermally cured the resin composition is 0.05 to 2.8 g·mm/m2·24 h are useful for making printed wiring boards.

Abstract: Described herein is a connector assembly that comprises a head-gimbal assembly (HGA) tail connector, a flex connector, and an adhesive. The HGA tail connector comprises a pad support, an HGA pad coupled to the pad support, and an HGA trace coupled to the pad support and electrically coupled to the HGA pad. The flex connector comprises a substrate, comprising a first side and a second side, where the first side is opposite the second side. The flex connector also comprises a flex pad coupled to the first side of the substrate, a flex trace coupled to the second side of the substrate, and a via extending through the substrate from the first side to the second side. The via electrically couples the flex pad and the flex trace. Also, the adhesive adheres the HGA pad of the HGA connector in electrical contact with the flex pad of the flex connector.

Abstract: Resin compositions containing (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler in which the content of (C) the inorganic filler is 55% by mass or higher with respect to 100% by mass of a non-volatile component within the resin composition, the average particle diameter of (C) the inorganic filler is 0.05 to 0.35 ?m, the product of the specific surface area (m2/g) of (C) the inorganic filler and the true density of (C) the inorganic filler is 1 to 77 m2/g and the moisture permeation of a cured product obtained by thermally cured the resin composition is 0.05 to 2.8 g˜mm/m2·24 h are useful for making printed wiring boards.

Abstract: Wiring boards, including an embedded type wiring boards and flexible wiring boards, may be produce by: (1) preparing a wiring layer-attached base including a base and a wiring layer provided on at least one surface of the base, (2) laminating an adhesive sheet including (i) a thermosetting resin composition layer and (ii) a resin film layer on the wiring layer-attached base so that the wiring layer will be embedded in (i) the thermosetting resin composition layer and performing thermal curing to form an insulating layer, (3) forming via holes in the insulating layer, (4) forming a conductor layer, and (5) removing the base.

Abstract: To provide a practical infrared transmissive protective cover capable of detecting a heating abnormality of an internal heating element and the like by visual observation and by using infrared rays. The infrared transmissive protective cover includes a light transmission section, the light transmission section is made of a resin sheet containing a resin composition, and a total light transmittance of the light transmission section in a visible light region is 70% or more, and an average infrared transmittance in a wavelength range of 8 to 14 ?m is 5% or more.

Abstract: There is provided a novel and stereoselective method for producing an optically active azetidinone compound. An optically active azetidinone compound of Formula (7) can be produced in a high yield and a high stereoselectivity from a ketone compound of Formula (5), and this method is industrially useful. In formulae, R is a hydrogen atom or a hydroxy protecting group.

Abstract: A method for producing a printed wiring board which is capable of forming an insulating layer having a surface with low roughness and high adhesion strength to a conductive layer and of achieving an excellent performance in removal of smear, involves the following steps (A) to (F) in this order: (A) laminating, onto an internal layer circuit substrate, a resin sheet with a support which includes a support and a resin composition layer in contact with the support so that the resin composition layer is in contact with the internal layer circuit substrate; (B) thermally curing the resin composition layer of the resin sheet with a support to form an insulating layer; (C) perforating the insulating layer to form a via hole; (D) performing a desmear treatment; (E) peeling the support; and (F) forming a conductive layer on a surface of the insulating layer.

Abstract: An image forming apparatus includes a feeder having a longer side direction orthogonal to a conveyance direction of a recording medium, and feeds a maximum size recording medium with a longer side first, an image forming unit having a maximum sheet feed width corresponding to a longer side length of the maximum size recording medium, and prints a toner image onto the recording medium, and a sub feeder that can feed the maximum size recording medium to the image forming unit independently from the feeder. A post processing apparatus receives a printed recording medium and executes post processing on a side of the recording medium. A feeding source of the maximum size recording medium is selected from the feeder and the sub feeder for executing the post processing on the longer and shorter sides of the maximum size recording medium, respectively.

Abstract: Protective film-laminated adhesive sheets which include; an adhesive sheet including a support having first and second surfaces and a resin composition layer in contact with the second surface of the support; and a protective film having first and second surfaces with the second surface of the protective film in contact with the resin composition layer of the adhesive sheet and in which the first surface of the protective film has an arithmetic mean roughness (Rap1) of 100 nm or more, and the second surface of the protective film has an arithmetic mean roughness (Rap2) of 100 nm or more are capable of suppressing a winding displacement when the sheet is wound into a roll and are capable of preventing a resin separation when the protective film is peeled off in an automatic cutter device.

Abstract: A method of and an apparatus for controlling a molten metal surface in a mold that are effective to various disturbances are provided. The method and the apparatus for controlling a molten metal surface level in a mold according to the present invention perform the following operations of: measuring the molten metal surface level in the mold of a continuous-casting machine; changing a reference position of oscillation of the mold based on the difference between a molten metal surface setting value set in advance as a desired value of the molten metal surface and a measured value of the molten metal surface level; and making the reference position of oscillation follow molten metal surface fluctuations.

Abstract: A heat-assisted magnetic recording (HAMR) head gimbal assembly (HGA) protects the associated HAMR heating source from unwanted contact, such as from contact with an adjacent HAMR laser in response to a shock event. The HGA is configured such that the distance between the flexure and the top of a load beam flange is greater than the height of a submount associated with the heating source, and the height of the submount may also be greater than the height of the heating source, thus protecting against contact between adjacent heating sources.

Abstract: A resin composition which is low in a roughness of an insulating layer surface and capable of forming thereon a plated conductor layer having a sufficient peel strength in a wet roughing step and which is excellent in dielectric characteristics and a coefficient of thermal expansion, is disclosed. The resin composition contains a cyanate ester resin and a specified epoxy resin.

Abstract: Multilayer printed wiring boards may be prepared by forming a via hole by laser irradiation in insulating layer formed by a prepreg, comprised of a glass cloth impregnated with a thermosetting resin composition, and subjecting the via hole to a glass etching treatment with a glass etching solution and then to a desmear treatment with an oxidizing agent solution. By such a process, etch back phenomenon and excessive protrusion of glass cloth from the wall surface of a via hole can be sufficiently suppressed, and a highly reliable via can be formed. Particularly, a highly reliable via can be formed in a small via hole having a top diameter of 75 ?m or below.

Abstract: In a heat-assisted magnetic recording (HAMR) hard disk drive, a heat-dissipating head slider assembly is described in which the slider is stepped on the disk-opposing side and a HAMR laser module is mounted on the lower surface to assist with dissipation of heat from the laser. The lower surface is a surface of the main body of the slider and is composed primarily of a first material, and the slider may include a heat-dissipating plate that forms the higher stepped surface, where the plate is composed of a second material that has a higher thermal conductivity than the first material, such as silicon.

Abstract: Multi-layer printed wiring boards may be produced by: (1) conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) forming an insulating layer by thermally curing the prepreg, and (5) detaching the support film after the thermal curing step.

Abstract: Epoxy resin compositions, which comprise (A) en epoxy resin having two or more epoxy groups in a molecule; (B) a phenol type curing agent where an average hydroxyl group content in a molecule (a mean value of (the total number of hydroxyl groups)/(the total number of benzene rings)), P, satisfies the equation 0<P<1; (C) a phenoxy resin; and (D) rubber particles, are suitable for use as an insulating layer of a multi-layered printed board in which, in spite of the fact that the roughness of a roughened surface after a roughening treatment is relatively small, an insulating layer having a good tight adhesion with a conductor layer formed by plating is able to be easily introduced into a multi-layered printed board.