Patents by Inventor Shigeo Nakamura

Shigeo Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150000859
    Abstract: A method of and an apparatus for controlling a molten metal surface in a mold that are effective to various disturbances are provided. The method and the apparatus for controlling a molten metal surface level in a mold according to the present invention perform the following operations of: measuring the molten metal surface level in the mold of a continuous-casting machine; changing a reference position of oscillation of the mold based on the difference between a molten metal surface setting value set in advance as a desired value of the molten metal surface and a measured value of the molten metal surface level; and making the reference position of oscillation follow molten metal surface fluctuations.
    Type: Application
    Filed: October 11, 2012
    Publication date: January 1, 2015
    Applicant: JP STEEL PLANTECH CO.
    Inventors: Takeshi Sekiguchi, Shigeo Nakamura
  • Patent number: 8922942
    Abstract: In a magnetic, disk apparatus, flows around disks are stabilized, flow-induced vibration generated in the disks and a head positioning actuator is reduced, and the positioning accuracy of the head is improved. In a magnetic disk apparatus including plural magnetic disks which are attached to a rotating motor and stacked with a spacer in between and a static structure that surrounds outer circumferences of the magnetic disks, plural current plates supported by the static structure are inserted between a pair of the magnetic disks in a stacking direction of the magnetic disks.
    Type: Grant
    Filed: June 9, 2011
    Date of Patent: December 30, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Takehiko Eguchi, Shigeo Nakamura
  • Patent number: 8912279
    Abstract: Resin compositions which contain an epoxy resin, an alkoxy oligomer, and an inorganic filler provide insulating layers that have a surface with not only low arithmetic mean roughness but also low root mean square roughness in a wet roughening step and that are capable of forming thereon a plated conductive layer having a sufficient peel strength that can be formed while maintaining the glass transition temperature and thermal expansion coefficient.
    Type: Grant
    Filed: November 22, 2013
    Date of Patent: December 16, 2014
    Assignee: Ajinomoto Co., Inc.
    Inventors: Shigeo Nakamura, Kazuhiko Tsurui, Masanori Yoda
  • Patent number: 8747975
    Abstract: A seamless can in which an ink layer is transferred onto a can body thereof by a curved surface printing is provided. The ink layer which has been transferred has an overlapping portion which is formed by mutually overlapping a front-end portion of the ink layer and a rear-end portion of the ink layer in a circumferential direction of the can body. An ink area ratio for at least one of the front-end portion and the rear-end portion is smaller than an ink area ratio of an intermediate portion of the ink layer which is adjacent to and continuous with the overlapping portion and excludes the overlapping portion.
    Type: Grant
    Filed: August 31, 2009
    Date of Patent: June 10, 2014
    Assignee: Toyo Seikan Kaisha, Ltd.
    Inventors: Shigeo Nakamura, Makoto Nakasato
  • Publication number: 20140118964
    Abstract: A method for producing a printed wiring board which is capable of forming an insulating layer having a surface with low roughness and high adhesion strength to a conductive layer and of achieving an excellent performance in removal of smear, involves the following steps (A) to (F) in this order: (A) laminating, onto an internal layer circuit substrate, a resin sheet with a support which includes a support and a resin composition layer in contact with the support so that the resin composition layer is in contact with the internal layer circuit substrate; (B) thermally curing the resin composition layer of the resin sheet with a support to form an insulating layer; (C) perforating the insulating layer to form a via hole; (D) performing a desmear treatment; (E) peeling the support; and (F) forming a conductive layer on a surface of the insulating layer.
    Type: Application
    Filed: October 29, 2013
    Publication date: May 1, 2014
    Applicant: Ajinomoto Co., Inc.
    Inventors: Shigeo Nakamura, Yukinori Morikawa, Tadahiko Yokota
  • Publication number: 20140111883
    Abstract: In a magnetic, disk apparatus, flows around disks are stabilized, flow-induced vibration generated in the disks and a head positioning actuator is reduced, and the positioning accuracy of the head is improved. In a magnetic disk apparatus including plural magnetic disks which are attached to a rotating motor and stacked with a spacer in between and a static structure that surrounds outer circumferences of the magnetic disks, plural current plates supported by the static structure are inserted between a pair of the magnetic disks in a stacking direction of the magnetic disks.
    Type: Application
    Filed: June 9, 2011
    Publication date: April 24, 2014
    Applicant: HITACHI, LTD.
    Inventors: Takehiko Eguchi, Shigeo Nakamura
  • Publication number: 20140102623
    Abstract: Epoxy resin compositions, which comprise (A) en epoxy resin having two or more epoxy groups in a molecule; (B) a phenol type curing agent where an average hydroxyl group content in a molecule (a mean value of (the total number of hydroxyl groups)/(the total number of benzene rings)), P, satisfies the equation 0<P<1; (C) a phenoxy resin; and (D) rubber particles, are suitable for use as an insulating layer of a multi-layered printed board in which, in spite of the fact that the roughness of a roughened surface after a roughening treatment is relatively small, an insulating layer having a good tight adhesion with a conductor layer formed by plating is able to be easily introduced into a multi-layered printed board.
    Type: Application
    Filed: December 20, 2013
    Publication date: April 17, 2014
    Applicant: AJINOMOTO CO., INC.
    Inventors: Kenji KAWAI, Shigeo NAKAMURA
  • Publication number: 20140087152
    Abstract: Resin compositions which contain an epoxy resin, an alkoxy oligomer, and an inorganic filler provide insulating layers that have a surface with not only low arithmetic mean roughness but also low root mean square roughness in a wet roughening step and that are capable of forming thereon a plated conductive layer having a sufficient peel strength that can be formed while maintaining the glass transition temperature and thermal expansion coefficient.
    Type: Application
    Filed: November 22, 2013
    Publication date: March 27, 2014
    Applicant: Ajinomoto Co., Inc.
    Inventors: Shigeo Nakamura, Kazuhiko Tsurui, Masanori Yoda
  • Publication number: 20130329765
    Abstract: To provide a practical infrared transmissive protective cover capable of detecting a heating abnormality of an internal heating element and the like by visual observation and by using infrared rays. The infrared transmissive protective cover includes a light transmission section, the light transmission section is made of a resin sheet containing a resin composition, and a total light transmittance of the light transmission section in a visible light region is 70% or more, and an average infrared transmittance in a wavelength range of 8 to 14 ?m is 5% or more.
    Type: Application
    Filed: December 13, 2011
    Publication date: December 12, 2013
    Applicants: THE JAPAN ATOMIC POWER COMPANY, THERMOGRAPHERS CO., LTD., ASAHI KASEI ENGINEERING CORPORATION, ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Tsuyoshi Nishikawa, Shigeo Nakamura, Kazuhiro Yonezawa, Hidenobu Takeyama, Hisakazu Higasa, Akihiro Hirashima, Tetsushi Matsunaga
  • Publication number: 20130319749
    Abstract: Multilayer printed wiring boards may be prepared by forming a via hole by laser irradiation in insulating layer formed by a prepreg, comprised of a glass cloth impregnated with a thermosetting resin composition, and subjecting the via hole to a glass etching treatment with a glass etching solution and then to a desmear treatment with an oxidizing agent solution. By such a process, etch back phenomenon and excessive protrusion of glass cloth from the wall surface of a via hole can be sufficiently suppressed, and a highly reliable via can be formed. Particularly, a highly reliable via can be formed in a small via hole having a top diameter of 75 ?m or below.
    Type: Application
    Filed: August 7, 2013
    Publication date: December 5, 2013
    Applicants: SHINKO ELECTRIC INDUSTRIES CO., LTD., AJINOMOTO CO., INC.
    Inventors: Seiichiro OHASHI, Eiichi Hayashi, Shigeo Nakamura, Takaaki Yazawa, Junichi Nakamura
  • Patent number: 8584352
    Abstract: Multilayer printed wiring boards superior in formation of an ultrafine wiring, which can form a conductive layer superior in peel strength on a flat insulating layer surface, can be prepared by a method including the following steps (A)-(E): (A) a step of laminating a film with a metal film, wherein a metal film layer is formed on a support layer, on an internal-layer circuit substrate via a curable resin composition layer, or laminating an adhesive film with a metal film, wherein a curable resin composition layer is formed on a metal film layer of the film with a metal film, on an internal-layer circuit substrate; (B) a step of curing a curable resin composition layer to form an insulating layer; (C) a step of removing a support layer; (D) a step of removing a metal film layer; and (E) a step of forming a metal film layer on an insulating layer surface by electroless plating.
    Type: Grant
    Filed: August 27, 2010
    Date of Patent: November 19, 2013
    Assignee: Ajinomoto Co., Inc.
    Inventors: Hirohisa Narahashi, Shigeo Nakamura, Tadahiko Yokota
  • Patent number: 8576516
    Abstract: A magnetic disc apparatus includes a micro actuator for two-stage actuator having a first stage and a second stage, and a slider mounted to the miro actuator and having a head element to perform recording and reproduction into/from a magnetic disc. A thermal actuator and a spring part are provided on a table, on which the slider is put. The thermal actuator is connected to the slider, and the thermal actuator includes a V-shaped thin film resistance.
    Type: Grant
    Filed: May 11, 2011
    Date of Patent: November 5, 2013
    Assignee: Hitachi, Ltd.
    Inventors: Seong-Hun Choe, Shigeo Nakamura
  • Patent number: 8544841
    Abstract: In a sheet discharge roller, a transportation roller includes a roller portion formed integrally on a rotation shaft, and an annular elastic member attached to a surface of the roller portion, each of rigidity increasing portions includes a plurality of plate members axially spaced from each other by a predetermined distance, and the plurality of plate members have forms each obtained by circumferentially dividing a circular plate, respectively, are arranged in positions circumferentially shifted from each other, respectively, and thereby exhibit an outer periphery of a substantially circular form when viewed in the axial direction.
    Type: Grant
    Filed: May 23, 2011
    Date of Patent: October 1, 2013
    Assignee: Konica Minolta Business Technologies, Inc.
    Inventor: Shigeo Nakamura
  • Patent number: 8533942
    Abstract: Multilayer printed wiring boards may be prepared by forming a via hole by laser irradiation in insulating layer formed by a prepreg, comprised of a glass cloth impregnated with a thermosetting resin composition, and subjecting the via hole to a glass etching treatment with a glass etching solution and then to a desmear treatment with an oxidizing agent solution. By such a process, etch back phenomenon and excessive protrusion of glass cloth from the wall surface of a via hole can be sufficiently suppressed, and a highly reliable via can be formed. Particularly, a highly reliable via can be formed in a small via hole having a top diameter of 75 ?m or below.
    Type: Grant
    Filed: November 21, 2008
    Date of Patent: September 17, 2013
    Assignees: Ajinomoto Co., Inc., Shinko Electric Industries Co., Ltd.
    Inventors: Seiichiro Ohashi, Eiichi Hayashi, Shigeo Nakamura, Takaaki Yazawa, Junichi Nakamura
  • Patent number: 8493692
    Abstract: A magnetic head-positioning system to accurately test a magnetic disk and a magnetic head, comprises a plurality of hinges attached on an end portion of a linear driving element and disposed on both sides of a center line of the linear driving element, which is in parallel with an extension-shrinkage direction of the linear driving element, and an arm having a length longer than a distance between a plurality of hinge joint portions, the plurality of the hinge joint portions each of which join the hinge with a root portion of the arm and which are disposed on both sides of a center line of the arm which is in parallel with a longitudinal direction of the arm. The arm has an extremity portion on which a head gimbal assembly is detachably attached and this head gimbal assembly is positioned.
    Type: Grant
    Filed: February 18, 2010
    Date of Patent: July 23, 2013
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Shigeo Nakamura, Yasuhiro Matsuda, Toshinori Sugiyama
  • Patent number: 8479991
    Abstract: There is provided an illumination setting support apparatus that enables a user to easily set an optimal lighting pattern while visually checking. A schematic diagram of the illumination unit is displayed in the setting screen, so that clicking on a desired area inside this schematic diagram allows the arbitrary area to be selected from eight areas in the circumferential row of the “outermost circumference” of the external illumination unit. Lighting pattern information is transmitted to a bar code reader and is transferred to the external illumination unit. Imaging is performed while executing illumination control in accordance with the lighting pattern to thereby immediately display a live image on a PC.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: July 9, 2013
    Assignee: Keyence Corporation
    Inventors: Shigeo Nakamura, Hajime Matsuda
  • Publication number: 20130067742
    Abstract: Multi-layer printed wiring boards may be produced by: (1) conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) forming an insulating layer by thermally curing the prepreg, and (5) detaching the support film after the thermal curing step.
    Type: Application
    Filed: September 14, 2012
    Publication date: March 21, 2013
    Applicant: AJINOMOTO CO., INC.
    Inventors: Shigeo NAKAMURA, Seiichiro OHASHI, Eiichi Hayashi, Tadahiko Yokota
  • Patent number: 8382996
    Abstract: Metal-clad laminates in which a conductor layer having superior peel strength is formed on a smooth surface of an insulating layer can be obtained by a method comprising (A) a step of preparing a metal-clad laminate precursor by providing one or more sheets of prepreg between two sheets of film having a metal film layer on a support layer, and heating and pressing them under reduced pressure, (B) a step of removing the support layer, (C) a step of removing the metal film layer, and (D) a step of forming a metal film layer on the surface of an insulating layer by electroless plating.
    Type: Grant
    Filed: March 12, 2010
    Date of Patent: February 26, 2013
    Assignee: Ajinomoto Co., Inc.
    Inventors: Hirohisa Narahashi, Shigeo Nakamura, Tadahiko Yokota
  • Patent number: 8377345
    Abstract: A method of manufacturing an optical member by mixing isocyanate terminal prepolymer component (A) and aromatic diamine component (B), and immediately after mixing, casting a mixture into a casting mold to obtain a molded article. A method of manufacturing a plastic lens by mixing said components (A) and (B), immediately after mixing, casting a mixture into a casting mold and polymerizing it to obtain a molded article. A gasket for molding plastic lenses comprised of a cylindrical member. A casting mold for molding plastic lenses using this gasket and a monomer casting jig.
    Type: Grant
    Filed: January 27, 2010
    Date of Patent: February 19, 2013
    Assignee: Hoya Corporation
    Inventors: Masanori Kadota, Shigeo Nakamura, Kengo Hirayama, Yoshitaka Kitahara, Yuji Hoshi, Yasuhisa Okamoto
  • Patent number: 8357443
    Abstract: Producing a circuit board, by laminating, on a substrate, an adhesive film with a metal film, which comprises a water-soluble polymer release layer, a metal film layer and a curable resin composition layer, which are formed in this order on a support layer, and has a release property enabling detachment of said water-soluble polymer release layer from the support layer after curing of the curable resin composition layer, such that the curable resin composition layer contacts the substrate; curing the curable resin composition layer; detaching the support layer, and removing the water-soluble polymer release layer present on the metal film layer by dissolving the release layer in an aqueous solution, efficiently forms an insulating layer and a metal film layer superior in adhesiveness to the insulating layer and in uniformity.
    Type: Grant
    Filed: September 1, 2009
    Date of Patent: January 22, 2013
    Assignee: Ajinomoto Co., Inc.
    Inventors: Hirohisa Narahashi, Shigeo Nakamura, Tadahiko Yokota