Abstract: A layout-data generation equipment includes a logic circuit designing section which designs a logic circuit based on information of the specifications of a semiconductor integrated circuit, a layout-data generation section which creates layout-data based on the logic circuit, a resistance information extraction section which extracts resistance information of a wire from the layout-data, a circuit simulation execution section which executes a circuit simulation, an identification section of current direction which identifies a direction of a current in the wire based on the resistance information of a wire and an execution result of the circuit simulation, a verification section which verifies whether layout-data of the wire breaks a design rule, the design rule being extracted from the information of the specifications of a semiconductor integrated circuit and the verification section generates this verification result, and a data output section which outputs the layout-data.

Abstract: A semiconductor device according to the present invention includes a substrate including a plurality of first pads thereon; at least one semiconductor chip including a plurality of second pads; and at least one wiring chip including a plurality of third pads. A part of the plurality of second pads of the semiconductor chip is electrically connected to a part of the plurality of third pads of the wiring chip, and another part of the plurality of third pads of the wiring chip is electrically connected to a part of the plurality of first pads of the substrate.

Abstract: The verification equipment of a semiconductor integrated circuit in the present invention is included with a circuit net list extraction section that extracts the net list of a circuit, a circuit simulation execution section that executes a circuit simulation, based on the extracted net list, a finite impedance judgment section that judges existence or nonexistence of finite impedances, a floating error terminal judgment section that judges existence or nonexistence of floating error terminals by measuring finite impedances, a true floating error terminal judgment section that adds any one of a P channel-type transistor and an N channel-type transistor to terminals of the circuit where it is judged that there are floating error terminals and calculates changes in potential at the terminals and adds the other of the P channel-type transistor and the N channel-type transistor to the terminals and calculates changes in potential at the terminals, and an output section that outputs a judgment result of the floati

Abstract: A nonvolatile semiconductor memory device having a first memory cell array including a plurality of electrical reprogramming and erasable nonvolatile semiconductor memory cells formed in a first area of a semiconductor substrate, a second memory cell array including a plurality of electrical reprogramming and erasable nonvolatile semiconductor memory cells formed in a second area different from said first area of said semiconductor substrate, said first and second memory cell arrays being arranged in a first direction, and a first pad section for inputting data to and outputting data from said first memory cell array and said second memory cell array, said first pad section having a plurality of pads arranged between said first memory cell array and said second memory cell array along a second direction perpendicular to said first direction.

Abstract: In an FCRAM having a late write function, when a first command signal indicates “write active”, whether a write operation or an auto-refresh operation is to be performed is determined on the basis of a second command signal. For example, when the second command signal indicates “write”, a write operation for a memory cell is performed by a late write scheme. When the second command signal indicates “auto-refresh”, an auto-refresh operation is performed. In the last write cycle of a write operation immediately preceding this auto-refresh operation, addresses for selecting a memory cell as an object of auto-refresh are predetermined. After data write to a memory cell is completed in the last write cycle, row precharge for auto-refresh is performed. After that, an auto-refresh operation (i.e., a data read operation and a data restore operation) is performed for the selected memory cell.

Abstract: An input data register for latching write data is arranged in a position near a memory cell array of a memory core section. The input data register is arranged on the upstream side of a data path used for writing data into a memory cell. Write data input to a data pin which is arranged in the end position on the downstream side is latched in the input data register via a data input buffer, serial/parallel converting circuit and write data line. Data latched in the input data register is written into a memory cell via a DQ write driver, data line pair, I/O gate and bit line pair in a next write cycle.

Abstract: A synchronous semiconductor memory device includes a plurality of memory banks which read data from memory cells and write data into the memory cells, a command decoder circuit which receives a command, detects whether the command is a read command or a write command, and, when detecting a read command or a write command, outputs a first control signal that enables a read operation or a write operation in the plurality of memory banks, bank select circuits which activate a second control signal to activate each of the memory banks, and bank timer circuits which deactivate the activated second control signal and perform control in such a manner that the timing with which the second control signal is deactivated in a test mode differs from that in a normal mode.

Abstract: A synchronous semiconductor memory device includes a memory cell array and a command decoder. In the memory cell array, dynamic memory cells are arranged in a matrix form. The command decoder decodes a plurality of commands in synchronism with an external clock signal. The plurality of commands are set by combinations of logical levels of a plurality of control pins at input timing of a first command and at input timing of a second command one cycle after the input timing of the first command. The command decoder includes a first decode section which determines a read operation, a second decode section which determines a write operation, and a third decode section which determines an auto-refresh operation. Setting of an auto-refresh command is determined only by a combination of the logical levels of the plurality of control pins at the input timing of the first command.

Abstract: In the package, a semiconductor chip is accommodated. This semiconductor chip has n pads (n is a natural number). The package has n pins connected to n pads.

Abstract: In an FCRAM having a late write function, when a first command signal indicates “write active”, whether a write operation or an auto-refresh operation is to be performed is determined on the basis of a second command signal. For example, when the second command signal indicates “write”, a write operation for a memory cell is performed by a late write scheme. When the second command signal indicates “auto-refresh”, an auto-refresh operation is performed. In the last write cycle of a write operation immediately preceding this auto-refresh operation, addresses for selecting a memory cell as an object of auto-refresh are predetermined. After data write to a memory cell is completed in the last write cycle, row precharge for auto-refresh is performed. After that, an auto-refresh operation (i.e., a data read operation and a data restore operation) is performed for the selected memory cell.

Abstract: An input data register for latching write data is arranged in a position near a memory cell array of a memory core section. The input data register is arranged on the upstream side of a data path used for writing data into a memory cell. Write data input to a data pin which is arranged in the end position on the downstream side is latched in the input data register via a data input buffer, serial/parallel converting circuit and write data line. Data latched in the input data register is written into a memory cell via a DQ write driver, data line pair, I/O gate and bit line pair in a next write cycle.

Abstract: In an FCRAM having a late write function, when a first command signal indicates “write active”, whether a write operation or an auto-refresh operation is to be performed is determined on the basis of a second command signal. For example, when the second command signal indicates “write”, a write operation for a memory cell is performed by a late write scheme. When the second command signal indicates “auto-refresh”, an auto-refresh operation is performed. In the last write cycle of a write operation immediately preceding this auto-refresh operation, addresses for selecting a memory cell as an object of auto-refresh are predetermined. After data write to a memory cell is completed in the last write cycle, row precharge for auto-refresh is performed. After that, an auto-refresh operation (i.e., a data read operation and a data restore operation) is performed for the selected memory cell.

Abstract: An input data register for latching write data is arranged in a position near a memory cell array of a memory core section. The input data register is arranged on the upstream side of a data path used for writing data into a memory cell. Write data input to a data pin which is arranged in the end position on the downstream side is latched in the input data register via a data input buffer, serial/parallel converting circuit and write data line. Data latched in the input data register is written into a memory cell via a DQ write driver, data line pair, I/O gate and bit line pair in a next write cycle.

Abstract: A semiconductor integrated circuit, comprising: a first output driving part which outputs a data signal in sync with a reference clock signal; a second output driving part which outputs a data strobe signal prescribing a timing of said data signal; and a driving control part which separately controls driving ability of said first and second output driving parts.

Abstract: A synchronous type semiconductor device which inputs/outputs data with respect to a host includes a memory circuit, command decoder and CAS latency setting circuit. The command decoder decodes a command control signal input from the host in synchronism with a clock input from the host and outputs the decoded command to the memory circuit. The command includes a read command and mode register set command. The CAS latency setting circuit sets CAS latency in a read cycle based on a predetermined command output from the command decoder and a function control signal input from the host. The predetermined command is a command other than the mode register set command.

Abstract: A semiconductor memory has a memory cell array, a command decoder, and an input/output control circuit. The memory cell array has a plurality of memory cells which store data. The command decoder decodes a command input from outside. The input/output control circuit controls writing of data into the memory cell and an output of the data to the outside, in accordance with an output of the command decoder. If a write command is input in the command decoder, write data received from outside is written in the memory cell when two write commands are input in the command decoder subsequent to the write command.

Abstract: A synchronous semiconductor memory device has a memory section which includes a memory cell array having a plurality of memory cells and which is capable of a read operation of reading information from the memory cells according to a read command and a write operation of writing information into the memory cells according to a write command. The synchronous semiconductor memory device further has a command sensing circuit which senses whether a first command inputted in synchronization with an external clock signal is the read command or the write command. The synchronous semiconductor memory device further has a bank timer circuit which, when the command sensing circuit has sensed either the read command or the write command, sets the end time of the restore operation of a row address strobe (RAS) and the start time of the precharge operation of the RAS according to the external clock signal.

Abstract: A synchronous semiconductor memory device includes a memory cell array and a command decoder. In the memory cell array, dynamic memory cells are arranged in a matrix form. The command decoder decodes a plurality of commands in synchronism with an external clock signal. The plurality of commands are set by combinations of logical levels of a plurality of control pins at input timing of a first command and at input timing of a second command one cycle after the input timing of the first command. The command decoder includes a first decode section which determines a read operation, a second decode section which determines a write operation, and a third decode section which determines an auto-refresh operation. Setting of an auto-refresh command is determined only by a combination of the logical levels of the plurality of control pins at the input timing of the first command.

Abstract: A synchronous type semiconductor device which inputs/outputs data with respect to a host includes a memory circuit, command decoder and CAS latency setting circuit. The command decoder decodes a command control signal input from the host in synchronism with a clock input from the host and outputs the decoded command to the memory circuit. The command includes a read command and mode register set command. The CAS latency setting circuit sets CAS latency in a read cycle based on a predetermined command output from the command decoder and a function control signal input from the host. The predetermined command is a command other than the mode register set command.

Abstract: An input data register for latching write data is arranged in a position near a memory cell array of a memory core section. The input data register is arranged on the upstream side of a data path used for writing data into a memory cell. Write data input to a data pin which is arranged in the end position on the downstream side is latched in the input data register via a data input buffer, serial/parallel converting circuit and write data line. Data latched in the input data register is written into a memory cell via a DQ write driver, data line pair, I/O gate and bit line pair in a next write cycle.