Patents by Inventor Shigeto Akahori

Shigeto Akahori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240046720
    Abstract: A vehicle-mounted information processing apparatus is mounted in a vehicle and includes: a plurality of processing units configured to execute processing in parallel; and a plurality of shared storage units that are accessible by the plurality of processing units, wherein the plurality of processing units exchange information via at least one of the shared storage units and change the at least one of the shared storage units used to exchange information, at predetermined timing. A detection unit configured to detect an abnormality for the shared storage units is also provided. The predetermined timing is the timing at which the detection unit has detected an abnormality occurred at the at least one of the shared storage units. When the detection unit has detected an abnormality occurred at the at least one of the shared storage units, the plurality of processing units may exchange information via a different shared storage unit.
    Type: Application
    Filed: November 11, 2021
    Publication date: February 8, 2024
    Inventors: Takayuki SHIOZAWA, Norihiro ONO, Shigeto AKAHORI
  • Patent number: 11859862
    Abstract: A dry space creation system includes a hollow treatment tank configured to house a material to be treated, an inflatable balloon member having a balloon shape configured to be inflated and deflated by supply and exhaust of air, the inflatable balloon member being provided inside the treatment tank, and being configured to be inflated while leaving a partial area in the treatment tank, a dry air supply unit configured to supply dry air into the area, and an inflation air supply unit configured to supply air into the inflatable balloon member.
    Type: Grant
    Filed: February 25, 2022
    Date of Patent: January 2, 2024
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Satonori Iura, Satoshi Yonezawa, Satoshi Aoki, Shigeto Akahori, Shuga Ikeda, Yui Kinoshita, Masaki Kunigami
  • Publication number: 20230313334
    Abstract: An active material separation device according to an embodiment of the present invention is an active material separation device configured to separate an active material from a battery member, which includes a container, a base member disposed in the container and configured to support the battery member, and a nozzle disposed above the container and configured to inject a liquid with respect to the battery member, and the nozzle injects the liquid in a state in which a position of an upper surface of the battery member is lower than a position of a liquid surface of the liquid.
    Type: Application
    Filed: March 28, 2023
    Publication date: October 5, 2023
    Inventors: Masafumi Saito, Shigeto Akahori
  • Publication number: 20220290875
    Abstract: A dry space creation system includes a hollow treatment tank configured to house a material to be treated, an inflatable balloon member having a balloon shape configured to be inflated and deflated by supply and exhaust of air, the inflatable balloon member being provided inside the treatment tank, and being configured to be inflated while leaving a partial area in the treatment tank, a dry air supply unit configured to supply dry air into the area, and an inflation air supply unit configured to supply air into the inflatable balloon member.
    Type: Application
    Filed: February 25, 2022
    Publication date: September 15, 2022
    Inventors: Satonori IURA, Satoshi YONEZAWA, Satoshi AOKI, Shigeto AKAHORI, Shuga IKEDA, Yui KINOSHITA, Masaki KUNIGAMI
  • Patent number: 11161310
    Abstract: This heat-caulking device is inserted into one or more holes penetrating a main plate having a substantially conical hollow portion, whereby one or more bosses of a blade protruding from an inner peripheral surface of the main plate toward the hollow portion are melted so as to join the main plate and the blade. A heat chip of the heat-caulking device has a substantially conical hollow main body portion, an outer peripheral surface of which conforms to the inner peripheral surface of the main plate. On the outer peripheral surface of the main body portion, a convex portion protruding toward the vicinity of the holes of the inner peripheral surface of the main plate is provided.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: November 2, 2021
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Hiroshi Ishikawa, Yoshinori Tsurugai, Yuichi Tajiri, Shigeto Akahori, Naohiro Ohtsu, Satoshi Shiozaki, Shinzo Urushidani
  • Publication number: 20210107234
    Abstract: This heat-caulking device is inserted into one or more holes penetrating a main plate having a substantially conical hollow portion, whereby one or more bosses of a blade protruding from an inner peripheral surface of the main plate toward the hollow portion are melted so as to join the main plate and the blade. A heat chip of the heat-caulking device has a substantially conical hollow main body portion, an outer peripheral surface of which conforms to the inner peripheral surface of the main plate. On the outer peripheral surface of the main body portion, a convex portion protruding toward the vicinity of the holes of the inner peripheral surface of the main plate is provided.
    Type: Application
    Filed: March 30, 2018
    Publication date: April 15, 2021
    Inventors: Hiroshi Ishikawa, Yoshinori Tsurugai, Yuichi Tajiri, Shigeto Akahori, Naohiro Ohtsu, Satoshi Shiozaki, Shinzo Urushidani
  • Patent number: 10864683
    Abstract: Provided is a thermal caulking method of melting, at one time, a plurality of bosses 33 of a second member 30 protruding toward an inner circumferential surface of a conical hollow portion 11 of a first member 10 while being fitted to a plurality of holes 132 provided in the inner circumferential surface of the hollow portion 11 of the first member 10 having the substantially conical hollow portion 11 so that the plurality of bosses are joined to the first member 10, in which the plurality of bosses 33 are melted at one time by using a heat chip 51 having a continuous shape in the circumferential direction of the hollow portion 11 along the inner circumferential surface and are joined to the first member 10 while the adjacent melted bosses 33 are connected to each other.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: December 15, 2020
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Yoshinori Tsurugai, Hiroshi Ishikawa, Shigeto Akahori
  • Patent number: 10605594
    Abstract: An electrolyte membrane thickness measurement apparatus includes a detecting medium supplying portion configured to emit a detecting medium, a detecting portion configured to detect a metal catalyst, and an analyzing unit. A thickness direction profile of a detection signal is generated by the detecting portion, and first and second inflection points are determined in the thickness direction profile based on the intensity of the detection signal by the analyzing unit. The distance between the first and second inflection points is evaluated as the thickness of the electrolyte membrane by the analyzing unit.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: March 31, 2020
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Shigeto Akahori, Shohei Yoshida, Satoshi Hasegawa, Tomoko Tamai, Mai Yokoi
  • Patent number: 10569454
    Abstract: Provided is a method for manufacturing an impeller composed of a frustum-shaped hub (11) and a plurality of blades provided on a peripheral surface (12) of the hub (11) at predetermined intervals in a circumferential direction and inclined in one direction. The method for manufacturing the impeller comprises: an injection-molding step of injection-molding a molding article (10a) in which the blades are connected to the periphery of the hub (11) via fragile connection parts (16) so as to spread outward; a blade rotationally moving step of rotationally moving the blades (13) to the peripheral surface (12) of the hub (11) about the connection parts (16); and a fixation step of fixing ends of the blades (13) to the hub (11).
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: February 25, 2020
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Hiroshi Ishikawa, Shigeto Akahori, Yoshinori Tsurugai
  • Patent number: 10369749
    Abstract: The first electrode section (7a) and the second electrode section (7b) are formed such that the outer portion connected to the upper portion of the heating section (6) is thinner than the inner portion connected to the lower portion of the heating section (6). The heating section (6) and the first electrode section (7a) are interconnected by an R-shaped first connecting portion (21). The inner circumferential sloping surface of the heating section (6) and the second electrode section (7b) are interconnected by an R-shaped second connecting portion (22). The first and second connecting portions (21)(22) are formed such that R becomes larger from the upper end to the lower end, where the upper portion is thin and the lower portion is thick. The thickness of an intermediate portion (6b) is smaller than the thicknesses of the first and second connecting portions (21)(22).
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: August 6, 2019
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Yoshinori Tsurugai, Hiroshi Ishikawa, Yuichi Tajiri, Shigeto Akahori, Naohiro Ohtsu, Satoshi Shiozaki
  • Publication number: 20190101386
    Abstract: An electrolyte membrane thickness measurement apparatus includes a detecting medium supplying portion configured to emit a detecting medium, a detecting portion configured to detect a metal catalyst, and an analyzing unit. A thickness direction profile of a detection signal is generated by the detecting portion, and first and second inflection points are determined in the thickness direction profile based on the intensity of the detection signal by the analyzing unit. The distance between the first and second inflection points is evaluated as the thickness of the electrolyte membrane by the analyzing unit.
    Type: Application
    Filed: September 26, 2018
    Publication date: April 4, 2019
    Inventors: Shigeto Akahori, Shohei Yoshida, Satoshi Hasegawa, Tomoko Tamai, Mai Yokoi
  • Publication number: 20190084248
    Abstract: Provided is a thermal caulking method of melting, at one time, a plurality of bosses 33 of a second member 30 protruding toward an inner circumferential surface of a conical hollow portion 11 of a first member 10 while being fitted to a plurality of holes 132 provided in the inner circumferential surface of the hollow portion 11 of the first member 10 having the substantially conical hollow portion 11 so that the plurality of bosses are joined to the first member 10, in which the plurality of bosses 33 are melted at one time by using a heat chip 51 having a continuous shape in the circumferential direction of the hollow portion 11 along the inner circumferential surface and are joined to the first member 10 while the adjacent melted bosses 33 are connected to each other.
    Type: Application
    Filed: September 16, 2016
    Publication date: March 21, 2019
    Inventors: Yoshinori Tsurugai, Hiroshi Ishikawa, Shigeto Akahori
  • Publication number: 20190022954
    Abstract: The first electrode section (7a) and the second electrode section (7b) are formed such that the outer portion connected to the upper portion of the heating section (6) is thinner than the inner portion connected to the lower portion of the heating section (6). The heating section (6) and the first electrode section (7a) are interconnected by an R-shaped first connecting portion (21). The inner circumferential sloping surface of the heating section (6) and the second electrode section (7b) are interconnected by an R-shaped second connecting portion (22). The first and second connecting portions (21)(22) are formed such that R becomes larger from the upper end to the lower end, where the upper portion is thin and the lower portion is thick. The thickness of an intermediate portion (6b) is smaller than the thicknesses of the first and second connecting portions (21)(22).
    Type: Application
    Filed: July 12, 2018
    Publication date: January 24, 2019
    Inventors: Yoshinori Tsurugai, Hiroshi Ishikawa, Yuichi Tajiri, Shigeto Akahori, Naohiro Ohtsu, Satoshi Shiozaki
  • Publication number: 20180243955
    Abstract: Provided is a method for manufacturing an impeller composed of a frustum-shaped hub (11) and a plurality of blades provided on a peripheral surface (12) of the hub (11) at predetermined intervals in a circumferential direction and inclined in one direction. The method for manufacturing the impeller comprises: an injection-molding step of injection-molding a molding article (10a) in which the blades are connected to the periphery of the hub (11) via fragile connection parts (16) so as to spread outward; a blade rotationally moving step of rotationally moving the blades (13) to the peripheral surface (12) of the hub (11) about the connection parts (16); and a fixation step of fixing ends of the blades (13) to the hub (11).
    Type: Application
    Filed: January 13, 2016
    Publication date: August 30, 2018
    Inventors: Hiroshi Ishikawa, Shigeto Akahori, Yoshinori Tsurugai
  • Patent number: 9753083
    Abstract: A parallelism adjusting device and a parallelism adjusting method capable of adjusting the parallelism between the surface of a semiconductor and the surface of an electrode by reducing the load on the semiconductor and capable of shortening the cycle time by increasing the operating speed. A probe device of adjusting the parallelism between the surface and the surface of a contact body that is in contact with the surface to press the surface and apply a current is configured to include a pressing body assembly that presses the contact body with a predetermined pressing force until the surface and the surface come into contact with each other to adjust the parallelism and, after that, presses the contact body with a pressing force that is stronger than the predetermined pressing force.
    Type: Grant
    Filed: May 5, 2014
    Date of Patent: September 5, 2017
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Shigeto Akahori, Nobuo Kambara
  • Patent number: 9664727
    Abstract: An electric current application method for applying electric current to a power semiconductor 100 having a first signal pin contact region 102 that conducts a first electric current, and a contacting body contact region 101 that electrically connects with the first signal pin contact region 102 and conducts a second electric current, includes a Step S1 of contacting a first signal pin 32 of a probe device 1 to the first signal pin contact region 102 so as to eliminate residual electricity remaining in the first signal pin contact region 102 and contacting body contact region 101; and Steps S3 and S4 of contacting a contacting part 21 of the contacting body 2 of the probe device 1 to the contacting body contact region 101, and conducting the first electric current and second electric current, after Step S1.
    Type: Grant
    Filed: May 6, 2014
    Date of Patent: May 30, 2017
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Shigeto Akahori, Nobuo Kambara
  • Patent number: 9632110
    Abstract: A semiconductor inspection device (1) equipped with a contacting unit (7) having a contacting side surface (7a) electrically contacting a semiconductor element (3), and which inspects the semiconductor element (3) by making the contacting unit (7) electrically contact the semiconductor element (3). The contacting side surface (7a) is provided with a plurality of projecting units (13), and the semiconductor element inspection device (1) is equipped with a hitting mark detecting unit (11) configured to detect hitting marks of the projecting unit (13) transferred to the semiconductor element (3) when the contacting side surface (7a) contacts the semiconductor element (3), and a control unit (17) configured to determine whether or not an inspection of the semiconductor element (3) is performed appropriately, on the basis of the hitting marks detected by the hitting mark detecting unit (11).
    Type: Grant
    Filed: August 14, 2013
    Date of Patent: April 25, 2017
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Shigeto Akahori, Shinyu Hirayama, Hiroyuki Yamagishi, Yoko Yamaji
  • Patent number: 9541577
    Abstract: Provided is a current application device capable of applying a test current of a magnitude necessary for testing of a semiconductor element without any trouble. A current application device 1 is configured to have a contacting section having a plurality of projections 21 for contacting a contact region 24 inside an active region 23 of a semiconductor element 22 and applying the test current thereto, and a pressing section 3 which presses the contacting section 2 against the semiconductor element 22 such that each projection 21 contacts the contact region 24. A plurality of the projections 21 are arranged such that an arrangement density of outside projections 21 is larger than the arrangement density of inside projections 21.
    Type: Grant
    Filed: January 6, 2014
    Date of Patent: January 10, 2017
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Satoshi Hasegawa, Shigeto Akahori, Shinya Maita, Hitoshi Saito, Yoko Yamaji
  • Patent number: 9417264
    Abstract: Provided are a current application device capable of improving the electrical contact between projections of a contact section and a surface electrode when applying a test current to a semiconductor element, and a method of manufacturing a semiconductor element properly tested by using the current application device. The current application device includes a contact section that has a plurality of projections, which are brought into contact with a surface electrode of a semiconductor element to apply a test current, and a pressing section that presses the contact section against the semiconductor element such that the projections penetrate a film to come in contact with the surface electrode. The contact section has a plurality of the projections on a plane that has been formed in a curved shape, and the curved-shaped plane is deformed into a planar shape by being pressed by the pressing section.
    Type: Grant
    Filed: January 5, 2015
    Date of Patent: August 16, 2016
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Shigeto Akahori, Hitoshi Saito, Hiroyuki Yamagishi, Shinyu Hirayama, Satoshi Hasegawa, Yoko Yamaji, Koichiro Sato, Machie Saitou
  • Patent number: 9322845
    Abstract: A current applying device in which a contact electrode is destroyed firstly when a large current is applied in the event of failure. A probe device is configured by serially connecting a contact body that is to be in contact with the surface of a power semiconductor to apply a current and a pressing body assembly that presses the contact body so as to apply the current to the power semiconductor and is configured so that, when the pressing body power applied to the pressing body assembly is smaller than the withstand power of the pressing body assembly, the contact body power applied to the contact body is larger than the withstand power of the contact.
    Type: Grant
    Filed: May 5, 2014
    Date of Patent: April 26, 2016
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Shigeto Akahori, Nobuo Kambara