Abstract: A ferrite material is disclosed, consisting of an oxide metal composition, the metal composition having the formula of FeaNibZncCod, where: a+b+c+d=3.0; 2.1?a?2.7; 0?b?0.4; 0?c?0.4; and 0.1?d?0.5. A ferrite film is made of the ferrite material. Preferably, the ferrite film is formed by a ferrite plating method to have a thickness of 30 ?m or less and an aspect ratio of 30 or more. The ferrite film is arranged or provided in the vicinity of an antenna conductor of a radio frequency identification tag. The ferrite film may be in direct contact with the antenna conductor.

Abstract: A device with a coil antenna is disclosed. The coil antenna defines an aperture. The device further comprises a magnetic flux guide adapted to guide magnetic fluxes so that the guided magnetic fluxes pass through the aperture of the coil antenna. For example, the magnetic flux guide is made of a sheet-shaped magnetic material such as a complex magnetic sheet, which comprises soft magnetic powder particles and a binder agent binding them.

Abstract: A ferrite film is formed by regularly arranging constituents such as magnetized grains or one analogous to that. In the ferrite film, the constituents have at least one of the uniaxial anisotropy and the multiaxial anisotropy. The ferrite film has the magnetic anisotropy or the magnetic isotropy. The ferrite film is formed by the use of the plating method in the presence of a magnetic field. Furthermore, an electromagnetic noise suppressor includes the ferrite film.

Abstract: A ferrite film is formed by regularly arranging constituents such as magnetized grains or one analogous to that. In the ferrite film, the constituents have at least one of the uniaxial anisotropy and the multiaxial anisotropy. The ferrite film has the magnetic anisotropy or the magnetic isotropy. The ferrite film is formed by the use of the plating method in the presence of a magnetic field. Furthermore, an electromagnetic noise suppressor includes the ferrite film.

Abstract: In a semiconductor bare chip (57) on the front surface whereof is formed an integrated circuit, a magnetic loss film 55 is formed on the back surface of that semiconductor bare chip.

Abstract: A composite magnetic material is provided for use as an electromagnetic interference suppressing body for effectively suppressing an electromagnetic interference within a high frequency apparatus including a mobile communication terminal. The composite magnetic material consists essentially of a soft magnetic powder and an organic binder and is electrically non-conductive and has at least two magnetic resonances caused by at least two anisotropic magnetic fields (Hk). In the composite magnetic material, the anisotropic magnetic fields (Hk) are different in strength from each other.

Abstract: In a composite magnetic body comprising soft magnetic powder dispersed in an organic binding agent and having an electromagnetic interference suppressing effect, powder excellent in thermal conductivity is further dispersed into the organic binding agent so as to provide a composite magnetic body excellent in thermal conductivity. This composite magnetic body may also be used as a heat dissipation sheet for an electronic device. Further, it may also constitute a heat sink having an electromagnetic interference suppressing effect. As the organic binding agent, thermoplastic polyimide or liquid crystal polymer can be cited. As the powder excellent in thermal conductivity, Al2O3, AlN, cubic BN, insulating SiC or a heat conductive reinforcement (capton) can be cited.

Abstract: An electromagnetic noise absorbing thin film has a structure including an inorganic insulating matrix made of oxie, nitride, fluoride, or a mixture thereof and columnar-structured particles made of a pure metal of Fe, Co, or Ni or an alloy containing at least 20 weight % of Fe, Co, or Ni and buried in an inorganic insulating matrix.

Abstract: In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) (17) operates at a high speed in using at a high frequency band, and a predetermined number of terminals (19) are provided with a high frequency current suppressor (21) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor (21) is a thin film magnetic substance having a range from 0.3 to 20 (?m) in thickness, and is disposed on the entire surface of each terminal (19), covering a mounting portion to be mounted on a printed wiring circuit board (23) for mounting IC (17) and an edge including a connecting portion to a conductive pattern (25) disposed on the printed wiring circuit board (23).

Abstract: A component for suppressing EMI includes a composite magnetic material layer and a composite permanent magnet layer disposed on at least part of the composite magnetic material layer. In the component, the composite magnetic material layer contains an organic binder and a soft magnetic material powder dispersed in the organic binder. The composite permanent magnet layer contains a binder and a permanent magnet powder dispersed in the binder. A bias magnetic field is applied to the composite magnetic material layer from the composite permanent magnet layer.

Abstract: In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) (17) operates at a high speed in using at a high frequency band, and a predetermined number of terminals (19) are provided with a high frequency current suppressor (21) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor (21) is a thin film magnetic substance having a range from 0.3 to 20 (&mgr;m) in thickness, and is disposed on the entire surface of each terminal (19), covering a mounting portion to be mounted on a printed wiring circuit board (23) for mounting IC (17) and an edge including a connecting portion to a conductive pattern (25) disposed on the printed wiring circuit board (23).

Abstract: A ferrite film is formed by regularly arranging constituents such as magnetized grains or one analogous to that. In the ferrite film, the constituents have at least one of the uniaxial anisotropy and the multiaxial anisotropy. The ferrite film has the magnetic anisotropy or the magnetic isotropy. The ferrite film is formed by the use of the plating method in the presence of a magnetic field. Furthermore, an electromagnetic noise suppressor includes the ferrite film.

Abstract: In a display device (70, 70A, 80-80G, 90-90F) having a display window (73, 81, 93), a magnetic loss layer or layer (75, 75A, 88-88C, 97-97C) is formed on at least a part of a principal surface of the display window. The magnetic loss layer may be a granular magnetic thin layer which is, for example, made of a magnetic substance of a magnetic composition comprising M, X and Y, where M is a metallic magnetic material consisting of Fe, Co, and/or Ni, X being element or elements other than M and Y, and Y being F, N, and/or O. The magnetic loss layer may be formed in any one selected from mat, lattice, stripe, and speck fashions. The magnetic loss layer may be formed in a mesh fashion.

Abstract: A composite magnetic material is provided for use as an electromagnetic interference suppressing body for effectively suppressing an electromagnetic interference within a high frequency apparatus including a mobile communication terminal. The composite magnetic material consists essentially of a soft magnetic powder and an organic binder and is electrically non-conductive and has at least two magnetic resonances caused by at lest two anisotropic magnetic fields (Hk). In the composite magnetic material, the anisotropic magnetic fields (Hk) are different in strength from each other.

Abstract: An atomized mixture of flat soft magnetic powder and an organic binding agent is rolled by mutually confronting two rolling rolls so as to easily produce a composite magnetic sheet excellent in electromagnetic wave absorption characteristic. A plurality of the composite magnetic sheets are stacked by forming unevenness on joining surfaces thereof and rolled so as to realize a desired thickness. By sandwiching a mesh metal layer between the foregoing two composite magnetic sheets and joining them by applying rolling thereto, a mechanically strong electromagnetic interference suppressing sheet can be easily obtained. For reducing reflection and transmittance of electromagnetic waves of the composite magnetic sheet, embossing is applied to obverse and reverse surfaces thereof.

Abstract: A composite magnetic body is obtained without the use of halogen-based or halogen-containing materials, such as, halogen-based binding agent of halogen-based resins or elastomers, and bromine-based fire retardents. The composite magnetic body (1) comprises a soft magnetic powder (2) and a silicone rubber (3). The silicone rubber (3) should preferably be a solid silicone rubber. An electromagnet interference suppressing body is obtained using this composite magnetic body.

Abstract: In a display device (70, 70A, 80-80G, 90-90F) having a display window (73, 81, 93), a magnetic loss layer or layer (75, 75A, 88-88C, 97-97C) is formed on at least a part of a principal surface of the display window. The magnetic loss layer may be a granular magnetic thin layer which is, for example, made of a magnetic substance of a magnetic composition comprising M, X and Y, where M is a metallic magnetic material consisting of Fe, Co, and/or Ni, X being element or elements other than M and Y, and Y being F, N, and/or O. The magnetic loss layer may be formed in any one selected from mat, lattice, stripe, and speck fashions. The magnetic loss layer may be formed in a mesh fashion.

Abstract: A magnetic loss material includes a soft magnetic powder and a binder. In the magnetic loss material, a frequency dispersion profile of an imaginary part magnetic permeability (&mgr;″) has at least two different dispersion portions including a first dispersion portion (D1) at a relatively high-frequency side and a second dispersion portion (D2) at a relatively low frequency side. The imaginary part magnetic permeability has first and second maximum values (&mgr;″max (D1) and &mgr;″max (D2)) as the maxima within the first and the second dispersion portions, respectively. The second maximum value is equal to or greater than the first maximum value. The second dispersion portion may be the dispersion owing to magnetic resonance. The first dispersion portion may be the dispersion owing to eddy current.

Abstract: In a magnetic random access memory having a memory device portion (33,34,35) using magnetic material, a high-frequency current suppressor (26) is arranged in the vicinity of the magnetic material to suppress a high-frequency current which flows in the memory device portion. The memory device and the high-frequency current suppressor may be collectively molded in a mold body (25) of a plastic resin. It is preferable that the high-frequency current suppressor is made of a thin film of a granular magnetic material which has a composition represented by M-X-Y where M is a magnetic metal element, Y is one element selected from oxygen, nitrogen, and fluorine, and X is an element other than M and Y.

Abstract: In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) (17) operates at a high speed in using at a high frequency band, and a predetermined number of terminals (19) are provided with a high frequency current suppressor (21) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor (21) is a thin film magnetic substance having a range from 0.3 to 20 (&mgr;m) in thickness, and is disposed on the entire surface of each terminal (19), covering a mounting portion to be mounted on a printed wiring circuit board (23) for mounting IC (17) and an edge including a connecting portion to a conductive pattern (25) disposed on the printed wiring circuit board (23).