Abstract: In a radiator (1) for use in radiating heat generated by an electronic component (5), a high-frequency current suppressor (2) is attached to that principal surface of the radiator which faces the electronic component. The high-frequency current suppressor serves to attenuate a high-frequency current flowing through the radiator and having a frequency within a frequency band between several tens MHz and several GHz. It is preferable that a heat-conductive sheet is formed on the high-frequency current suppressor. An insulating sheet may be formed on the high-frequency current suppressor.

Abstract: In a method of manufacturing a composite magnetizer, flat soft magnetic powder that strain is removed and magnetic coating of slurry regime consisting of a binder dissolved in a solvent are formed in a sheet by die-coating, gravure coating, or reverse coating. The binder includes a vinyl chloride resin with glass-transition temperature of not lower than 50° C.

Abstract: In a composite magnetic body comprising flat soft magnetic powder dispersed in an organic binding agent, biodegradable plastic is used as the organic binding agent so that the composite magnetic body is free of possibility of pollution due to disposal thereof. As the biodegradable plastic, any of a microbe-generated type, a chemically-synthesized type and a natural high molecular weight type is used.

Abstract: A magnetic substance having the maximum value of complex permeability in quasi-microwave range is provided for suppressing a high frequency noise in a small-sized (electronic apparatus. The magnetic substance is of a magnetic composition comprising M, X and Y, where M is a metallic magnetic material consisting of Fe, Co, and/or Ni, X being element or elements other than M and Y, and Y being F, N, and/or O. The M-X-Y magnetic composition has a concentration of M in the composition so that said M-X-Y magnetic composition has a saturation magnetization of 35-80% of that of the metallic bulk of magnetic material comprising M alone. The magnetic composition has the maximum &mgr;″max of complex.

Abstract: An earphone system 201 comprises an earphone 211, a microphone 212, a connection plug 213, a signal cable 214 for connecting those, and a hollow cylindrical high-frequency current suppressor 215 attached to the signal cable 214 at a position near the earphone 211 with covering an external circumuferencial surface 216a of the cable housing 216. When used for a terminal equipment for mobile communication, high-frequency current generated by electromagnetic waves produced from the terminal equipment can be reduced. The earphone system 201 can prevent an increase of SAR value in human head.

Abstract: A resin-molded unit (1) includes a semiconductor bear chip (2) arranged inside and sealed in an epoxy resin mold (3). The resin-molded unit is entirely covered with a magnetic loss film (5) as a high-frequency current suppressor. It is preferable that the magnetic loss film is made of a granular magnetic material. A plurality of lead frames (4) may be extended from the semiconductor bear chip to the outside through the epoxy resin mold.

Abstract: An electromagnetic interference suppressing body is provided for suppressing electromagnetic interference by undesirable electromagnetic waves. The body includes a conductive support element and a non-conductive soft magnetic layer provided on at least one surface. The electromagnetic interference suppressing body may be used in an electronic equipment comprising a circuit board and an active element mounted on the circuit board, and is interposed between the circuit board and the active element so as to suppress the interference by an induction noise generated from the active element. The electromagnetic interference suppressing body may also be used in a hybrid integrated circuit element having an active element and a passive element mounted on a circuit board. The hybrid integrated circuit element is covered with and sealed by a non-conductive layer and the electromagnetic interference suppressing body overlying an outer surface of the non-conductive layer.

Abstract: A tube for externally covering or bundling electric cables is provided for suppressing radiation of undesired electromagnetic waves. The tube is made of a material in which soft magnetic powder is mixed with and dispersed into an organic binding agent. For protecting the cable from the undesired electromagnetic waves from the exterior, it is preferable to provide a conductor layer at an outer side of a composite magnetic layer. For facilitating mounting onto the cable, the tube is provided with a slit in a longitudinal direction. Alternatively, the cable may have a spiral structure. As an organic binding agent, it is preferable to use an elastomer which is excellent in extensible property. Further, it is preferable that the soft magnetic powder is powder being essentially flat.

Abstract: For improving a noise characteristic of a printed circuit board excellent in noise characteristic, a magnetic prepreg formed by impregnating a magnetic paint composed of soft magnetic powder and thermosetting resin into a glass cloth is used as a prepreg constituting the printed circuit board. It is preferable that the soft magnetic powder is metal powder being essentially flat. Further, it is preferable that a main component of the thermosetting resin is epoxy resin.

Abstract: In a semiconductor bare chip (57) on the front surface whereof is formed an integrated circuit, a magnetic loss film 55 is formed on the back surface of that semiconductor bare chip.

Abstract: In a magnetic random access memory has a memory device portion (33, 34, 35) using magnetic material, a high-frequency current suppressor (26) is arranged in the vicinity of the magnetic material to suppress a high-frequency current which flows in the memory device portion. The memory device and the high-frequency current suppressor may be collectively molded in a mold body (25) of a plastic resin. It is preferable that the high-frequency current suppressor is made by a thin film of a granular magnetic material which has a composition represented by M-X-Y where M is a magnetic metal element, Y is one element selected from oxygen, nitrogen, and fluorine, and X is an element other than M and Y.

Abstract: A tube for externally covering or bundling electric cables is provided for suppressing radiation of undesired electromagnetic waves. The tube is made of a material in which soft magnetic powder is mixed with and dispersed into an organic binding agent. For protecting the cable from the undesired electromagnetic waves from the exterior, it is preferable to provide a conductor layer at an outer side of a composite magnetic layer. For facilitating mounting onto the cable, the tube is provided with a slit in a longitudinal direction. Alternatively, the cable may have a spiral structure. As an organic binding agent, it is preferable to use an elastomer which is excellent in extensible property. Further, it is preferable that the soft magnetic powder is powder being essentially flat.

Abstract: In a radiator (1) for use in radiating heat generated by an electronic component (5), a high-frequency current suppressor (2) is attached to that principal surface of the radiator which faces the electronic component. The high-frequency current suppressor serves to attenuate a high-frequency current flowing through the radiator and having a frequency within a frequency band between several tens MHz and several GHz. It is preferable that a heat-conductive sheet is formed on the high-frequency current suppressor. An insulating sheet may be formed on the high-frequency current suppressor.

Abstract: In a composite magnetic body comprising flat soft magnetic powder dispersed in an organic binding agent, bio-composable plastic is used as the organic binding agent so that the composite magnetic body is free of possibility of pollution due to disposal thereof. As the bio-composable plastic, any of a microbe type, a chemical synthesis type and a natural high molecular type is used.

Abstract: In a display device (70, 70A, 80-80G, 90-90F) having a display window (73, 81, 93), a magnetic loss layer or layer (75, 75A, 88-88C, 97-97C) is formed on at least a part of a principal surface of the display window. The magnetic loss layer may be a granular magnetic thin layer which is, for example, made of a magnetic substance of a magnetic composition comprising M, X and Y, where M is a metallic magnetic material consisting of Fe, Co, and/or Ni, X being element or elements other than M and Y, and Y being F, N, and/or O. The magnetic loss layer may be formed in any one selected from mat, lattice, stripe, and speck fashions. The magnetic loss layer may be formed in a mesh fashion.

Abstract: A resin-molded unit (1) includes a semiconductor bear chip (2) arranged inside and sealed in an epoxy resin mold (3). The resin-molded unit is entirely covered with a magnetic loss film (5) as a high-frequency current suppressor. It is preferable that the magnetic loss film is made of a granular magnetic material. A plurality of lead frames (4) may be extended from the semiconductor bear chip to the outside through the epoxy resin mold.

Abstract: An EMI countermeasure component is provided relative to an active element, which does not deteriorate a circuit function of the active element, but has a sufficient shielding effect against permeation of electromagnetic waves radiated to the exterior, and further suppresses a malfunction or the like due to mutual interferences between peripheral components or an electromagnetic induction to a signal line. The EMI countermeasure component is made of a composite magnetic body including soft magnetic powder having oxide films on the surfaces thereof and an organic binding agent, and extinguishes undesired high frequency electromagnetic radiation as heat due to its complex permeability.

Abstract: In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) (17) operates at a high speed in using at a high frequency band, and a predetermined number of terminals (19) are provided with a high frequency current suppressor (21) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor (21) is a thin film magnetic substance having a range from 0.3 to 20 (&mgr;m) in thickness, and is disposed on the entire surface of each terminal (19), covering a mounting portion to be mounted on a printed wiring circuit board (23) for mounting IC (17) and an edge including a connecting portion to a conductive pattern (25) disposed on the printed wiring circuit board (23).

Abstract: A mixture of flat soft magnetic powder and an organic binding agent is rolled by mutually confronting of rolls so as to produce a composite magnetic sheet excellent in electromagnetic wave absorption characteristic. A plurality of the composite magnetic sheets are stacked by forming groove surfaces on each of said plurality of sheets and rolled to a desired thickness. By sandwiching a conductive mesh metal layer between two of said composite magnetic sheets and joining them by applying rolling pressure thereto, a mechanically strong electromagnetic interference suppressing sheet can be easily obtained. In order to reduce reflection and transmittance of electromagnetic waves of the composite magnetic sheet, embossing is applied to obverse and reverse surfaces of the composite magnetic sheet.

Abstract: A thin electromagnetic interference suppressing body effective for electromagnetic interference suppression at a microwave band. As a material of the electromagnetic interference suppressing body, there is provided a composite magnetic body formed by bonding powder made of a semi-hard magnetic material by an organic bonding agent and having a high magnetic loss at the microwave band. As the semi-hard magnetic material, a metallic magnetic body, such as Fe--Co--Mo alloy, Co--Fe--Nb alloy or Fe--Co--V alloy, or an oxide magnetic body, such as .gamma.-Fe.sub.2 O.sub.3 or Co--Ti substituted Ba ferrite, can be used. Further, as an example of the organic bonding agent, polyurethane resin can be cited.