Abstract: A multi-chips in system level and wafer level package structure includes a package substrate having a plurality of through holes a multi-chips with different functions and sizes, the metal wires, a package body, and the conductive components. The multi-chips are used to combine with the package substrate so as to the pads of the multi-chips are exposed out of the through holes. The pads of the multi-chips are electrically connected to the connecting terminal adjacent to the through holes by the plurality of conductive wires. The package material is filled into the through holes to form the package body to encapsulate the conductive wire, each active surface and the pads of the multi-chips with the different functions and the sizes by dispensing method so as to the multiple chip system level and wafer level package structure is accomplished by partially packaging method.

Abstract: A laser manufacturing system capable of fabricating 3-D resolved 2-D patterns. The system includes a pulse laser source generating a laser beam; a reflectance mirror arranged in the propagation path of the laser to reflect the laser, the mirror being controllable to adjust an emergent angle of the laser; a deformable dispersion unit located in the laser receiving path from the reflectance mirror and having an array of micromirrors controllable in response to the adjusted emergent angle to form required laser patterns from the reflected laser, the laser patterns having spatially separated optical spectral components with multiple propagation angles; and one or more focusing optical components positioned in the propagation path of the separated optical spectral components produced by the deformable dispersion unit; the focusing components recombine the optical spectral components at fabrication targets with patterns defined by the deformable dispersion unit.

Abstract: A method, computing system, and computer-readable medium for assigning global edge IDs for evolving graphs are described herein. The method includes selecting a block size for an evolving graph and, as new vertices are added to the evolving graph, calculating block IDs for the evolving graph. Calculating the block IDs includes creating a table representing the evolving graph and, as new vertices are added to the evolving graph, calculating block IDs for cells in a new column of the table before calculating block IDs for cells in a new row of the table. The method also includes calculating global edge IDs for the evolving graph based on the source vertex ID, the target vertex ID, and the block ID for the block at which each edge is located. The method may also include calculating incremental Page Rank for the evolving graph.

Abstract: A multi-chips in system level and wafer level package structure includes a package substrate having a plurality of through holes a multi-chips with different functions and sizes, the metal wires, a package body, and the conductive components. The multi-chips are used to combine with the package substrate so as to the pads of the multi-chips are exposed out of the through holes. The pads of the multi-chips are electrically connected to the connecting terminal adjacent to the through holes by the plurality of conductive wires. The package material is filled into the through holes to form the package body to encapsulate the conductive wire, each active surface and the pads of the multi-chips with the different functions and the sizes by dispensing method so as to the multiple chip system level and wafer level package structure is accomplished by partially packaging method.

Abstract: A compliant apparatus for nano-manufacture, including a stage for supporting the objects to be nano-manufactured. The stage includes at least one flexural beam and at least one actuator coupled to the flexural beam; and the actuator is configured to generate and apply axial loads onto the flexural beam, such that a natural frequency of the flexural beam is shifted in response to the generated axial loads, so as to allow trade-offs between the natural frequency and a stroke of the stage for nano-manufacturing the objects.

Abstract: A cushion package structure includes at least a plate and two or more blocks. The plate is disposed within a storage box and the blocks are the same and pivotable with one another. As a number of blocks are connected with one another serially with various including angle between each adjacent two, one or multiple block sets may be formed thereby. Positioning holes on the plate having substantially same contour as corresponding positioning sections on the blocks are further prepared to engage with the positioning sections as the block sets are put to be disposed on the plate, thereby forming a storage space with a specific shape within the storage box. The blocks may be removed from the plate, rearranged, and redisposed on another plate, so that a storage space with a different shape may be defined.

Abstract: A die packaged structure includes a pad on the central region of the die. A packaged substrate with an opening disposed in the central region, and a connecting terminal is passed through the packaged substrate and disposed around the opening. An external connecting terminal is disposed on the four sides of the packaged substrate. A first metal wire is electrically connected the connecting terminal with the external connecting terminal, and the back of the packaged substrate is fixed on the die, such that the pad is exposed on the opening. A second metal wire is electrically connected the pad with the connecting terminal. A packaged body is encapsulated the packaged substrate, the die and the second metal wire, and the external connecting terminal is exposed. A conductive component is electrically connected with the external connecting terminal and is arranged on the four sides of the die packaged structure.

Abstract: A process for positive microcontact printing, including inking a patterned mold with a thiol; contacting the mold with a metal surface of a substrate; backfilling the metal surface with a solution containing an aromatic amine to form a backfilling layer; etching the metal surface of the substrate; and rinsing the substrate to remove the backfilling layer.

Abstract: A fabric rolling apparatus is driven by a circular knitting machine to revolve and receive a knitted fabric. The fabric rolling apparatus comprises a bracket, a transmission rod set located on the bracket and a revolving fabric collection mechanism. The bracket includes two side boxes corresponding to each other and a drive mechanism located in each side box. Each side box has a top side and a bottom side. The drive mechanism drives the transmission rod set to guide movement of the fabric. The revolving fabric collection mechanism includes two revolving arms hinged respectively on the side boxes and a fabric rolling rod driven by the transmission rod set to revolve and roll the fabric. Each revolving arm has a revolving end hinged on the bottom side of the side box and a holding end connected to the fabric rolling rod at an elevation higher than the revolving end.

Abstract: A vending machine, and an operating system and an operating method thereof are provided. The vending machine includes a cabinet and a transparent touch display. The cabinet accommodates a plurality of physical commodities for vending. The transparent touch display is configured in the cabinet and located in front of the physical commodities. The transparent touch display has a transparent area for revealing the physical commodities. A user selects the physical commodities by touching a position corresponding to each of the physical commodities at the transparent area. The transparent touch display is adapted for displaying corresponding commodity information according to touch information applied by the user on the transparent touch display.

Abstract: A fabric rolling apparatus is driven by a circular knitting machine to revolve and receive a knitted fabric. The fabric rolling apparatus comprises a bracket, a transmission rod set located on the bracket and a revolving fabric collection mechanism. The bracket includes two side boxes corresponding to each other and a drive mechanism located in each side box. Each side box has a top side and a bottom side. The drive mechanism drives the transmission rod set to guide movement of the fabric. The revolving fabric collection mechanism includes two revolving arms hinged respectively on the side boxes and a fabric rolling rod driven by the transmission rod set to revolve and roll the fabric. Each revolving arm has a revolving end hinged on the bottom side of the side box and a holding end connected to the fabric rolling rod at an elevation higher than the revolving end.

Abstract: A microtome method and apparatus includes a microtome blade configured to oscillate in a direction transverse to a direction of advancing a cut, and a first flexure to support and guide the blade. The first flexure is compliant in the transverse direction while being stiff in the cut direction. A second flexure operatively engaged at one end portion with the first flexure, is stiff in the transverse direction while being compliant in the cut direction. The other end portion of the second flexure is rotatably engaged by an eccentric driven by a rotatable actuator, which oscillates the blade in the transverse direction while effectively isolating non-transverse motion from the blade. The second flexure is configured to move independently of any guides or other stationary objects during oscillation.

Abstract: A carrier tray includes a top plate and a first sidewall. The top plate includes a first side edge and a containing room. The first sidewall is connected to the top plate and is extended from the first side edge. The containing room and the first sidewall are disposed on the same side of the top plate. The first sidewall and the top plate form a first included angle of between 73 and 78 degrees therebetween.

Abstract: A module with stack package components includes: at least a package component in a loader. Moreover, each package components includes at least a chip. Package components stacks in the loader. The package components connect with the loader by metal connecters and wire. These package components are placed to make the loader be the module with stack package components. The module connects with some sockets by other metal connecters.

Abstract: A package module with offset stacked device is provided which includes a group of stacked device, a carrier and a substrate. The group of stacked device is offset stacked to dispose in the carrier and the substrate is disposed on the bottom of the carrier. A plurality of electric connections is disposed on the surface substrate that is opposite to the carrier. A plurality of outer connections on another surface of the substrate is electrically connected with the plurality of electric connections. The group of the stacked device is electrically connected with the carrier by the connecting the plurality of metal connections and the pads. The plurality of metal connections is extended to the bottom of the carrier to form another metal connection to electrically connect with the electric connection on the substrate.

Abstract: A multiple degrees of freedom control apparatus for a roll-to-roll printing system.

Abstract: A micro-contact imprinting apparatus for transferring patterns of a stamp to a substrate.

Abstract: A method for manufacturing a carrier tray includes softening and disposing a plastic film on a first mold, wherein the first mold includes a top surface and a first lateral surface, the top surface includes a recession and a first edge, the first lateral surface is connected to the top surface and extends from the first edge, and the first lateral surface and the top surface form a first included angle; attaching the plastic film to the top surface and the first lateral surface; disposing a restorer on an outer side of the first mold; separating the first mold from the plastic film, wherein the plastic film is pushed by the first lateral surface such that the restorer is moved from an initial position to a final position; and pushing the plastic film from the final position to the initial position by the restorer; and cooling the plastic film.

Abstract: A package module with offset stacked device is provided which includes a group of stacked device, a carrier and a substrate. The group of stacked device is offset stacked to dispose in the carrier and the substrate is disposed on the bottom of the carrier. A plurality of electric connections is disposed on the surface substrate that is opposite to the carrier. A plurality of outer connections on another surface of the substrate is electrically connected with the plurality of electric connections. The group of the stacked device is electrically connected with the carrier by the connecting the plurality of metal connections and the pads. The plurality of metal connections is extended to the bottom of the carrier to form another metal connection to electrically connect with the electric connection on the substrate.

Abstract: A microtome method and apparatus includes a microtome blade configured to oscillate in a direction transverse to a direction of advancing a cut, and a first flexure to support and guide the blade. The first flexure is compliant in the transverse direction while being stiff in the cut direction. A second flexure operatively engaged at one end portion with the first flexure, is stiff in the transverse direction while being compliant in the cut direction. The other end portion of the second flexure is rotatably engaged by an eccentric driven by a rotatable actuator, which oscillates the blade in the transverse direction while effectively isolating non-transverse motion from the blade. The second flexure is configured to move independently of any guides or other stationary objects during oscillation.