Abstract: A method of operating magneto-resistive random access memory (MRAM) cells includes providing an MRAM cell, which includes a magnetic tunneling junction (MTJ) device and a word line selector having a source-drain path serially coupled to the MTJ device. A negative substrate bias voltage is connected to a body of the word line selector to increase the drive current of the word line selector. The threshold voltage of the word line selector is also reduced.

Abstract: A method of operating magneto-resistive random access memory (MRAM) cells includes providing an MRAM cell, which includes a magnetic tunneling junction (MTJ) device; and a selector comprising a source-drain path serially coupled to the MTJ device. The method further includes applying an overdrive voltage to a gate of the selector to turn on the selector.

Abstract: In various embodiments, the fuse is formed from silicide and on top of a fin of a fin structure. Because the fuse is formed on top of a fin, its width takes the width of the fin, which is very thin. Depending on implementations, the fuse is also formed using planar technology and includes a thin width. Because the width of the fuse is relatively thin, a predetermined current can reliably cause the fuse to be opened. Further, the fuse can be used with a transistor to form a memory cell used in memory arrays, and the transistor utilizes FinFET technology.

Abstract: The present disclosure provides an image sensor semiconductor device. The semiconductor device includes a sensor element disposed in a semiconductor substrate; an inter-level dielectric (ILD) disposed on the semiconductor substrate; and a trench disposed in the ILD, overlying and enclosing the sensor element, and filled with a first dielectric material.

Abstract: A first terminal and a second terminal of a FinFET transistor are used as two terminals of an anti-fuse. To program the anti-fuse, a gate of the FinFET transistor is controlled, and a voltage having a predetermined amplitude and a predetermined duration is applied to the first terminal to cause the first terminal to be electrically shorted to the second terminal.

Abstract: A method of writing a magneto-resistive random access memory (MRAM) cell includes providing a writing pulse to write a value to the MRAM cell; and verifying a status of the MRAM cell immediately after the step of providing the first writing pulse. In the event of a write failure, the value is rewritten into the MRAM cell.

Abstract: A static random access memory (SRAM) cell is disclosed which comprises a cross-couple inverter latch coupled between a positive supply voltage and ground, and having at least a first storage node, and a first and second switching device serially connected between the first storage node and a predetermined voltage source, wherein the first switching device is controlled by a word select signal, and the second switching device is controlled by a first bit select signal, wherein either the word select signal or the first bit select signal is only activated during a write operation.

Abstract: The present invention discloses a bipolar device. An emitter is formed in a semiconductor substrate. A collector is laterally spaced from the emitter in the substrate. A gate terminal is formed on the substrate, defining a space between the emitter and the collector. An extrinsic base is formed on the substrate with a predetermined distance from either the emitter or the collector, wherein the base, the emitter, the collector and the gate terminal are located in an active area defined by a hole in a surrounding isolation structure in the substrate.

Abstract: Design and methods for fabricating bipolar junction transistors are described. In one embodiment, a semiconductor device includes a first fin comprising a first emitter region, a first base region, and a first collector region. The first emitter region, the first base region, and the first collector region form a bipolar junction transistor. A second fin is disposed adjacent and parallel to the first fin. The second fin includes a first contact to the first base region.

Abstract: An integrated circuit structure includes a semiconductor chip including a top surface, a bottom surface, and a side surface; a metal seal ring adjacent the side surface; and an antenna including a seal-ring antenna. The seal-ring antenna includes at least a portion of the metal seal ring.

Abstract: The present invention discloses a bipolar device. An emitter is formed in a semiconductor substrate. A collector is laterally spaced from the emitter in the substrate. A gate terminal is formed on the substrate, defining a space between the emitter and the collector. An extrinsic base is formed on the substrate with a predetermined distance from either the emitter or the collector, wherein the base, the emitter, the collector and the gate terminal are located in an active area defined by a hole in a surrounding isolation structure in the substrate.

Abstract: A circuit and method for a digital process monitor is disclosed. Circuits for comparing a current or voltage to a current or voltage corresponding to a device having process dependent circuit characteristics are disclosed, having converters for converting current or voltage measurements proportional to the process dependent circuit characteristic to a digital signal and outputting the digital signal for monitoring. The process dependent circuit characteristics may be selected from transistor threshold voltage, transistor saturation current, and temperature dependent quantities. Calibration is performed using digital techniques such as digital filtering and digital signal processing. The digital process monitor circuit may be formed as a scribe line circuit for wafer characterization or placed in an integrated circuit die as a macro. The process monitor circuit may be accessed using probe pads or scan test circuitry. Methods for monitoring process dependent characteristics using digital outputs are disclosed.

Abstract: This invention discloses a write-sensing circuit for a semiconductor memory having at least one memory block with a continuous word-line being coupled to all the memory cells in a column of the memory block and a continuous bit-line being coupled to all the memory cells in a row of the memory block, the write-sensing circuit comprising a first and a second sense amplifier belonging to the same memory block, a first switching device coupled between the first sense amplifier and a first power supply, the first switching device being controlled by a first signal, and a second switching device coupled between the second sense amplifier and the first power supply, the second switching device being controlled by a second signal different from the first signal, wherein when the first sense amplifier is activated, the second sense amplifier can remain de-activated.

Abstract: A fuse circuit comprising one or more one-time programmable electrical fuses; one or more unidirectional conductive devices each coupled to one of the fuses; a programming device coupled to the unidirectional conductive devices; and a selection module coupled to the electrical fuses for selecting a predetermined electrical fuse, wherein upon a selection by the selection module, a programming current is introduced through at least one selected electrical fuse, wherein the selection module is an N-to-one multiplexer selecting one of the N number of electrical fuses to be programmed, and the unidirectional conductive devices not coupled to the selected electrical fuse to prevent the programming current from interfering with the remaining electrical fuses.

Abstract: A split gate memory cell. First and second well regions of respectively first and second conductivity types are formed in the substrate. A floating gate is disposed on a junction of the first and second well regions and insulated from the substrate. A control gate is disposed over the sidewall of the floating gate and insulated from the substrate and the floating gate and partially extends to the upper surface of the floating gate. A doping region of the first conductivity type is formed in the second well region. The first well region and the doping region respectively serve as source and drain regions of the split gate memory cell.

Abstract: A voltage controlled oscillator includes: a first merged device having a first bipolar transistor and a first MOS transistor, the first bipolar transistor having a collector sharing a common active area with a source/drain of the first MOS transistor, and an emitter sharing the common active area with another source/drain of the first MOS transistor, a second merged device having a second bipolar transistor and a second MOS transistor, the second bipolar transistor having a collector sharing a common active area with a source/drain of the second MOS transistor, and an emitter sharing the common active area with another source/drain of the second MOS transistor, and a first inductor connected to both the collector of the first bipolar transistor and a base of the second bipolar transistor.

Abstract: An integrated circuit structure includes a semiconductor chip including a top surface, a bottom surface, and a side surface; a metal seal ring adjacent the side surface; and an antenna including a seal-ring antenna. The seal-ring antenna includes at least a portion of the metal seal ring.

Abstract: A static random access memory (SRAM) cell is disclosed which comprises a cross-couple inverter latch coupled between a positive supply voltage and ground, and having at least a first storage node, and a first and second switching device serially connected between the first storage node and a predetermined voltage source, wherein the first switching device is controlled by a word select signal, and the second switching device is controlled by a first bit select signal, wherein either the word select signal or the first bit select signal is only activated during a write operation.

Abstract: A system and method for calibrating a digital-to-analog converter (DAC) is disclosed, the method comprises providing a plurality of spare bits to each of a group of DAC bits that are designated for calibration, calibrating a first DAC bit of the group of DAC bits using its corresponding plurality of spare bits, and keeping a second DAC bit of the group of DAC bits unchanged while calibrating the first DAC bit.

Abstract: A voltage down converter for programming a one-time-programmable (OTP) memory comprising is disclosed, the voltage down converter comprises a bonding pad for coupling to a programming power supply, and at least one forward biased diode coupled between the bonding pad and the OTP memory, wherein a programming voltage received by the OTP memory is lowered from the programming power supply by the voltage drop across the forward biased diode.