Abstract: A photosensitive device is disclosed which comprises a semiconductor substrate, at least one reverse biased device, such as a P-N junction diode formed in the semiconductor substrate, and at least one photosensitive layer disposed above the semiconductor substrate and substantially covering the reverse biased device, the photosensitive layer releasing electrons and holes when struck by photons, wherein the photon generated electrons and holes in the photosensitive layer reach the reverse biased device and create a combination current therein when a light shines thereon.

Abstract: A fuse structure with aggravated electromigration effect is disclosed, which comprises an anode area overlaying a first plurality of contacts that are coupled to a positively high voltage during a programming of the fuse structure, a cathode area overlaying a second plurality of contacts that are coupled to a complementary low voltage during a programming of the fuse structure, and a fuse link area having a first and second end, wherein the first end contacts the anode area at a predetermined distance to the nearest of the first plurality of contacts, and the second end contacts the cathode area at the predetermined distance to the nearest of the second plurality of contacts, wherein the cathode area is smaller than the anode area for the aggravating electromigration effect.

Abstract: A fuse circuit comprising one or more one-time programmable electrical fuses; one or more unidirectional conductive devices each coupled to one of the fuses; a programming device coupled to the unidirectional conductive devices; and a selection module coupled to the electrical fuses for selecting a predetermined electrical fuse, wherein upon a selection by the selection module, a programming current is introduced through at least one selected electrical fuse, wherein the selection module is an N-to-one multiplexer selecting one of the N number of electrical fuses to be programmed, and the unidirectional conductive devices not coupled to the selected electrical fuse to prevent the programming current from interfering with the remaining electrical fuses.

Abstract: A photosensitive device is disclosed which comprises a semiconductor substrate, at least one reverse biased device, such as a P-N junction diode formed in the semiconductor substrate, and at least one photosensitive layer disposed above the semiconductor substrate and substantially covering the reverse biased device, the photosensitive layer releasing electrons and holes when struck by photons, wherein the photon generated electrons and holes in the photosensitive layer reach the reverse biased device and create a combination current therein when a light shines thereon.

Abstract: A system and method for calibrating a digital-to-analog converter (DAC) is disclosed, the method comprises providing a plurality of spare bits to each of a group of DAC bits that are designated for calibration, calibrating a first DAC bit of the group of DAC bits using its corresponding plurality of spare bits, and keeping a second DAC bit of the group of DAC bits unchanged while calibrating the first DAC bit.

Abstract: A DAC cell comprising: two or more PMOS core devices coupled in series between a power supply and a steering node; a first core transistor coupled between the steering node and a complementary power supply line and controlled by a control signal; and a second core transistor coupled between the steering node and an output of the DAC cell and controlled by a logical inverse of the control signal, wherein the control signal and its logical inverse direct a current from the steering node to either the complementary power supply line or to the output of the DAC cell based on the control signal.

Abstract: This invention discloses an extended memory comprising a first tag RAM for storing one or more tags corresponding to data stored in a first storage module, and a second tag RAM for storing one or more tags corresponding to data stored in a second storage module, wherein the first and second storage modules are separated and independent memory units, the numbers of bits in the first and second tag RAMs differ, and an address is concurrently checked against both the first and second tag RAMs using a first predetermined bit field of the address for checking against a first tag from the first tag RAM and using a second predetermined bit field of the address for checking against a second tag from the second tag RAM.

Abstract: A temperature-dependent oscillator includes a first current source, wherein a first current provided by the first current source has a positive temperature coefficient, a second current source serially connected to the first current source, wherein a second current provided by the second current source has a negative temperature coefficient, and a capacitor serially connected to the first current source and parallel connected to the second current source.

Abstract: A multi-level electrical fuse system comprises at least one fuse box having at least one electrical fuse, a programming device serially coupled to the electrical fuse, and a variable power supply coupled to the fuse box and configured to generate two or more voltage levels.

Abstract: This invention discloses a write-sensing circuit for a semiconductor memory having at least one memory block with a continuous word-line being coupled to all the memory cells in a column of the memory block and a continuous bit-line being coupled to all the memory cells in a row of the memory block, the write-sensing circuit comprising a first and a second sense amplifier belonging to the same memory block, a first switching device coupled between the first sense amplifier and a first power supply, the first switching device being controlled by a first signal, and a second switching device coupled between the second sense amplifier and the first power supply, the second switching device being controlled by a second signal different from the first signal, wherein when the first sense amplifier is activated, the second sense amplifier can remain de-activated.

Abstract: The present disclosure provides an image sensor semiconductor device. The semiconductor device includes a sensor element disposed in a semiconductor substrate; an inter-level dielectric (ILD) disposed on the semiconductor substrate; and a trench disposed in the ILD, overlying and enclosing the sensor element, and filled with a first dielectric material.

Abstract: A semiconductor device is disclosed for alleviating well proximity effects. The semiconductor device comprises a well in a substrate; and a transistor with an active region and a gate of 0.13 um or less in gate length, wherein the gate is entirely within or extended to outside of the well, and a minimum spacing between an edge of the active region and an edge of the well is at least 3 times the gate length.

Abstract: A system-on-chip semiconductor circuit includes a logic circuit having at least one first transistor with a thin gate dielectric, at least one dynamic random access memory cell coupled with the logic circuit having at least one storage capacitor and at least one thick gate dielectric access transistor, and an analog circuit operable with the logic circuit and the memory cell having at least one thick gate dielectric switched transistor and at least one switched capacitor, wherein the storage capacitors of the memory cell and the switched transistors are of the same type, and wherein the thick gate dielectric switched transistor and the switched capacitor of the analog circuit are made by a process for making the dynamic random access memory cell.

Abstract: A temperature-sensitive current source includes a first MOS transistor having a source coupled to a first voltage; a second MOS transistor having a source coupled to the first voltage, and a gate coupled to a gate of the first MOS transistor, such that a current output at a drain of the second MOS transistor mirrors a current passing across the first MOS transistor; and a resistor coupled between the source and a drain of the first MOS transistor in parallel, such that the current passing across the first MOS transistor is substantially larger than a current passing through the resistor, wherein the first and second MOS transistors operate in a saturation mode, such that the output current at the drain of the second MOS transistor is responsive to a change of temperature.

Abstract: A method for testing a memory with cell plates and bit-line plates comprises putting the memory in a test mode, applying a test pattern to the memory, then providing a first voltage higher than Vdd/2 to the cell plate when writing a ‘1’ to a predetermined cell, providing a second voltage lower than Vdd/2 to the cell plate when writing a ‘0’ to a predetermined cell, wherein the first and second voltages are applied to emulate weak charge storage in the memory cell, similarly, providing a third voltage higher than Vdd/2 to the bit-line plate when expecting to read a ‘1’ from a predetermined cell, and providing a fourth voltage lower than Vdd/2 to the bit-line plate when expecting to read a ‘0’ from a predetermined cell, wherein the third and fourth voltages are applied to emulate charge decay in the memory cell.

Abstract: An edge triggered flip-flop circuit is disclosed with a clock signal, an input signal, a switch module using the clock signal for defining a data passing window, and a latch module for receiving the input signal during the data passing window.

Abstract: This invention discloses a write-sensing circuit for semiconductor memories comprising a first and a second local bit-lines (BLs) forming a complementary BL pair, a first and a second global bit-lines (GBLs) forming a complementary GBL pair, and at least one switching circuit controlled by the first and second GBLs and controllably coupling a predetermined power supply source to the first and second BLs, separately, wherein when the first and second GBLs are asserted during a write operation, the switching circuit couples only one of the first and second BLs to the predetermined voltage supply source.

Abstract: A startup circuit operating with a bandgap circuit having a predetermined node with a current change proportional to temperature change and a current source connected to the predetermined node comprising: a controllable current switch connected between the predetermined node and a control node of the current source; wherein when the voltage at the predetermined node is floating when starting the bandgap circuit, the controllable current switch biases the current source at the control node whereby the voltage at the predetermined node changes based on the current provided by the current source causing the bandgap circuit to start its normal operation.

Abstract: This invention discloses a write-sensing circuit for semiconductor memories comprising a first and a second local bit-lines (BLs) forming a complementary BL pair, a first and a second global bit-lines (GBLs) forming a complementary GBL pair, and at least one switching circuit controlled by the first and second GBLs and controllably coupling a predetermined power supply source to the first and second BLs, separately, wherein when the first and second GBLs are asserted during a write operation, the switching circuit couples only one of the first and second BLs to the predetermined voltage supply source.

Abstract: A digital-to-analog converter comprising a digital input; a first thermometer coder for generating a set of first control signals based on a first portion of the digital input; at least one fractional-bit DAC cell controlled by one or more of the first control signals for providing a fractional-bit current based on the first portion of the digital input; at least one second thermometer coder for generating a set of second control signals based on a second portion of the digital input; and at least one multi-bit DAC cell controlled by one or more of the second control signals for providing a multi-bit current based on the second portion of the digital input, wherein the fractional-bit current and the multi-bit current are combined to form an output of the DAC corresponding to the digital input.