Patents by Inventor Shinichiro Izawa
Shinichiro Izawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240107157Abstract: The present disclosure relates to a solid-state imaging device, a method for driving the solid-state imaging device, and an electronic device capable of improving auto-focusing accuracy by using a phase difference signal obtained by using a photoelectric conversion film. The solid-state imaging device includes a pixel including a photoelectric conversion portion having a structure where a photoelectric conversion film is interposed by an upper electrode on the photoelectric conversion film and a lower electrode under the photoelectric conversion film. The upper electrode is divided into a first upper electrode and a second upper electrode. The present disclosure can be applied to, for example, a solid-state imaging device or the like.Type: ApplicationFiled: December 6, 2023Publication date: March 28, 2024Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Keisuke HATANO, Fumihiko KOGA, Tetsuji YAMAGUCHI, Shinichiro IZAWA
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Patent number: 11882359Abstract: The present disclosure relates to a solid-state imaging device, a method for driving the solid-state imaging device, and an electronic device capable of improving auto-focusing accuracy by using a phase difference signal obtained by using a photoelectric conversion film. The solid-state imaging device includes a pixel including a photoelectric conversion portion having a structure where a photoelectric conversion film is interposed by an upper electrode on the photoelectric conversion film and a lower electrode under the photoelectric conversion film. The upper electrode is divided into a first upper electrode and a second upper electrode. The present disclosure can be applied to, for example, a solid-state imaging device or the like.Type: GrantFiled: March 13, 2023Date of Patent: January 23, 2024Assignee: Sony Semiconductor Solutions CorporationInventors: Keisuke Hatano, Fumihiko Koga, Tetsuji Yamaguchi, Shinichiro Izawa
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Publication number: 20230217103Abstract: The present disclosure relates to a solid-state imaging device, a method for driving the solid-state imaging device, and an electronic device capable of improving auto-focusing accuracy by using a phase difference signal obtained by using a photoelectric conversion film. The solid-state imaging device includes a pixel including a photoelectric conversion portion having a structure where a photoelectric conversion film is interposed by an upper electrode on the photoelectric conversion film and a lower electrode under the photoelectric conversion film. The upper electrode is divided into a first upper electrode and a second upper electrode. The present disclosure can be applied to, for example, a solid-state imaging device or the like.Type: ApplicationFiled: March 13, 2023Publication date: July 6, 2023Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Keisuke HATANO, Fumihiko KOGA, Tetsuji YAMAGUCHI, Shinichiro IZAWA
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Patent number: 11632494Abstract: The present disclosure relates to a solid-state imaging device, a method for driving the solid-state imaging device, and an electronic device capable of improving auto-focusing accuracy by using a phase difference signal obtained by using a photoelectric conversion film. The solid-state imaging device includes a pixel including a photoelectric conversion portion having a structure where a photoelectric conversion film is interposed by an upper electrode on the photoelectric conversion film and a lower electrode under the photoelectric conversion film. The upper electrode is divided into a first upper electrode and a second upper electrode. The present disclosure can be applied to, for example, a solid-state imaging device or the like.Type: GrantFiled: July 8, 2021Date of Patent: April 18, 2023Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Keisuke Hatano, Fumihiko Koga, Tetsuji Yamaguchi, Shinichiro Izawa
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Publication number: 20220070392Abstract: The present technology relates to an event signal detection sensor and a control method for shortening latency and reducing overlooking objects. A plurality of pixel circuits detects an event that is a change in an electrical signal of a pixel that generates the electrical signal by performing photoelectric conversion, and outputs event data indicating the occurrence of the event. A detection probability setting unit calculates a detection probability per unit time for detecting the event for each region formed with one or more pixel circuits, in accordance with a result of pattern recognition. The detection probability setting unit controls the pixel circuits in such a manner that event data is output in accordance with the detection probability. The present technology can be applied to an event signal detection sensor that detects an event that is a change in an electrical signal of a pixel.Type: ApplicationFiled: February 7, 2020Publication date: March 3, 2022Inventors: SHINICHIRO IZAWA, MOTONARI HONDA
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Patent number: 11223758Abstract: The present disclosure relates to a solid-state imaging device, a method for driving the solid-state imaging device, and an electronic device capable of improving auto-focusing accuracy by using a phase difference signal obtained by using a photoelectric conversion film. The solid-state imaging device includes a pixel including a photoelectric conversion portion having a structure where a photoelectric conversion film is interposed by an upper electrode on the photoelectric conversion film and a lower electrode under the photoelectric conversion film. The upper electrode is divided into a first upper electrode and a second upper electrode. The present disclosure can be applied to, for example, a solid-state imaging device or the like.Type: GrantFiled: February 25, 2020Date of Patent: January 11, 2022Assignee: Sony Semiconductor Solutions CorporationInventors: Keisuke Hatano, Fumihiko Koga, Tetsuji Yamaguchi, Shinichiro Izawa
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Publication number: 20210335874Abstract: The present disclosure relates to a solid-state imaging device, a method for driving the solid-state imaging device, and an electronic device capable of improving auto-focusing accuracy by using a phase difference signal obtained by using a photoelectric conversion film. The solid-state imaging device includes a pixel including a photoelectric conversion portion having a structure where a photoelectric conversion film is interposed by an upper electrode on the photoelectric conversion film and a lower electrode under the photoelectric conversion film. The upper electrode is divided into a first upper electrode and a second upper electrode. The present disclosure can be applied to, for example, a solid-state imaging device or the like.Type: ApplicationFiled: July 8, 2021Publication date: October 28, 2021Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Keisuke HATANO, Fumihiko KOGA, Tetsuji YAMAGUCHI, Shinichiro IZAWA
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Publication number: 20200195869Abstract: The present disclosure relates to a solid-state imaging device, a method for driving the solid-state imaging device, and an electronic device capable of improving auto-focusing accuracy by using a phase difference signal obtained by using a photoelectric conversion film. The solid-state imaging device includes a pixel including a photoelectric conversion portion having a structure where a photoelectric conversion film is interposed by an upper electrode on the photoelectric conversion film and a lower electrode under the photoelectric conversion film. The upper electrode is divided into a first upper electrode and a second upper electrode. The present disclosure can be applied to, for example, a solid-state imaging device or the like.Type: ApplicationFiled: February 25, 2020Publication date: June 18, 2020Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Keisuke HATANO, Fumihiko KOGA, Tetsuji YAMAGUCHI, Shinichiro IZAWA
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Patent number: 10616515Abstract: The present disclosure relates to a solid-state imaging device, a method for driving the solid-state imaging device, and an electronic device capable of improving auto-focusing accuracy by using a phase difference signal obtained by using a photoelectric conversion film. The solid-state imaging device includes a pixel including a photoelectric conversion portion having a structure where a photoelectric conversion film is interposed by an upper electrode on the photoelectric conversion film and a lower electrode under the photoelectric conversion film. The upper electrode is divided into a first upper electrode and a second upper electrode. The present disclosure can be applied to, for example, a solid-state imaging device or the like.Type: GrantFiled: November 27, 2018Date of Patent: April 7, 2020Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Keisuke Hatano, Fumihiko Koga, Tetsuji Yamaguchi, Shinichiro Izawa
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Patent number: 10602084Abstract: The present disclosure relates to an imaging apparatus comprising an image sensor that includes an imaging surface in which many pixels are arranged vertically and horizontally, a pixel control unit that controls the image sensor, selects a pixel corresponding to a sampling function among pixels configuring a block by applying the sampling function for each block acquired by partitioning the imaging surface of the image sensor into a plurality of blocks, and outputs a sampling signal based on a pixel value of the selected pixel, and a reduced image generating unit that generates a reduced image on the basis of the sampling signal for each block output from the image sensor.Type: GrantFiled: July 1, 2016Date of Patent: March 24, 2020Assignee: SONY CORPORATIONInventors: Tomoo Mitsunaga, Hayato Wakabayashi, Kenichi Okumura, Yasunobu Hitomi, Daisuke Iso, Tomonori Masuno, Shinichiro Izawa, Kyoko Izuha, Kouichi Harada
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Patent number: 10504953Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.Type: GrantFiled: March 7, 2019Date of Patent: December 10, 2019Assignee: Sony CorporationInventors: Takeshi Yanagita, Itaru Oshiyama, Takayuki Enomoto, Harumi Ikeda, Shinichiro Izawa, Atsuhiko Yamamoto, Kazunobu Ota
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Patent number: 10418404Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.Type: GrantFiled: September 13, 2018Date of Patent: September 17, 2019Assignee: Sony CorporationInventors: Takeshi Yanagita, Itaru Oshiyama, Takayuki Enomoto, Harumi Ikeda, Shinichiro Izawa, Atsuhiko Yamamoto, Kazunobu Ota
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Publication number: 20190206911Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.Type: ApplicationFiled: March 7, 2019Publication date: July 4, 2019Applicant: SONY CORPORATIONInventors: Takeshi YANAGITA, Itaru OSHIYAMA, Takayuki ENOMOTO, Harumi IKEDA, Shinichiro IZAWA, Atsuhiko YAMAMOTO, Kazunobu OTA
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Publication number: 20190098239Abstract: The present disclosure relates to a solid-state imaging device, a method for driving the solid-state imaging device, and an electronic device capable of improving auto-focusing accuracy by using a phase difference signal obtained by using a photoelectric conversion film. The solid-state imaging device includes a pixel including a photoelectric conversion portion having a structure where a photoelectric conversion film is interposed by an upper electrode on the photoelectric conversion film and a lower electrode under the photoelectric conversion film. The upper electrode is divided into a first upper electrode and a second upper electrode. The present disclosure can be applied to, for example, a solid-state imaging device or the like.Type: ApplicationFiled: November 27, 2018Publication date: March 28, 2019Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Keisuke HATANO, Fumihiko KOGA, Tetsuji YAMAGUCHI, Shinichiro IZAWA
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Publication number: 20190027520Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.Type: ApplicationFiled: September 13, 2018Publication date: January 24, 2019Applicant: SONY CORPORATIONInventors: Takeshi YANAGITA, Itaru OSHIYAMA, Takayuki ENOMOTO, Harumi IKEDA, Shinichiro IZAWA, Atsuhiko YAMAMOTO, Kazunobu OTA
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Patent number: 10178332Abstract: The present disclosure relates to a solid-state imaging device, a method for driving the solid-state imaging device, and an electronic device capable of improving auto-focusing accuracy by using a phase difference signal obtained by using a photoelectric conversion film. The solid-state imaging device includes a pixel including a photoelectric conversion portion having a structure where a photoelectric conversion film is interposed by an upper electrode on the photoelectric conversion film and a lower electrode under the photoelectric conversion film. The upper electrode is divided into a first upper electrode and a second upper electrode. The present disclosure can be applied to, for example, a solid-state imaging device or the like.Type: GrantFiled: August 27, 2015Date of Patent: January 8, 2019Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Keisuke Hatano, Fumihiko Koga, Tetsuji Yamaguchi, Shinichiro Izawa
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Patent number: 10128291Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.Type: GrantFiled: May 31, 2017Date of Patent: November 13, 2018Assignee: Sony CorporationInventors: Takeshi Yanagita, Itaru Oshiyama, Takayuki Enomoto, Harumi Ikeda, Shinichiro Izawa, Atsuhiko Yamamoto, Kazunobu Ota
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Patent number: 10096638Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.Type: GrantFiled: May 31, 2017Date of Patent: October 9, 2018Assignee: Sony CorporationInventors: Takeshi Yanagita, Itaru Oshiyama, Takayuki Enomoto, Harumi Ikeda, Shinichiro Izawa, Atsuhiko Yamamoto, Kazunobu Ota
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Publication number: 20180205895Abstract: The present disclosure relates to an imaging apparatus and an information processing system capable of decreasing the amount of data of a video or the like transmitted through a network and suppressing power consumption of the imaging apparatus. An imaging apparatus which is a first aspect of the present disclosure includes: an image sensor that includes an imaging surface in which many pixels are arranged vertically and horizontally; a pixel control unit that controls the image sensor, selects a pixel corresponding to a sampling function among pixels configuring a block by applying the sampling function for each block acquired by partitioning the imaging surface of the image sensor into a plurality of blocks, and outputs a sampling signal based on a pixel value of the selected pixel; and a reduced image generating unit that generates a reduced image on the basis of the sampling signal for each block output from the image sensor.Type: ApplicationFiled: July 1, 2016Publication date: July 19, 2018Inventors: TOMOO MITSUNAGA, HAYATO WAKABAYASHI, KENICHI OKUMURA, YASUNOBU HITOMI, DAISUKE ISO, TOMONORI MASUNO, SHINICHIRO IZAWA, KYOKO IZUHA, KOUICHI HARADA
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Patent number: 9923010Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.Type: GrantFiled: February 17, 2017Date of Patent: March 20, 2018Assignee: Sony CorporationInventors: Takeshi Yanagita, Itaru Oshiyama, Takayuki Enomoto, Harumi Ikeda, Shinichiro Izawa, Atsuhiko Yamamoto, Kazunobu Ota