Abstract: It is aimed to prevent a reduction in connection reliability. A terminal fitting is to be mounted into a housing having a board accommodation space and is provided with a connection terminal including a resilient contact piece to be brought into contact with a circuit board inserted into the board accommodation space and a protection terminal separate from the connection terminal and attached to the connection terminal. The connection terminal is movable with respect to the protection terminal between a protection position where the resilient contact piece is accommodated in the protection terminal and a connection position where the resilient contact piece is exposed to outside of the protection terminal to be contactable with the circuit board.

Abstract: The present invention provides a surface treatment method that improves antimicrobial activity of copper or a copper alloy and enhances immediate effects of antimicrobial actions on the surface of the copper or the copper alloy. A surface treatment method for copper or a copper alloy according to the present invention comprises preparing a reducing agent solution containing a biological reducing substance, and treating the surface of the copper or the copper alloy with the reducing agent solution. The present invention also provides a surface treatment liquid for sterilizing copper or a copper alloy, in which the surface treatment liquid contains a biological reducing substance. The present invention also provides a sterilization method that comprises bringing copper or a copper alloy treated by the surface treatment method into contact with a surface of an object to sterilize the surface of the object.

Abstract: A bioinert pipe includes a flow path inside, an inner wall of the flow path is composed of a resin tube and an outer peripheral surface of the resin tube is covered with a metal tube. The bioinert pipe includes an end portion extension member attached to an end portion of the metal tube, and the end portion extension member is made from a material harder than the resin tube and has a first surface and a second surface. The first surface is facing and in contact with an end surface of the metal tube and the second surface is directed opposite to the first surface. a through hole having an inner diameter substantially the same as an inner diameter of the metal tube is provided so as to pass from the first surface to the second surface in the end portion extension member. An edge of the through hole on the second surface of the end portion extension member has a chamfered shape, and the resin tube is inserted into the through hole.

Abstract: An object of the present invention is to provide a compound having an anti-inflammatory activity or a pharmacologically acceptable salt thereof. The solution of the present invention is a compound of general formula (1) or a pharmacologically acceptable salt thereof. wherein the symbols in the formula are defined below: R1: e.g., a C1-C6 alkyl group; R2: a C1-C6 alkyl group; A: e.g., an oxygen atom; and R3: e.g., a C1-C6 alkyl group.

Abstract: This free-cutting copper alloy comprises 75.4-78.7% Cu, 3.05-3.65% Si, 0.10-0.28% Sn, 0.05-0.14% P, and at least 0.005% to less than 0.020% Pb, with the remainder comprising Zn and inevitable impurities. The composition satisfies the following relations: 76.5?f1=Cu+0.8×Si?8.5×Sn+P?80.3; 60.7?f2=Cu?4.6×Si?0.7×Sn?P?62.1; and 0.25?f7=P/Sn?1.0. The area percentage (%) of respective constituent phases satisfies the following relations: 28???67; 0???1.0; 0???0.2; 0???1.5; 97.4?f3=?+?; 99.4?f4=?+?+?+?; 0?f5=?+??2.0; and 30?f6=?+6×?1/2+0.5×??70. The long side of the ? phase is at most 40 ?m, the long side of the ? phase is at most 25 ?m, and ? phase is present in ? phase.

Abstract: This free-cutting copper alloy comprises 76.0-78.7% Cu, 3.1-3.6% Si, 0.40-0.85% Sn, 0.05-0.14% P, and at least 0.005% to less than 0.020% Pb, with the remainder comprising Zn and inevitable impurities. The composition satisfies the following relations: 75.0?f1=Cu+0.8×Si?7.5×Sn+P+0.5×Pb?78.2; 60.0?f2=Cu?4.8×Si?0.8×Sn?P+0.5×Pb?61.5; and 0.09?f3=P/Sn?0.30. The area percentage (%) of respective constituent phases satisfies the following relations: 30???65; 0???2.0; 0???0.3; 0???2.0; 96.5?f4=?+?; 99.4?f5=?+?+?+?; 0?f6=?+??3.0; and 35?f7=1.05×?+6×?1/2+0.5×??70. ? phase is present in ? phase, the long side of the ? phase is at most 50 ?m, and the long side of the ? phase is at most 25 ?m.

Abstract: This free-cutting copper alloy casting contains: 76.0-79.0% Cu, 3.1-3.6% Si, 0.36-0.85% Sn, 0.06-0.14% P, 0.022-0.10% Pb, with the remainder being made up of Zn and unavoidable impurities. This composition satisfies the following relations: 75.5?f1=Cu+0.8×Si?7.5×Sn+P+0.5×Pb?78.7, 60.8?f2=Cu?4.5×Si—0.8×Sn?P+0.5×Pb?62.2, 0.09?f3=P/Sn?0.35. The area ratios (%) of the constituent phases satisfy the following relations, 30???63, 0???2.0, 0???0.3, 0???2.0, 96.5?f4=?+?, 99.3?f5=?+?+?+?, 0?f6=?+??3.0, and 37?f7=1.05×?+6×?1/2+0.5×??72. The ? phase is present within the ? phase, the long side of the ? phase does not exceed 50 ?m, and the long side of the ? phase does not exceed 25 ?m.

Abstract: A device includes a sample rack having a mounting region for mounting a sample plate that holds a sample, a housing in which a temperature adjustment space for adjusting a temperature of the sample plate mounted on the sample rack while accommodating the sample rack inside is provided therein, and the housing having, in a lateral surface, a rack insertion opening through which the sample rack is inserted into the temperature adjustment space; and an air temperature adjustment part having an air intake port for taking in air in the temperature adjustment space, a temperature adjustment element for cooling or heating air taken in from the air intake portion, and an outlet for blowing out air cooled or heated by the temperature adjustment element.

Abstract: To suppress generation of dew condensation in temperature control space when heating temperature control is performed. In an apparatus, an air temperature control part for cooling or heating air in temperature control space has a first temperature control element for performing at least cooling of air, and a second temperature control element for performing at least heating of air downstream of the first temperature control element. In this manner, when heating temperature control is performed, cooling and dehumidification of air taken in from an air intake portion can be performed by the first temperature control element, and then heating of the dehumidified air can be performed by the second temperature control element.

Abstract: This free-cutting copper alloy contains more than 77.0% but less than 81.0% Cu, more than 3.4% but less than 4.1% Si, 0.07% to 0.28% Sn, 0.06% to 0.14% P, and more than 0.02% but less than 0.25% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 1.0?f0=100×Sn/(Cu+Si+0.5×Pb+0.5×P?75.5)?3.7, 78.5?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?83.0, 61.8?f2=Cu?4.2×Si?0.5×Sn?2×P?63.7. The area ratios (%) of the constituent phases satisfy the following relations, 36???72, 0???2.0, 0???0.5, 0???2.0, 96.5?f3=?+?, 99.4?f4=?+?+?+?, 0?f5=?+??3.0, 38?f6=?+6×?1/2+0.5×??80. The long side of the ? phase does not exceed 50 ?m, and the long side of the ? phase does not exceed 25 ?m.

Abstract: A seat includes a backrest, and a fan that is installed on the backrest at a position corresponding to a height of a head of a sitter sitting on the seat and generates an airflow flowing from a front toward a rear of the backrest. The seat may further include a sitter detector that detects the height of the head of the sitter, a lifting-and-lowering motor that adjusts a height of the fan, and a lifting-and-lowering controller that controls the lifting-and-lowering motor. The lifting-and-lowering controller may control the lifting-and-lowering motor to adjust the height of the fan to the height of the head of the sitter detected by the sitter detector.

Abstract: A semiconductor device including an SRAM capable of sensing a defective memory cell that does not satisfy desired characteristics is provided. The semiconductor device includes a memory cell, a bit line pair being coupled to the memory cell and having a voltage changed towards a power-supply voltage and a ground voltage in accordance with data of the memory cell in a read mode, and a specifying circuit for specifying a bit line out of the bit line pair. In the semiconductor device, a wiring capacitance is coupled to the bit line specified by the specifying circuit and a voltage of the specified bit line is set to a voltage between a power voltage and a ground voltage in a test mode.

Abstract: [Problem] To provide a method for efficiently producing a sulfide solid electrolyte using a liquid-phase method. [Solution to Problem] A method for producing a sulfide solid electrolyte not using a pulverizer in reacting raw materials, wherein a raw material that contains lithium sulfide, a phosphorus compound and a halogen compound, and a complexing agent are stirred in a reactor while a fluid that contains the contents in the reactor is discharged outside the reactor through a discharging port arranged in the reactor and the fluid that contains the discharged contents is returned back to the reactor through a returning port arranged in the reactor to thereby make the contents-containing fluid circulate therethrough.

Abstract: The invention is to provide a novel method for producing a solid electrolyte having a high ionic conductivity according to a liquid-phase method. The production method for a solid electrolyte includes mixing a raw material inclusion containing a lithium atom, a sulfur atom, a phosphorus atom and a halogen atom with a complexing agent and a solvent, wherein the amount of the complexing agent is 0.1 mL or more and 4.0 mL or less relative to 1 g of the total mass of the raw material inclusion.

Abstract: To suppress inflow of external air through a rack insertion opening while a sample rack is pulled out. An apparatus includes a housing, a temperature control space, and an air temperature control part. The housing has the rack insertion opening on one side surface for putting in and taking out the sample rack. The air temperature control part has an air intake portion for intake of air in the temperature control space, a fan for blowing air taken in from the air intake portion toward the sample rack accommodated in the temperature control space, and a cooling element provided to cool the air on a path of air taken in from the air intake portion. The air temperature control part is configured to reduce an amount of air flowing near the rack insertion opening while the sample rack is pulled out from the temperature control space as compared to while the sample rack is accommodated in the temperature control space, so as to suppress inflow of air through the rack insertion opening.

Abstract: This free-cutting copper alloy contains 76.0%-79.0% Cu, 3.1%-3.6% Si, 0.36%-0.84% Sn, 0.06%-0.14% P, 0.022%-0.10% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 74.4?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?78.2, 61.2?f2=Cu?4.4×Si?0.7×Sn?P+0.5×Pb?62.8, 0.09?f3=P/Sn?0.35. The area ratio (%) of the constituent phases satisfies the following relations: 30???65, 0???2.0, 0???0.3, 0???2.0, 96.5?f4=?+?, 99.4?f5=?+?+?+?, 0?f6=?+??3.0, 36?f7=1.05×?+6×?1/2+0.5×??72. The ? phase is present within the ? phase, the long side of the ? phase does not exceed 50 ?m, and the long side of the ? phase does not exceed 25 ?m.

Abstract: An object of the present invention is to provide a compound having an anti-inflammatory activity or a pharmacologically acceptable salt thereof. The solution of the present invention is a compound of general formula (1) or a pharmacologically acceptable salt thereof. wherein the symbols in the formula are defined below: R1: e.g., a C1-C6 alkyl group; R2: a C1-C6 alkyl group; A: e.g., an oxygen atom; and R3: e.g., a C1-C6 alkyl group.

Abstract: An embodiment of the present invention controls a mobile body device to carry out a natural action. A mobile body control device (1) includes: an image acquiring section (21) configured to acquire an image of a surrounding environment of a specific mobile body device; and a control section (2) which is configured to (i) refer to the image and infer, in accordance with the image, a scene in which the specific mobile body device is located, (ii) determine an action in accordance with the scene inferred, and (iii) control the mobile body device to carry out the action determined.

Abstract: A device includes a sample rack having a mounting region for mounting a sample plate that holds a sample, a housing in which a temperature adjustment space for adjusting a temperature of the sample plate mounted on the sample rack while accommodating the sample rack inside is provided therein, and the housing having, in a lateral surface, a rack insertion opening through which the sample rack is inserted into the temperature adjustment space; and an air temperature adjustment part having an air intake port for taking in air in the temperature adjustment space, a temperature adjustment element for cooling or heating air taken in from the air intake portion, and an outlet for blowing out air cooled or heated by the temperature adjustment element.

Abstract: A resin tube is prepared. Further, a formation tool having a pressing surface and a projection that projects from the pressing surface and is insertable into the resin tube is prepared. The projection of the formation tool is inserted from an end of the resin tube into the resin tube. The pressing surface of the formation tool is pressed against an end surface of the resin tube. Thermal energy is applied to the end of the resin tube, whereby a shape of the pressing surface of the formation tool is transferred to the end surface of the resin tube, and the end of the resin tube is formed into a flange shape.