Patents by Inventor Shinya Katou

Shinya Katou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10233324
    Abstract: An epoxy resin composition, the epoxy resin composition including components (A1) to (C1) described below, wherein the content of the component (B1) is 8 to 20 parts by mass relative to 100 parts by mass of the component (A1), and the content of the component (C1) is 12 to 110 parts by mass relative to 100 parts by mass of the component (A1): component (A1): an epoxy resin; component (B1): a boron trihalide-amine complex; and component (C1): rubber particles.
    Type: Grant
    Filed: June 5, 2013
    Date of Patent: March 19, 2019
    Assignee: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Yukihiro Harada, Satoshi Okamoto, Kenta Narumori, Tomoo Sano, Akihiro Ito, Masayuki Sugiura, Tatsuhiro Kishikawa, Shinya Katou, Sanae Kita
  • Publication number: 20170369700
    Abstract: An epoxy resin composition suitable for molding a fiber-reinforced plastic molded article is provided. The molded article has exceptional mechanical properties. In particular, a tubular molded article has high breaking strength. The epoxy resin composition contains components (A), (C), and (D), where component (A) is an epoxy resin of a particular formula, component (C) is an epoxy resin other than component (A) that is liquid at 25° C., and component (D) is a curing agent.
    Type: Application
    Filed: December 17, 2015
    Publication date: December 28, 2017
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Hirokazu MITOBE, Kenichi WATANABE, Tomoko ISHIMOTO, Shinya KATOU
  • Patent number: 9190309
    Abstract: In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release substrate from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased and the wafer processing tape can be suppressed from being peeled off from the wafer ring during processes.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: November 17, 2015
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Kouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta, Rie Katou
  • Publication number: 20150279717
    Abstract: In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release substrate from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased and the wafer processing tape can be suppressed from being peeled off from the wafer ring during processes.
    Type: Application
    Filed: June 16, 2015
    Publication date: October 1, 2015
    Inventors: Kouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta, Rie Katou
  • Patent number: 9076833
    Abstract: In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release substrate from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased and the wafer processing tape can be suppressed from being peeled off from the wafer ring during processes.
    Type: Grant
    Filed: October 12, 2011
    Date of Patent: July 7, 2015
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Kouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta, Rie Katou
  • Patent number: 9076832
    Abstract: In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release base material from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased. Methods of manufacturing the tape and a semiconductor device are also provided.
    Type: Grant
    Filed: October 14, 2011
    Date of Patent: July 7, 2015
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Kouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta, Rie Katou
  • Publication number: 20150148451
    Abstract: An epoxy resin composition, the epoxy resin composition including components (A1) to (C1) described below, wherein the content of the component (B1) is 8 to 20 parts by mass relative to 100 parts by mass of the component (A1), and the content of the component (C1) is 12 to 110 parts by mass relative to 100 parts by mass of the component (A1): component (A1): an epoxy resin; component (B1): a boron trihalide-amine complex; and component (C1): rubber particles.
    Type: Application
    Filed: June 5, 2013
    Publication date: May 28, 2015
    Applicant: MITSUBISHI RAYON CO., LTD.
    Inventors: Yukihiro Harada, Satoshi Okamoto, Kenta Narumori, Tomoo Sano, Akihiro Ito, Masayuki Sugiura, Tatsuhiro Kishikawa, Shinya Katou, Sanae Kita
  • Patent number: 9011624
    Abstract: A method for manufacturing an adhesive sheet according to the present invention is a method for manufacturing an adhesive sheet including a long peeling base material 1 and an adhesive layer 2 provided on the peeling base material 1 in the form of an island, the method including a peeling step of, after laminating a long adhesive layer 2 on the peeling base material 1, peeling off an unnecessary portion 6 of the adhesive layer 2 so that a predetermined portion of the adhesive layer is left on the peeling base material 1 in the form of an island, wherein, in the peeling step, the width W of a narrow portion 8, which is the narrowest in width in a short direction of the unnecessary portion 6 of the adhesive layer 2, is adjusted so that the breaking strength in the narrow portion 8 is 200 g or more.
    Type: Grant
    Filed: July 9, 2010
    Date of Patent: April 21, 2015
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Ryoji Furutani, Takahiro Tokuyasu, Shinya Katou, Rie Katou, Tomohito Yuasa, Kouji Komorida, Tatsuya Sakuta
  • Patent number: 8975161
    Abstract: A dicing/die bonding integral film of the present invention includes a base film, a pressure-sensitive adhesive layer which is formed on the base film and to which a wafer ring for blade dicing is bonded, and a bonding layer formed on the adhesive layer and having a central portion to which a semiconductor wafer to be diced is bonded, wherein a planar shape of the bonding layer is circular, an area of the bonding layer is greater than an area of the semiconductor wafer and smaller than an area of each of the base film and the adhesive layer, and a diameter of the bonding layer is greater than a diameter of the semiconductor wafer and less than an inner diameter of the wafer ring, and a difference in diameter between the bonding layer and the semiconductor wafer is greater than 20 mm and less than 35 mm.
    Type: Grant
    Filed: July 13, 2011
    Date of Patent: March 10, 2015
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Rie Katou, Takayuki Matsuzaki, Shinya Katou, Ryoji Furutani, Tatsuya Sakuta, Kouji Komorida
  • Publication number: 20130273718
    Abstract: In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release substrate from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased and the wafer processing tape can be suppressed from being peeled off from the wafer ring during processes.
    Type: Application
    Filed: October 12, 2011
    Publication date: October 17, 2013
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Kouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta, Rie Katou
  • Publication number: 20130143390
    Abstract: A dicing/die bonding integral film of the present invention includes a base film, a pressure-sensitive adhesive layer which is formed on the base film and to which a wafer ring for blade dicing is bonded, and a bonding layer formed on the adhesive layer and having a central portion to which a semiconductor wafer to be diced is bonded, wherein a planar shape of the bonding layer is circular, an area of the bonding layer is greater than an area of the semiconductor wafer and smaller than an area of each of the base film and the adhesive layer, and a diameter of the bonding layer is greater than a diameter of the semiconductor wafer and less than an inner diameter of the wafer ring, and a difference in diameter between the bonding layer and the semiconductor wafer is greater than 20 mm and less than 35 mm,
    Type: Application
    Filed: July 13, 2011
    Publication date: June 6, 2013
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Rie Katou, Takayuki Matsuzaki, Shinya Katou, Ryoji Furutani, Tatsuya Sakuta, Kouji Komorida
  • Publication number: 20120171475
    Abstract: A method for manufacturing an adhesive sheet according to the present invention is a method for manufacturing an adhesive sheet including a long peeling base material 1 and an adhesive layer 2 provided on the peeling base material 1 in the form of an island, the method including a peeling step of, after laminating a long adhesive layer 2 on the peeling base material 1, peeling off an unnecessary portion 6 of the adhesive layer 2 so that a predetermined portion of the adhesive layer is left on the peeling base material 1 in the form of an island, wherein, in the peeling step, the width W of a narrow portion 8, which is the narrowest in width in a short direction of the unnecessary portion 6 of the adhesive layer 2, is adjusted so that the breaking strength in the narrow portion 8 is 200 g or more.
    Type: Application
    Filed: July 9, 2010
    Publication date: July 5, 2012
    Inventors: Ryoji Furutani, Takahiro Tokuyasu, Shinya Katou, Rie Katou, Tomohito Yuasa, Kouji Komorida, Tatsuya Sakuta
  • Publication number: 20120094471
    Abstract: In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release base material from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased. Methods of manufacturing the tape and a semiconductor device are also provided.
    Type: Application
    Filed: October 14, 2011
    Publication date: April 19, 2012
    Inventors: Kouhei TANIGUCHI, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta, Rie Katou
  • Patent number: D656909
    Type: Grant
    Filed: April 15, 2011
    Date of Patent: April 3, 2012
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Kouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta, Rie Katou
  • Patent number: D664511
    Type: Grant
    Filed: April 15, 2011
    Date of Patent: July 31, 2012
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Kouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta, Rie Katou
  • Patent number: D664512
    Type: Grant
    Filed: April 15, 2011
    Date of Patent: July 31, 2012
    Assignee: Hitachi Chemical Comapany, Ltd.
    Inventors: Kouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta, Rie Katou
  • Patent number: D680505
    Type: Grant
    Filed: February 16, 2012
    Date of Patent: April 23, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Kouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta, Rie Katou
  • Patent number: D689831
    Type: Grant
    Filed: February 16, 2012
    Date of Patent: September 17, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Kouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta, Rie Katou
  • Patent number: D804435
    Type: Grant
    Filed: May 20, 2014
    Date of Patent: December 5, 2017
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Kouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta, Rie Katou
  • Patent number: D690278
    Type: Grant
    Filed: February 16, 2012
    Date of Patent: September 24, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Kouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta, Rie Katou