Adhesive tape for semiconductor manufacturing

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Description

FIG. 1 is a top plan view of a first embodiment of our new design;

FIG. 2 is a bottom plan view of the first embodiment;

FIG. 3 is a left side view of the first embodiment;

FIG. 4 is a right side view of the first embodiment;

FIG. 5 is a rear side view of the first embodiment;

FIG. 6 is a front side view of the first embodiment;

FIG. 7 is a cross-sectional view of the first embodiment taken at line 7-7 of FIG. 1;

FIG. 8 is an exploded view of the first embodiment;

FIG. 9 is an enlarged view of the lower and left portion of the claimed design shown in FIG. 1 for completeness of illustration.

FIG. 10 is a top plan view of a second embodiment of our new design;

FIG. 11 is a bottom plan view of the second embodiment;

FIG. 12 is a left side view of the second embodiment;

FIG. 13 is a right side view of the second embodiment;

FIG. 14 is a rear side view of the second embodiment;

FIG. 15 is a front side view of the second embodiment;

FIG. 16 is a cross-sectional view of the second embodiment taken at line 16-16 of FIG. 10;

FIG. 17 is an exploded view of the second embodiment;

FIG. 18 is an enlarged view of the lower and left portion of the claimed design shown in FIG. 10 for completeness of illustration.

FIG. 19 is a top plan view of a third embodiment of our new design;

FIG. 20 is a bottom plan view of the third embodiment;

FIG. 21 is a left side view of the third embodiment;

FIG. 22 is a right side view of the third embodiment;

FIG. 23 is a rear side view of the third embodiment;

FIG. 24 is a front side view of the third embodiment;

FIG. 25 is a cross-sectional view of the third embodiment taken at line 25-25 of FIG. 19;

FIG. 26 is an exploded view of the third embodiment; and,

FIG. 27 is an enlarged view of the lower and left portion of the claimed design shown in FIG. 19 for completeness of illustration.

Claims

The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.

Referenced Cited
U.S. Patent Documents
D194932 April 1963 Masuda
D228439 September 1973 Mercadante
D287683 January 13, 1987 Unger
D392330 March 17, 1998 Sucese
D395641 June 30, 1998 Gaete
D480811 October 14, 2003 Horhota et al.
D490470 May 25, 2004 Fujii
D490854 June 1, 2004 Fujii
D490855 June 1, 2004 Fujii
D491226 June 8, 2004 Fujii
D491227 June 8, 2004 Fujii
D491228 June 8, 2004 Fujii
D491229 June 8, 2004 Fujii
D492354 June 29, 2004 Fujii
D493838 August 3, 2004 Fujii
D529096 September 26, 2006 Jordan
D544607 June 12, 2007 Henry et al.
D621051 August 3, 2010 Kase et al.
D621803 August 17, 2010 Maruyama et al.
D628170 November 30, 2010 Maruyama et al.
Foreign Patent Documents
D1315621 November 2007 JP
Other references
  • U.S. Appl. No. 29/389,790, filed Apr. 15, 2011, Taniguchi et al.
  • U.S. Appl. No. 29/389,794, filed Apr. 15, 2011, Taniguchi et al.
  • U.S. Appl. No. 29/389,797, filed Apr. 15, 2011, Taniguchi et al.
Patent History
Patent number: D656909
Type: Grant
Filed: Apr 15, 2011
Date of Patent: Apr 3, 2012
Assignee: Hitachi Chemical Company, Ltd. (Tokyo)
Inventors: Kouhei Taniguchi (Ichihara), Takayuki Matsuzaki (Ichihara), Shinya Katou (Ichihara), Kouji Komorida (Ichihara), Michio Mashino (Ichihara), Tatsuya Sakuta (Ichihara), Rie Katou (Ichihara)
Primary Examiner: Austin Murphy
Attorney: Miles and Stockbridge P.C.
Application Number: 29/389,788