Adhesive tape for semiconductor manufacturing
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Claims
The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.
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- U.S. Appl. No. 29/389,790, filed Apr. 15, 2011, Taniguchi et al.
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Type: Grant
Filed: Apr 15, 2011
Date of Patent: Apr 3, 2012
Assignee: Hitachi Chemical Company, Ltd. (Tokyo)
Inventors: Kouhei Taniguchi (Ichihara), Takayuki Matsuzaki (Ichihara), Shinya Katou (Ichihara), Kouji Komorida (Ichihara), Michio Mashino (Ichihara), Tatsuya Sakuta (Ichihara), Rie Katou (Ichihara)
Primary Examiner: Austin Murphy
Attorney: Miles and Stockbridge P.C.
Application Number: 29/389,788