Patents by Inventor Shoriki Narita
Shoriki Narita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20220410322Abstract: A bead appearance inspection device includes an acquisition unit that acquires input data related to a welding bead, a storage unit that stores a first determination standard and a second determination standard used for an inspection of a defect of the welding bead, a first determination unit that executes a first inspection determination on the welding bead, and k second determination units, where k is an integer of 1 or more, that execute a second inspection determination on the welding bead. An appearance inspection result of the welding bead is created and output by using a determination result indicating whether a first inspection result acquired by the first inspection determination satisfies the first determination standard and a determination result indicating whether a second inspection result satisfies the second determination standard.Type: ApplicationFiled: September 1, 2022Publication date: December 29, 2022Inventors: Toshinari MOHRI, Shoriki NARITA, Katsuaki OKUMA, Takamichi KOMATSU
-
Patent number: 7806642Abstract: In a receiver for component feed plates for housing, in multi-stage stacks, a plurality of component feed plates with a plurality of components placed thereon, identification mark portions are formed so as to be placed at end portions or their proximities of support guide portions in a plate feed direction so that each paired set of support guide portions out of individual support guide portions can be distinguished from the other paired sets of support guide portions and moreover visually discerned in the plate feed direction.Type: GrantFiled: April 20, 2005Date of Patent: October 5, 2010Assignee: Panasonic CorporationInventors: Shoriki Narita, Kenichi Ishida, Shuichi Hirata, Satoshi Shida
-
Patent number: 7797820Abstract: In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.Type: GrantFiled: March 6, 2008Date of Patent: September 21, 2010Assignee: Panasonic CorporationInventors: Satoshi Shida, Shinji Kanayama, Shunji Onobori, Shuichi Hirata, Mamoru Nakao, Kunio Oe, Akira Kugihara, Shoriki Narita, Yoshitaka Etoh, Hiroshi Haji
-
Patent number: 7731469Abstract: According to the type of the plate placed in a plate placing device of a component feeder, appropriate holding operation and expanding operation are performed selectively and automatically according to the type of the plate by regulating the lowered position of a plate pressurizing member for the tray feeding plate to securely hold the plate and performing wafer expanding while securely holding the wafer feeding plate by releasing the regulation of the lowered position for the wafer feeding plate.Type: GrantFiled: November 28, 2003Date of Patent: June 8, 2010Assignee: Panasonic CorporationInventors: Shoriki Narita, Kanji Hata, Shuichi Hirata, Satoshi Shida, Mamoru Nakao
-
Publication number: 20100064510Abstract: A suction nozzle (65) of a reversing head device (22) has a distal end surface (65a) with a suction hole (65b) opened therein, and a suction passage (65c) communicated with the suction hole (65b) at one end thereof. A portion of the distal end surface (65a) outside of the suction hole (65b) abuts against bumps (39) of an electronic component (12). The suction hole (65b) is opposed with a gap to a portion of a mounting side surface (12a) where no bumps (39) are present. A vacuum pump (65) creates an air flow that flows from the gap between the suction hole (65b) and the mounting side surface (12a) into the suction passage (65c) through the suction hole (65b). The electronic component (12) is held at the distal end surface (65a) by a negative pressure generated by the air flow.Type: ApplicationFiled: November 27, 2009Publication date: March 18, 2010Inventors: Shoriki NARITA, Satoshi SHIDA, Yasuharu UENO, Makoto MORIKAWA, Hironori KOBAYASHI, Shuichi HIRATA
-
Patent number: 7650691Abstract: A suction nozzle (65) of a reversing head device (22) has a distal end surface (65a) with a suction hole (65b) opened therein, and a suction passage (65c) communicated with the suction hole (65b) at one end thereof. A portion of the distal end surface (65a) outside of the suction hole (65b) abuts against bumps (39) of an electronic component (12). The suction hole (65b) is opposed with a gap to a portion of a mounting side surface (12a) where no bumps (39) are present. A vacuum pump (65) creates an air flow that flows from the gap between the suction hole (65b) and the mounting side surface (12a) into the suction passage (65c) through the suction hole (65b). The electronic component (12) is held at the distal end surface (65a) by a negative pressure generated by the air flow.Type: GrantFiled: May 16, 2005Date of Patent: January 26, 2010Assignee: Panasonic CorporationInventors: Shoriki Narita, Satoshi Shida, Yasuharu Ueno, Makoto Morikawa, Hironori Kobayashi, Shuichi Hirata
-
Patent number: 7552528Abstract: In slack removal processing for removing slack generated on a wafer sheet by heating blow, a wafer feeding plate is positioned at a height position between a first height position and a second height position. This makes it possible to decrease a gap between an upper end portion of an expanding ring and a lower face of the wafer sheet and allows efficient and uniform processing. Moreover, setting the height position so as to avoid the contact between the wafer sheet and the upper end portion of the expanding ring at least when the slack removal processing is completed reliably prevents shrinking operation of the wafer sheet from being disturbed by the contact between the wafer sheet and the upper end portion.Type: GrantFiled: May 19, 2005Date of Patent: June 30, 2009Assignee: Panasonic CorporationInventors: Shoriki Narita, Shuichi Hirata, Takafumi Tsujisawa, Hirokuni Miyazaki, Satoshi Shida
-
Patent number: 7516878Abstract: A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device. ICs formed on the semiconductor wafer are divided into basic blocks. Bump formation is performed continuously for the ICs included in one basic block. Positional recognition for the other basic blocks is performed only when the bump formation operation is shifted from one basic block to another basic block. Thus, in comparison with the conventional art whereby a positional recognition operation is performed every time bumps are formed on each IC, the number of times of performing positional recognition is greatly reduced, so that productivity can be improved.Type: GrantFiled: December 27, 2005Date of Patent: April 14, 2009Assignee: Panasonic CorporationInventors: Shoriki Narita, Masahiko Ikeya, Yasutaka Tsuboi, Takaharu Mae, Shinji Kanayama
-
Patent number: 7452315Abstract: Step portions with an L-shaped section each having a vertical restriction surface and a horizontal engagement surface are provided on both sides of a main body portion of a tool. On one side of a holding portion placing and holding a mounted tool to be exchanged, a first engagement member has a first engagement projection piece that opposes the engagement surface of one of the step portions, and has an end surface in abutment against the restriction surface. On the other side of the holding portion, a second engagement member has a second engagement projection piece having its intermediate part opposed to the engagement surface of the other of the step portions, and end surfaces on both sides are in abutment against the outer periphery of the main both portion on both sides thereof. The first and second engagement members are movable between an engagement position and a withdrawal position with respect to the step portions.Type: GrantFiled: November 1, 2007Date of Patent: November 18, 2008Assignee: Panasonic CorporationInventors: Kanji Hata, Shoriki Narita
-
Publication number: 20080179378Abstract: A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and transfer device and a control device are provided. A wafer, after having bumps formed thereon, is held by the load and transfer device and arranged above the bonding stage through control by the control device, so that a temperature drop of the wafer is controlled. Accordingly, generation of troubles such as a crack because of thermal stress and the like can be prevented to even compound semiconductor wafers sensitive to a temperature change.Type: ApplicationFiled: October 31, 2007Publication date: July 31, 2008Inventors: Makoto Imanishi, Shoriki Narita, Masahiko Ikeya, Shinji Kanayama, Takaharu Mae
-
Publication number: 20080163481Abstract: In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.Type: ApplicationFiled: March 6, 2008Publication date: July 10, 2008Inventors: Satoshi Shida, Shinji Kanayama, Shunji Onobori, Shuichi Hirata, Mamoru Nakao, Kunio Oe, Akira Kugihara, Shoriki Narita, Yoshitaka Etoh, Hiroshi Haji
-
Publication number: 20080141526Abstract: In component feeding head apparatus, a head unit having a holding unit for releasably holding a component and a rotating unit for rotating the holding unit around its center of axis is set as an object of an up-and-down operation and an inverting operation, and a head lifting device for moving the head unit up and down and a head inverting device for inverting the head unit are provided as constructions independent from the head unit that is the object.Type: ApplicationFiled: February 11, 2008Publication date: June 19, 2008Inventors: Shoriki Narita, Shuichi Hirata, Kanji Hata, Hirokuni Miyazaki, Youhei Matsumoto
-
Patent number: 7387229Abstract: A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and transfer device and a control device are provided. A wafer, after having bumps formed thereon, is held by the load and transfer device and arranged above the bonding stage through control by the control device, so that a temperature drop of the wafer is controlled. Accordingly, generation of troubles such as a crack because of thermal stress and the like can be prevented to even compound semiconductor wafers sensitive to a temperature change.Type: GrantFiled: January 22, 2004Date of Patent: June 17, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Makoto Imanishi, Shoriki Narita, Masahiko Ikeya, Shinji Kanayama, Takaharu Mae
-
Patent number: 7353596Abstract: In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board. The component mounting process includes supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.Type: GrantFiled: March 18, 2004Date of Patent: April 8, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Satoshi Shida, Shinji Kanayama, Shunji Onobori, Shuichi Hirata, Mamoru Nakao, Kunio Oe, Akira Kugihara, Shoriki Narita, Yoshitaka Etoh, Hiroshi Haji
-
Patent number: 7350289Abstract: In component feeding head apparatus, a head unit having a holding unit for releasably holding a component and a rotating unit for rotating the holding unit around its center of axis is set as an object of an up-and-down operation and an inverting operation, and a head lifting device for moving the head unit up and down and a head inverting device for inverting the head unit are provided as constructions independent from the head unit that is the object.Type: GrantFiled: December 1, 2003Date of Patent: April 1, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shoriki Narita, Shuichi Hirata, Kanji Hata, Hirokuni Miyazaki, Youhei Matsumoto
-
Patent number: 7350684Abstract: A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage (316) through controlling the heating by a controller (317).Type: GrantFiled: April 26, 2005Date of Patent: April 1, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shoriki Narita, Koichi Yoshida, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama, Makoto Imanishi, Kazushi Higashi, Kenji Fukumoto, Hiroshi Wada
-
Publication number: 20080058186Abstract: Step portions with an L-shaped section each having a vertical restriction surface and a horizontal engagement surface are provided on both sides of a main body portion of a tool. On one side of a holding portion placing and holding a mounted tool to be exchanged, a first engagement member has a first engagement projection piece that opposes the engagement surface of one of the step portions, and has an end surface in abutment against the restriction surface. On the other side of the holding portion, a second engagement member has a second engagement projection piece having its intermediate part opposed to the engagement surface of the other of the step portions, and end surfaces on both sides are in abutment against the outer periphery of the main both portion on both sides thereof. The first and second engagement members are movable between an engagement position and a withdrawal position with respect to the step portions.Type: ApplicationFiled: November 1, 2007Publication date: March 6, 2008Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Kanji HATA, Shoriki NARITA
-
Publication number: 20080040917Abstract: A suction nozzle 65 of a reversing head device 22 has a distal end surface 65a with a suction hole 65b opened therein, and a suction passage 65c communicated with the suction hole 65b at one end thereof. A portion of the distal end surface 65a outside of the suction hole 65b abuts against bumps 39 of an electronic component 12. The suction hole 65b is opposed with a gap to a portion of a mounting side surface 12a where no bumps 39 are present. A vacuum pump 65 creates an air flow that flows from the gap between the suction hole 65b and mounting side surface 12a into the suction passage 65c through the suction hole 65b. The electronic component 12 is held at the distal end surface 65a by a negative pressure generated by the air flow.Type: ApplicationFiled: May 16, 2005Publication date: February 21, 2008Inventors: Shoriki Narita, Satoshi Shida, Yasuharu Ueno, Makoto Morikawa, Hironori Kobayashi, Shuichi Hirata
-
Publication number: 20080010818Abstract: In slack removal processing for removing slack generated on a wafer sheet by heating blow, a wafer feeding plate is positioned at a height position between a first height position and a second height position. This makes it possible to decrease a gap between an upper end portion of an expanding ring and a lower face of the wafer sheet and allows efficient and uniform processing. Moreover, setting the height position so as to avoid the contact between the wafer sheet and the upper end portion of the expanding ring at least when the slack removal processing is completed reliably prevents shrinking operation of the wafer sheet from being disturbed by the contact between the wafer sheet and the upper end portion.Type: ApplicationFiled: May 19, 2005Publication date: January 17, 2008Inventors: Shoriki Narita, Shuichi Hirata, Takafumi Tsujisawa, Hirokuni Miyazaki, Satoshi Shida
-
Patent number: 7306551Abstract: Step portions with an L-shaped section each having a vertical restriction surface and a horizontal engagement surface are provided on both sides of a main body portion of a tool. On one side of a holding portion placing and holding a mounted tool to be exchanged, a first engagement member has a first engagement projection piece that opposes the engagement surface of one of the step portions, and has an end surface in abutment against the restriction surface. On the other side of the holding portion, a second engagement member has a second engagement projection piece having its intermediate part opposed to the engagement surface of the other of the step portions, and end surfaces on both sides are in abutment against the outer periphery of the main both portion on both sides thereof. The first and second engagement members are movable between an engagement position and a withdrawal position with respect to the step portions.Type: GrantFiled: December 4, 2003Date of Patent: December 11, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kanji Hata, Shoriki Narita