Abstract: A semiconductor device includes a package structure, a first heat spreader, and a second heat spreader. The first heat spreader is aside the package structure. The second heat spreader is in physical contact with the first heat spreader. The second heat spreader covers a top surface and sidewalls of the package structure. A material of the first heat spreader is different from a material of the second heat spreader.

Abstract: Some embodiments relate to a semiconductor structure. The semiconductor structure includes a first substrate including a first plurality of conductive pads that are laterally spaced apart from one another on the first substrate. A first plurality of conductive bumps are disposed on the first plurality of conductive pads, respectively. A multi-tiered solder-resist structure is disposed on the first substrate and arranged between the first plurality of conductive pads. The multi-tiered solder-resist structure has different widths at a different heights over the first substrate and contacts sidewalls of the first plurality of conductive bumps to separate the first plurality of conductive bumps from one another.

Abstract: A multi-chip device includes a first material within a substrate. The first material has a first coefficient of thermal expansion different than a second coefficient of thermal expansion of the substrate. A first chip overlies a first portion of the first material and a first portion of the substrate. A second chip overlies a second portion of the first material and a second portion of the substrate. The first material is between the first portion of the substrate and the second portion of the substrate.

Abstract: A method for fabricating semiconductor devices includes forming channel regions over a substrate. The channel regions, in parallel with one another, extend along a first lateral direction. Each channel region includes at least a respective pair of epitaxial structures. The method includes forming a gate structure over the channel regions, wherein the gate structure extends along a second lateral direction. The method includes removing, through a first etching process, a portion of the gate structure that was disposed over a first one of the channel regions. The method includes removing, through a second etching process, a portion of the first channel region. The second etching process includes one silicon etching process and one silicon oxide deposition process. The method includes removing, through a third etching process controlled based on a pulse signal, a portion of the substrate that was disposed below the removed portion of the first channel region.

Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.

Abstract: Provided is a method for diagnosing and monitoring progression of cancer or effectiveness of a therapeutic treatment. The method includes detecting a methylation level of at least one gene in a biological sample containing circulating free DNA. Also provided are primer pairs and probes for diagnosis or prognosis of cancer in a subject in need thereof.

Abstract: A photographing optical lens assembly includes, in order from an object side to an image side along an optical axis, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element has positive refractive power. The second lens element has negative refractive power. The third lens element has an object-side surface being convex in a paraxial region thereof.

Abstract: A semiconductor device includes a substrate, a package structure, a first heat spreader, and a second heat spreader. The package structure is disposed on the substrate. The first heat spreader is disposed on the substrate. The first heat spreader surrounds the package structure. The second heat spreader is disposed on the package structure. The second heat spreader is connected to the first heat spreader. A material of the first heat spreader is different from a material of the second heat spreader.

Abstract: A lock device adapted for a first object and a second object movable relative to the first object includes a slider, a driving module, a latch and a power module. The driving module can drive the slider to move between a locking position and an unlocking position. The latch is movable relative to the slider. The power module can provide electricity to the driving module. When the second object is located at a retracted position relative to the first object, the driving module can drive the slider to move to the locking position, so that the latch blocks the second object. When the driving module is not driven by the power module, the latch is driven by the second object moving in an opening direction to move from an original state to a non-original state for driving the slider to move from the locking position to the unlocking position.

Abstract: A composite automatic production equipment for in-mold placement process includes a upper stamping mold having a upper die plate and punches, a lower stamping mold having a lower die plate, a punching strip feeding device sending out a punching material strip to the lower stamping mold, an insulating-sheet feeding device feeding out an insulating-film material strip intersecting to the punching material strip. The insulating-film material strip includes a main material strip and insulating sheet sets that are adhesive and detachably arranged along the main material strip. When the upper and lower die plates are closed, the punches punch the punching material strip to form semi-finished products arranged in sequence, and one of the semi-finished products is pressed to adhere to one of the insulating sheet sets. When they are separated, the insulating sheet set on the semi-finished product is torn off from the insulating-film material strip.

Abstract: An electronic lock includes a control circuit module and an electromagnetic mechanism. The electromagnetic mechanism is electrically connected to the control circuit module, and the electromagnetic mechanism includes a driving member and a magnet. The driving member is configured to be driven by the control circuit module to be located at one of a first position and a second position. When the driving member is not driven by the control circuit module, the driving member is configured to be held at one of the first position and the second position by the magnet.

Abstract: A locking mechanism is applicable to an intelligent cabinet system having a first object and a second object movable relative to each other. The second object is configured to be located at one of a retracted position, a predetermined extension position and an open position. The locking mechanism includes a locking member and a driving device. The driving device is configured to drive the locking member to move from a first predetermined position to a second predetermined position. When the second object is moved relative to the first object from the retracted position along a direction and when the locking member is located at the second predetermined position, the locking member is configured to block the second object at the predetermined extension position. The predetermined extension position is located between the retracted position and the open position.

Abstract: A locking device is adapted for a first object and a second object that are movable with respect to each other. The locking device includes a first element and a second element. The first element can be in a locking state or an unlocking state. The second element drives the first element and thereby moves the first element from the locking state to the unlocking state in response to the second object being displaced with respect to the first object from a retracted position to a predetermined position in an opening direction.

Abstract: A lock mechanism is configured to be arranged on one of a first object and a second object movable relative to each other. The lock mechanism includes a driving device and a locking member. The locking member is configured to be driven by the driving device to move between a first position and a second position in a non-rotatable manner. When the locking member is located at the first position, the locking member is configured to lock the other one of the first object and the second object. When the locking member is located at the second position, the locking member is does not lock the other one of the first object and the second object.

Abstract: A locking mechanism is applicable to an intelligent cabinet system having a first object and a second object movable relative to each other. The second object is configured to be located at one of a retracted position, a predetermined extension position and an open position. The locking mechanism includes a locking member and a driving device. The driving device is configured to drive the locking member to move from a first predetermined position to a second predetermined position. When the second object is moved relative to the first object from the retracted position along a direction and when the locking member is located at the second predetermined position, the locking member is configured to block the second object at the predetermined extension position. The predetermined extension position is located between the retracted position and the open position.

Abstract: A composite automatic production equipment for in-mold placement process includes a upper stamping mold having a upper die plate and punches, a lower stamping mold having a lower die plate, a punching strip feeding device sending out a punching material strip to the lower stamping mold, an insulating-sheet feeding device feeding out an insulating-film material strip intersecting to the punching material strip. The insulating-film material strip includes a main material strip and insulating sheet sets that are adhesive and detachably arranged along the main material strip. When the upper and lower die plates are closed, the punches punch the punching material strip to form semi-finished products arranged in sequence, and one of the semi-finished products is pressed to adhere to one of the insulating sheet sets. When they are separated, the insulating sheet set on the semi-finished product is torn off from the insulating-film material strip.

Abstract: An automatic production equipment includes a strip-material feeding device set, a continual stamping die set and a rivet providing mechanism. The strip-material feeding device set feeds a strip material. The continual stamping die set includes a upper stamping die group and a lower stamping die group. The lower stamping die group includes a lower die plate, a strip receiving groove formed on the lower die plate for receiving the strip material, a sliding block slidable on the strip receiving groove, and a guide groove formed on the sliding block to connect to the strip receiving groove. The upper stamping die group includes an upper clamping plate, a pushing lever and a riveting punch. The pushing lever and the riveting punch are located on the upper clamping plate. The rivet providing mechanism is connected to the sliding block, and feeds rivets into the guide groove in order.

Abstract: An automatic production equipment includes a strip-material feeding device set, a continual stamping die set and a rivet providing mechanism. The strip-material feeding device set feeds a strip material. The continual stamping die set includes a upper stamping die group and a lower stamping die group. The lower stamping die group includes a lower die plate, a strip receiving groove formed on the lower die plate for receiving the strip material, a sliding block slidable on the strip receiving groove, and a guide groove formed on the sliding block to connect to the strip receiving groove. The upper stamping die group includes an upper clamping plate, a pushing lever and a riveting punch. The pushing lever and the riveting punch are located on the upper clamping plate. The rivet providing mechanism is connected to the sliding block, and feeds rivets into the guide groove in order.

Abstract: A punching mold device capable of rotating a workpiece includes an upper mold base, a lower mold base opposite to the lower mold base, an indexing rotation plate, a servo motor and a position-fixing element. The lower mold base includes a clamping portion for fixedly clamping a workpiece. The indexing rotation plate is formed with holes which collectively form a circular contour. The servo motor is connected to the indexing rotation plate and the workpiece, and synchronously rotates the indexing rotation plate and the workpiece. The position-fixing element includes a positioning pin which aims towards and is pluggably connected to one of the holes for stopping the rotation of the indexing rotation plate and the workpiece. The upper mold base includes a punching head module aligned with the clamping portion for punching the workpiece.