Abstract: An automatic production equipment includes a strip-material feeding device set, a continual stamping die set and a rivet providing mechanism. The strip-material feeding device set feeds a strip material. The continual stamping die set includes a upper stamping die group and a lower stamping die group. The lower stamping die group includes a lower die plate, a strip receiving groove formed on the lower die plate for receiving the strip material, a sliding block slidable on the strip receiving groove, and a guide groove formed on the sliding block to connect to the strip receiving groove. The upper stamping die group includes an upper clamping plate, a pushing lever and a riveting punch. The pushing lever and the riveting punch are located on the upper clamping plate. The rivet providing mechanism is connected to the sliding block, and feeds rivets into the guide groove in order.

Abstract: A punching mold device capable of rotating a workpiece includes an upper mold base, a lower mold base opposite to the lower mold base, an indexing rotation plate, a servo motor and a position-fixing element. The lower mold base includes a clamping portion for fixedly clamping a workpiece. The indexing rotation plate is formed with holes which collectively form a circular contour. The servo motor is connected to the indexing rotation plate and the workpiece, and synchronously rotates the indexing rotation plate and the workpiece. The position-fixing element includes a positioning pin which aims towards and is pluggably connected to one of the holes for stopping the rotation of the indexing rotation plate and the workpiece. The upper mold base includes a punching head module aligned with the clamping portion for punching the workpiece.

Abstract: A lock mechanism is configured to be arranged on one of a first object and a second object movable relative to each other. The lock mechanism includes a driving device and a locking member. The locking member is configured to be driven by the driving device to move between a first position and a second position in a non-rotatable manner. When the locking member is located at the first position, the locking member is configured to lock the other one of the first object and the second object. When the locking member is located at the second position, the locking member is does not lock the other one of the first object and the second object.

Abstract: A punching mold device capable of rotating a workpiece includes an upper mold base, a lower mold base opposite to the lower mold base, an indexing rotation plate, a servo motor and a position-fixing element. The lower mold base includes a clamping portion for fixedly clamping a workpiece. The indexing rotation plate is formed with holes which collectively form a circular contour. The servo motor is connected to the indexing rotation plate and the workpiece, and synchronously rotates the indexing rotation plate and the workpiece. The position-fixing element includes a positioning pin which aims towards and is pluggably connected to one of the holes for stopping the rotation of the indexing rotation plate and the workpiece. The upper mold base includes a punching head module aligned with the clamping portion for punching the workpiece.

Abstract: A communication device includes a main body, a mother board, a housing and a first antenna. The main body is formed with a rim. The mother board is arranged at a first side of the main body. The housing is mounted on the main body and configured to cover the mother board. An orthogonal projection of the housing onto the main body defines a covering range. The first antenna is electrically connected to the mother board and arranged along the rim of the main body. Wherein, at least one portion of the first antenna is located outside the covering range of the housing.

Abstract: An automatic nut-inserted injection molding system and a method of the same are provided, and the system includes an automatic feeding machine for providing a nut, an air-evacuating device, a robot arm for delivering the nut, and an injection-molding module. The injection-molding module includes a first mold block, a second mold block, an air passage and an air needle. The second mold block is detachably closed with the first mold block for mutually defining a molding cavity. The air needle is partially embedded in the second mold block. The air passage is formed in the second mold block, and respectively connected to the air needle and the air evacuation device.

Abstract: A molding system for directly gas-cooling a molding object includes a cold air provider, two molding parts, a plurality of outlets, at least one air-providing molding part, at least one air passage, and a controller. The two molding parts are closed detachably to co-define a forming cavity therebetween. The outlets are arranged on the air-providing molding part. The air passage is connected to the cold air provider and the outlets. The controller drives the cold air provider to provide cold air to a molding object in the forming cavity directly when the two molding parts are separating.

Abstract: A communication device includes a main body, a mother board, a housing and a first antenna. The main body is formed with a rim. The mother board is arranged at a first side of the main body. The housing is mounted on the main body and configured to cover the mother board. An orthogonal projection of the housing onto the main body defines a covering range. The first antenna is electrically connected to the mother board and arranged along the rim of the main body. Wherein, at least one portion of the first antenna is located outside the covering range of the housing.

Abstract: A housing mounting mechanism for a portable electronic device includes a body, a housing, a mounting member, and a latching member. The housing is detachably mounted to the body. The mounting member is connected to the housing and has at least one mounting portion. The latching member is movably mounted to the body and has at least one latching portion. The at least one latching portion can lock the at least one mounting portion of the mounting member when the latching member is at a first position relative to the body. The at least one mounting portion of the mounting member can disengage from the at least one latching portion after the latching member is displaced to a second position from the first position.

Abstract: A housing mounting mechanism for a portable electronic device includes a body, a housing, a mounting member, and a latching member. The housing is detachably mounted to the body. The mounting member is connected to the housing and has at least one mounting portion. The latching member is movably mounted to the body and has at least one latching portion. The at least one latching portion can lock the at least one mounting portion of the mounting member when the latching member is at a first position relative to the body. The at least one mounting portion of the mounting member can disengage from the at least one latching portion after the latching member is displaced to a second position from the first position.

Abstract: An automatic nut-inserted injection molding system and a method of the same are provided, and the system includes an automatic feeding machine for providing a nut, an air-evacuating device, a robot arm for delivering the nut, and an injection-molding module. The injection-molding module includes a first mold block, a second mold block, an air passage and an air needle. The second mold block is detachably closed with the first mold block for mutually defining a molding cavity. The air needle is partially embedded in the second mold block. The air passage is formed in the second mold block, and respectively connected to the air needle and the air evacuation device.

Abstract: A semiconductor package structure having hollow chamber includes a bottom substrate having a bottom baseboard and a bottom metal layer formed on a disposing area of the bottom baseboard, a connection layer formed on the bottom metal layer, and a top substrate. The bottom metal layer has at least one corner having a first and a second outer lateral surface, and an outer connection surface. A first extension line is formed from a first extreme point of the first outer lateral surface, and a second extension line is formed from a second extreme point of the second outer lateral surface. A first exposing area of the bottom baseboard is formed by connecting the first and second extreme points and a cross point of the first and second extreme points. The top substrate connects to the connection layer to form a hollow chamber between the top and bottom substrates.

Abstract: A process for manufacturing a semiconductor package having a hollow chamber includes providing a bottom substrate having a bottom plate, a ring wall and a slot, wherein the ring wall and the bottom plate form the slot; forming an under ball metallurgy layer on a surface of the ring wall; bumping a plurality of solder balls on a surface of the under ball metallurgy layer, each of the solder balls comprises a diameter, wherein a spacing is spaced apart between two adjacent solder balls; performing reflow soldering to the solder balls for making the solder balls melting and interconnecting to form a connection layer; connecting a top substrate to the bottom substrate, wherein the lot of the bottom substrate is sealed by the top substrate to form a hollow chamber used for accommodating an electronic device.