Abstract: A method for forming a frame attachment interconnect between a substrate and a frame is disclosed. The method can include applying a composite material (e.g., epoxy-glass prepreg) to a surface of a substrate. The composite material can have one or more holes disposed to substantially align with a corresponding pad on the surface of the substrate. A metal disc is placed in each hole of the composite material on top of the corresponding pad. A frame member can be placed on top of the composite material and the metal discs. The frame member can have one or more pads disposed to substantially align with the metal discs. The substrate, composite material, metal discs and frame combination can be cured in a controlled atmosphere that can include a vacuum and a predetermined temperature to create discrete electrical connections between adjacent pads but with each encapsulated and electrically isolated.

Abstract: An X-ray obscuration (XRO) film comprising one or more metallic wire mesh layers and an adjacent layer of indium foil having portions which extend into openings of the wire mesh and in contact with metallic portions thereof. The XRO film can be capable of absorbing at least a portion of X-ray energy thereby creating an interference pattern when the XRO film is coupled with an electronic circuit and placed between an X-ray source and an X-ray detector and subjected to radiographic inspection. The interference pattern can create sufficient visual static to effectively obscure circuit lines in the electronic circuit when subjected to radiographic inspection techniques. The XRO film can be substantially thinner than existing solutions for preventing X-ray inspection with an exemplary embodiment being no more than 5 mils thick. The metallic XRO film can also provide electromagnetic shielding and/or heat dissipation for electronic circuits.

Abstract: A method for making conformal non-planar multi-layer circuitry is described. The method can include providing a substrate having a non-planar surface and depositing a first conformal dielectric layer on the substrate, the first conformal dielectric layer conforming to the non-planar surface of the substrate and having a non-planar surface. The method can also include applying a first conformal circuitry layer on the first conformal dielectric layer. The method can include depositing a second conformal dielectric layer on the first conformal circuitry layer, the second conformal dielectric layer conforming to a non-planar surface of the first conformal circuitry layer, and applying a second conformal circuitry layer on the second conformal dielectric layer. Successive layers can be sequentially deposited. Microvias may provide electrical connections between circuit layers.

Abstract: A method for forming a frame attachment interconnect between a substrate and a frame is disclosed. The method can include applying a composite material (e.g., epoxy-glass prepreg) to a surface of a substrate. The composite material can have one or more holes disposed to substantially align with a corresponding pad on the surface of the substrate. A metal disc is placed in each hole of the composite material on top of the corresponding pad. A frame member can be placed on top of the composite material and the metal discs. The frame member can have one or more pads disposed to substantially align with the metal discs. The substrate, composite material, metal discs and frame combination can be cured in a controlled atmosphere that can include a vacuum and a predetermined temperature to create discrete electrical connections between adjacent pads but with each encapsulated and electrically isolated.

Abstract: A venting member includes a fastener and a gas-permeable member positioned at least partially within the fastener to allow movement of a gas through the fastener, but prevent movement of liquids.