Patents by Inventor Stephen M. Hugo
Stephen M. Hugo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9986649Abstract: An apparatus for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.Type: GrantFiled: January 31, 2017Date of Patent: May 29, 2018Assignee: INTERNATIONAL BUSINESS MACHINE CORPORATIONInventors: Stephen M. Hugo, Matthew S. Kelly
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Patent number: 9910085Abstract: A laminate bond strength detection apparatus is provided. The laminate bond strength detection apparatus includes first circuit elements affixable to a printed circuit board (PCB), a housing having a coefficient of thermal expansion (CTE) mismatched from that of the PCB, second circuit elements affixable to the housing and configured to be laminated to a surface of the PCB, connectors and circuitry. The connectors respectively connect pairs of the first and second circuit elements and are breakable during CTE mismatch inducing heat processing resulting in the corresponding second circuit element becoming delaminated from the surface. The circuitry is coupled to the first and second circuit elements and configured to determine a number of broken connectors following the heat processing and to calculate a laminate bond strength of the PCB from the number of broken connectors.Type: GrantFiled: January 4, 2016Date of Patent: March 6, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Stephen M. Hugo, Theron L. Lewis
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Publication number: 20180053711Abstract: Bottom terminated components and methods of making bottom terminated components are provided. The bottom terminated component includes a die paddle and at least one die paddle structure configured to prevent wicking into a respective thermal via of a printed circuit board. The at least one die paddle structure includes a base defining an axis, the base having an axial thickness extending from the die paddle, and a contact surface configured to contact the printed circuit board at the thermal via of the printed circuit board to prevent wicking of solder into the respective thermal via.Type: ApplicationFiled: October 31, 2017Publication date: February 22, 2018Inventors: Stephen M. Hugo, Mark J. Jeanson, Matthew S. Kelly
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Publication number: 20180045773Abstract: A laminate bond strength detection apparatus is provided. The laminate bond strength detection apparatus includes first circuit elements affixable to a printed circuit board (PCB), a housing having a coefficient of thermal expansion (CTE) mismatched from that of the PCB, second circuit elements affixable to the housing and configured to be laminated to a surface of the PCB, connectors and circuitry. The connectors respectively connect pairs of the first and second circuit elements and are breakable during CTE mismatch inducing heat processing resulting in the corresponding second circuit element becoming delaminated from the surface. The circuitry is coupled to the first and second circuit elements and configured to determine a number of broken connectors following the heat processing and to calculate a laminate bond strength of the PCB from the number of broken connectors.Type: ApplicationFiled: October 23, 2017Publication date: February 15, 2018Inventors: Stephen M. Hugo, Theron L. Lewis
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Publication number: 20170192051Abstract: A laminate bond strength detection apparatus is provided. The laminate bond strength detection apparatus includes first circuit elements affixable to a printed circuit board (PCB), a housing having a coefficient of thermal expansion (CTE) mismatched from that of the PCB, second circuit elements affixable to the housing and configured to be laminated to a surface of the PCB, connectors and circuitry. The connectors respectively connect pairs of the first and second circuit elements and are breakable during CTE mismatch inducing heat processing resulting in the corresponding second circuit element becoming delaminated from the surface. The circuitry is coupled to the first and second circuit elements and configured to determine a number of broken connectors following the heat processing and to calculate a laminate bond strength of the PCB from the number of broken connectors.Type: ApplicationFiled: January 4, 2016Publication date: July 6, 2017Inventors: Stephen M. Hugo, Theron L. Lewis
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Publication number: 20170179004Abstract: Bottom terminated components and methods of making bottom terminated components are provided. The bottom terminated component includes a die paddle and at least one die paddle structure configured to prevent wicking into a respective thermal via of a printed circuit board. The at least one die paddle structure includes a base defining an axis, the base having an axial thickness extending from the die paddle, and a contact surface configured to contact the printed circuit board at the thermal via of the printed circuit board to prevent wicking of solder into the respective thermal via.Type: ApplicationFiled: December 17, 2015Publication date: June 22, 2017Inventors: Stephen M. Hugo, Mark J. Jeanson, Matthew S. Kelly
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Patent number: 9662732Abstract: A method, apparatus, and computer program product for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.Type: GrantFiled: June 21, 2016Date of Patent: May 30, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Stephen M. Hugo, Matthew S. Kelly
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Publication number: 20170142845Abstract: An apparatus for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.Type: ApplicationFiled: January 31, 2017Publication date: May 18, 2017Applicant: International Business Machines CorporationInventors: STEPHEN M. HUGO, Matthew S. Kelly
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Publication number: 20160297022Abstract: A method, apparatus, and computer program product for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.Type: ApplicationFiled: June 21, 2016Publication date: October 13, 2016Applicant: International Business Machines CorporationInventors: Stephen M. Hugo, Matthew S. Kelly
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Patent number: 9427828Abstract: A method, apparatus, and computer program product for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.Type: GrantFiled: August 8, 2014Date of Patent: August 30, 2016Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Stephen M. Hugo, Matthew S. Kelly
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Publication number: 20160044791Abstract: A method, apparatus, and computer program product for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.Type: ApplicationFiled: August 8, 2014Publication date: February 11, 2016Inventors: Stephen M. Hugo, Matthew S. Kelly
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Patent number: 9232664Abstract: A structure including a circuit board including a plane and a pin-in-hole component; and a heat transfer device, where the heat transfer device is thermally connected to the plane at a leading edge of the circuit board, the heat transfer device transfers heat from a wave of molten solder to the plane.Type: GrantFiled: December 11, 2013Date of Patent: January 5, 2016Assignee: International Business Machines CorporationInventors: Stephen M. Hugo, Matthew S. Kelly
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Patent number: 9148962Abstract: A structure including a circuit board including a plane and a pin-in-hole component; and a heat transfer device, where the heat transfer device is thermally connected to the plane at a leading edge of the circuit board, the heat transfer device transfers heat from a wave of molten solder to the plane.Type: GrantFiled: January 2, 2013Date of Patent: September 29, 2015Assignee: International Business Machines CorporationInventors: Stephen M. Hugo, Matthew S. Kelly
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Publication number: 20140183250Abstract: A structure including a circuit board including a plane and a pin-in-hole component; and a heat transfer device, where the heat transfer device is thermally connected to the plane at a leading edge of the circuit board, the heat transfer device transfers heat from a wave of molten solder to the plane.Type: ApplicationFiled: December 11, 2013Publication date: July 3, 2014Applicant: International Business Machines CorporationInventors: Stephen M. Hugo, Matthew S. Kelly
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Publication number: 20140182909Abstract: A structure including a circuit board including a plane and a pin-in-hole component; and a heat transfer device, where the heat transfer device is thermally connected to the plane at a leading edge of the circuit board, the heat transfer device transfers heat from a wave of molten solder to the plane.Type: ApplicationFiled: January 2, 2013Publication date: July 3, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Stephen M. Hugo, Matthew S. Kelly