Patents by Inventor Steven Yen

Steven Yen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100038054
    Abstract: A heat dispensing unit includes two heat dispensing plates between which the chip is clamped. Each heat dispensing plate includes multiple ridges extending from an outside thereof and two clamps clamp two ends of the two heat dispensing plates. Each clamp includes two side plates and a flexible plate which is connected between the two side plates, two protrusions extend from two respective insides of the two side plates so as to be engaged with two holes in the two heat dispensing plates to securely connect the two heat dispensing plates. The clamps each have two hooks to hook the notches in two ends of the chip.
    Type: Application
    Filed: September 3, 2008
    Publication date: February 18, 2010
    Inventors: Wei-Hau Chen, Steven Yen
  • Publication number: 20100038055
    Abstract: A heat dispensing unit includes two heat dispensing plates between which the chip is clamped. Each heat dispensing plate includes two connection plates bending from two ends thereof and the two connection plates have a connection piece or a connection port so that when the two heat dispensing plates are connected to each other, the connection pieces are connected to the connection ports.
    Type: Application
    Filed: September 3, 2008
    Publication date: February 18, 2010
    Inventors: Wei-Hau Chen, Steven Yen
  • Publication number: 20090288804
    Abstract: A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and a second heat dispensing unit is fixed on a top of the base board. The base board is connected to the first heat dispensing unit by two clamping members. The clamping members each have a first portion fixed to the base board and a second board which is removably connected to the first portion. The second portion is connected to the first heat dispensing unit. The second heat dispensing unit can be a fan, a water-cooling unit or an aluminum extruding member.
    Type: Application
    Filed: June 23, 2008
    Publication date: November 26, 2009
    Inventors: Wei-Hau Chen, Steven Yen
  • Publication number: 20090288803
    Abstract: A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and two engaging portions are connected to two ends of the base board. A second heat dispensing unit is fixed on a top of the base board. Two clamps connect the base board to the first heat dispensing unit. The second heat dispensing unit can be a fan, a water-cooling unit or an aluminum extruding member.
    Type: Application
    Filed: June 11, 2008
    Publication date: November 26, 2009
    Inventors: Wei-Hau Chen, Steven Yen
  • Publication number: 20090290308
    Abstract: A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped therebetween. A base board has a first extension portion and a second extension portion extending from two ends thereof. A second heat dispensing unit is fixed on a top of the base board. A first clamping member is integrally connected to the first extension portion and a second clamping member is removably connected to the second extension portion. The first and second clamping members connect the base board to the first heat dispensing unit.
    Type: Application
    Filed: June 23, 2008
    Publication date: November 26, 2009
    Inventors: Wei-Hau Chen, Steven Yen
  • Publication number: 20090288802
    Abstract: A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and a second heat dispensing unit is fixed on a top of the base board. The base board is connected to the first heat dispensing unit by two clamping members. The second heat dispensing unit can be a fan, a water-cooling unit or an aluminum extruding member.
    Type: Application
    Filed: June 11, 2008
    Publication date: November 26, 2009
    Inventors: Wei-Hau Chen, Steven Yen
  • Publication number: 20090277607
    Abstract: A heat sink for chips includes two heat dispensing units and each heat dispensing unit includes multiple fins between which passages are defined. Each heat dispensing unit includes a flat surface defined in an inside thereof and a heat conducting member is connected to the flat surface. The chip is in contact between the two heat conducting members so that the heat generated from the chip is contacted to the heat conducting members and the fins and escapes to the air.
    Type: Application
    Filed: May 23, 2008
    Publication date: November 12, 2009
    Inventors: Wei-Hau Chen, Steven Yen