Heat sink for chips

Abstract

A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and two engaging portions are connected to two ends of the base board. A second heat dispensing unit is fixed on a top of the base board. Two clamps connect the base board to the first heat dispensing unit. The second heat dispensing unit can be a fan, a water-cooling unit or an aluminum extruding member.

Description

BACKGROUND OF THE INVENTION

(1) Field of the Invention

The present invention relates to a heat sink for removing heat from chips and the fans are connected to the heat dispensing plates by clamps.

(2) Description of the Prior Art

The chips used in electronic devices such as computers generate a significant heat during high speed operation and the heat may damage the chips and slow down the speed that the CPU operates. A conventional way to remove heat from the chip is to provide two heat dispensing plates between which the chip is clamped, the heat generated from the chip is conducted to the heat dispensing plates and escapes to the air via the heat dispensing plates.

However, the latest chips generate much heat with higher temperature than those made by old technology so that the conventional heat dispensing plates cannot remove the heat efficiently. This is because the area that heat is transferred from the chip is insufficient and the conventional heat dispensing plates can only remove a certain amount of heat because of limited heat dispensing area. Extra heat removing units are needed and because the limited space available in the computers so that how to provide a high efficiency heat removing units is an important problem.

The present invention intends to provide a heat sink for chips and includes two heat dispensing units, one of the heat dispensing units clamps the chip between heat dispensing plates thereof and the other heat dispensing unit is connected on a base board which is connected to the first heat dispensing unit by using two clamps. The heat from the chip that is conducted to the first heat dispensing unit can be removed by the second heat dispensing unit.

SUMMARY OF THE INVENTION

The present invention relates to a heat sink-which comprises a first heat dispensing unit composed of multiple heat dispensing plates between which the chips are clamped. A base board has a contact surface defined in an underside of the base board and the contact surface is in contact with a top of the first heat dispensing unit. Two engaging portions are connected to two ends of the base board. A second heat dispensing unit is fixed on a top of the base board. Two clamps connect the base board to the first heat dispensing unit.

The present invention will become more obvious from the following description when taken in connection with the accompanying drawings which show, for purposes of illustration only, a preferred embodiment in accordance with the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded view to show the chips and the heat sink of the present invention;

FIG. 2 is a perspective view to show the connection of the chips and the heat sink of the present invention;.

FIG. 3 is an exploded view to show the chips and a second embodiment of the heat sink of the present invention;

FIG. 4 is a perspective view to show the connection of the chips and the heat sink in FIG. 3 of the present invention;

FIG. 5 is an exploded view to show the chips and a third embodiment of the heat sink of the present invention;

FIG. 6 is a perspective view to show the connection of the chips and the heat sink in FIG. 5 of the present invention, and

FIG. 7 shows a side view of the connection of the chips and the heat sink in FIG. 5 of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to FIGS. 1 and 2, the heat sink 10 for chips 5 of the present invention comprises first heat dispensing units 3, a base board 1, two second heat dispensing units 4 and two clamps 2, wherein the first heat dispensing units 3 each include multiple heat dispensing plates between which the chips 5 are clamped. The base board 1 has a contact surface 11 defined in an underside of the base board 1 and two holes 12 are defined through the base board 1. A plurality of threaded holes 13 are located around the holes 12. The contact surface 11 is in contact with a top of the first heat dispensing units 3 and two engaging portions 14 are connected to two ends of the base board 1. The engaging portions 14 in this embodiment are slots. The second heat dispensing units 4 are fixed on a top of the base board 1 by extending bolts through passages 41 in the fans and are connected to the threaded holes 13. The second heat dispensing units 4 are located corresponding to the holes 12. The two clamps 2 connect the base board 1 to the first heat dispensing units 3.

Each heat dispensing plate of the first heat dispensing units 3 includes recesses 31 defined in two ends thereof and the clamps 2 are engaged with the engaging portions 14 of the base board 1 and the recesses 31 of the first heat dispensing units 3.

Each clamp 2 includes a horizontal part 21 with two flexible parts 22 extending from two ends of the horizontal part 21, each flexible part 22 includes an engaging part 23 extending therefrom. The horizontal parts 21 are engaged with the recesses 31 of the first heat dispensing units 3 and the engaging parts 23 are engaged with the engaging portions 14 of the base board 1. In this embodiment, the horizontal part 21, the two flexible parts 22 and the engaging parts 23 are rod-like pieces.

The heat generated from the chips 5 is conducted to the heat dispensing plates of the first heat dispensing units 3 and then brought out from the first dispensing units 3 by the fans of the second heat dispensing units 4 via the holes 12.

As shown in FIGS. 3 and 4, which show the second embodiment of the heat sink 10 of the present invention, wherein the base board 1 does not have the holes 12 as shown in FIG. 1 and the second heat dispensing unit 4 is a water-cooling units.

As shown in FIGS. 5 to 7, which show the third embodiment of the heat sink 10 of the present invention, wherein the second heat dispensing unit 4 is an aluminum extruding member which includes the base board 1 integrally formed on the underside of the aluminum extruding member. The aluminum extruding member includes multiple fins extending therefrom and the engaging portions are slots defined between the fins so that the engaging parts 23 of the clamps 2 are engaged with the slots.

While we have shown and described the embodiment in accordance with the present invention, it should be clear to those skilled in the art that further embodiments may be made without departing from the scope of the present invention.

Claims

1. A heat sink comprising:

a first heat dispensing unit including multiple heat dispensing plates which are adapted to clamp chips therebetween;

a base board having a contact surface defined in an underside of the base board, the contact surface being in contact with a top of the first heat dispensing unit and two engaging portions connected to two ends of the base board, a second heat dispensing unit fixed on a top of the base board, and

two clamps connecting the base board to the first heat dispensing unit.

2. The heat sink as claimed in claim 1, wherein each heat dispensing plate of the first heat dispensing unit includes recesses defined in two ends thereof and the clamps are engaged with the engaging portions of the base board and the recesses of the first heat dispensing unit.

3. The heat sink as claimed in claim 2, wherein the engaging portions are slots.

4. The heat sink as claimed in claim 1, wherein the base board includes a hole defined therethrough and the second heat dispensing unit is located corresponding to the hole.

5. The heat sink as claimed in claim 1, the second heat dispensing unit is a fan.

6. The heat sink as claimed in claim 1, the second heat dispensing unit is a water-cooling unit.

7. The heat sink as claimed in claim 1, the second heat dispensing unit is an aluminum extruding member.

8. The heat sink as claimed in claim 1, wherein each clamp includes a horizontal part with two flexible parts extending from two ends of the horizontal part, each flexible part includes an engaging part extending therefrom, the horizontal part are engaged with the recesses of the first heat dispensing unit and the engaging parts are engaged with the engaging portions of the base board.

9. The heat sink as claimed in claim 8, wherein the horizontal part, the two flexible parts and the engaging parts of each clamp are rod-like pieces.