Patents by Inventor Sung Bok Lee
Sung Bok Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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THERMOPLASTIC POLYURETHANE COMPOSITION FOR INJECTION MOLDING AND A METHOD FOR MANUFACTURING THE SAME
Publication number: 20240132652Abstract: The present disclosure relates to a thermoplastic polyurethane composition for injection molding and a method for manufacturing the same. Specifically, the thermoplastic polyurethane composition includes 0.5% by weight to 10.0% by weight of a sulfonate diol, 13% by weight to 60% by weight of an isocyanate, 30% by weight to 70% by weight of an ether-containing polyester polyol, and 5% by weight to 40% by weight of a chain extender.Type: ApplicationFiled: April 17, 2023Publication date: April 25, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, DONGSUNG CHEMICAL Co., Ltd., HANWHA ADVANCED MATERIALS CORPORATIONInventors: Boo Youn An, In Soo Han, Sang Hyuk Lee, Jae Chan Lee, Hoon Jeong Kim, Gyu Min Lee, Sung Bok Kwak, Dong Ju Lee, Jae Yong Lee -
Patent number: 11938713Abstract: A protective film is provided. The protective film includes a release film, a base film which is disposed on the release film and comprises a protective part and a first pull tab part protruding from a first side surface of the protective part, and a first dummy film which is disposed on the release film, does not overlap the base film in a plan view, and comprises a part partially surrounding the first pull tab part, where edges of the base film and edges of the first dummy film are disposed inside edges of the release film in the plan view.Type: GrantFiled: September 4, 2020Date of Patent: March 26, 2024Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Jae Bok Lee, Hang Gyun Park, Jin Woo Park, Sung Hoon Lee
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Publication number: 20240094276Abstract: Disclosed herein is an untact DC electric-field sensor having improved sensitivity. The untact DC electric-field sensor has a circuit composed of a variable capacitor and an RF generator and improves sensitivity through resonance of the circuit by connecting an inductor to the sensor.Type: ApplicationFiled: August 22, 2023Publication date: March 21, 2024Applicant: KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTEInventors: Jeong Min WOO, Sung Man KANG, Jae Bok LEE, Mun No JU
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Publication number: 20240071316Abstract: A display device includes: a display panel including a display area including pixels and a non-display area including a dummy pixel; a scan driver which supplies a scan signal to the display panel; a data driver which supplies a data signal to the display panel; and a timing controller which supplies a first control signal for controlling the scan driver and a second control signal for controlling the data driver. The dummy pixel is connected to a bad pixel among the pixels in the display area through a repair line, and a connection of the dummy pixel to the repair line is cut off in an initialization phase in which a voltage of an initialization power source is supplied.Type: ApplicationFiled: October 19, 2023Publication date: February 29, 2024Inventors: Kyong Tae PARK, Sung Jun KIM, Jun Yeong SEOL, Jae Bok LEE
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Patent number: 11787688Abstract: A method of forming an acoustic transducer comprises providing a substrate and depositing a first structural layer on the substrate. The first structural layer is selectively etched to form at least one of an enclosed trench or an enclosed pillar thereon. A second structural layer is deposited on the first structural layer and includes a depression or a bump corresponding to the enclosed trench or pillar, respectively. At least the second structural layer is heated to a temperature above a glass transition temperature of the second structural layer causing the second structural layer to reflow. A diaphragm layer is deposited on the second structural layer such that the diaphragm layer includes at least one of a downward facing corrugation corresponding to the depression or an upward facing corrugation corresponding to the bump. The diaphragm layer is released, thereby forming a diaphragm suspended over the substrate.Type: GrantFiled: November 16, 2020Date of Patent: October 17, 2023Assignee: KNOWLES ELECTRONICS, LLCInventors: Sung Bok Lee, Vahid Naderyan, Bing Yu, Michael Kuntzman, Yunfei Ma, Michael Pedersen
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Patent number: 11787690Abstract: A method of forming a micro electro mechanical system (MEMS) assembly comprises providing a substrate having an electrically conductive layer disposed thereon. The method also comprises depositing, on the substrate over the electrically conductive layer, a bonding material having an elastic modulus of less than 500 MPa so as to form a bond layer. The bond layer is completely cured, and a MEMS die is attached to the completely cured bond layer.Type: GrantFiled: April 2, 2021Date of Patent: October 17, 2023Assignee: KNOWLES ELECTRONICS, LLC.Inventors: Sung Bok Lee, John Szczech, Josh Watson
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Publication number: 20230288281Abstract: In accordance with one aspect, a device is provided having a transducer comprising a conductor, a diaphragm configured to move relative to the conductor, and a reference volume in communication with the external environment. The diaphragm separates the reference volume and the external environment. The device further includes a controller operably coupled to the transducer and configured to determine an air pressure of an external environment based at least in part on movement of the diaphragm.Type: ApplicationFiled: March 15, 2023Publication date: September 14, 2023Applicant: Knowles Electronics, LLCInventors: Andy Unruh, Sung Bok Lee, Pete Loeppert, Wade Conklin, Michael Kuntzman, Vahid Naderyan
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Patent number: 11671766Abstract: A microphone device includes a base and a microelectromechanical system (MEMS) transducer and an integrated circuit (IC) disposed on the base. The microphone device also includes a cover mounted on the base and covering the MEMS transducer and the IC. The MEMS transducer includes a diaphragm attached to a surface of the substrate and a back plate mounted on the substrate and in a spaced apart relationship with the diaphragm. The diaphragm is attached to the surface of the substrate along at least a portion of a periphery of the diaphragm. The diaphragm can include a silicon nitride insulating layer, and a conductive layer, that faces a conductive layer of the back plate. The MEMS transducer can include a peripheral support structure that is disposed between at least a portion of the diaphragm and the substrate. The diaphragm can include one or more pressure equalizing apertures.Type: GrantFiled: November 19, 2021Date of Patent: June 6, 2023Assignee: KNOWLES ELECTRONICS, LLC.Inventors: Sung Bok Lee, Vahid Naderyan, Bing Yu, Michael Kuntzman, Yunfei Ma, Wade Conklin, Peter Loeppert
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Patent number: 11617042Abstract: An acoustic transducer for generating electrical signals in response to acoustic signals, comprises a first diaphragm having a first corrugation formed therein. A second diaphragm has a second corrugation formed therein, and is spaced apart from the first diaphragm such that a cavity having a pressure lower than atmospheric pressure is formed therebetween. A back plate is disposed between the first diaphragm and the second diaphragm. One or more posts extend from at least one of the first diaphragm or the second diaphragm towards the other through the back plate. The one or more posts prevent each of the first diaphragm and the second diaphragm from contacting the back plate due to movement of the first diaphragm and/or the second diaphragm towards the back plate. Each of the first corrugation and the second corrugation protrude outwardly from the first diaphragm and the second diaphragm, respectively, away from the back plate.Type: GrantFiled: January 27, 2021Date of Patent: March 28, 2023Assignee: KNOWLES ELECTRONICS, LLC.Inventors: Michael Kuntzman, Michael Pedersen, Sung Bok Lee, Bing Yu, Vahid Naderyan, Peter Loeppert
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Publication number: 20220150645Abstract: A microphone device includes a base and a microelectromechanical system (MEMS) transducer and an integrated circuit (IC) disposed on the base. The microphone device also includes a cover mounted on the base and covering the MEMS transducer and the IC. The MEMS transducer includes a diaphragm attached to a surface of the substrate and a back plate mounted on the substrate and in a spaced apart relationship with the diaphragm. The diaphragm is attached to the surface of the substrate along at least a portion of a periphery of the diaphragm. The diaphragm can include a silicon nitride insulating layer, and a conductive layer, that faces a conductive layer of the back plate. The MEMS transducer can include a peripheral support structure that is disposed between at least a portion of the diaphragm and the substrate. The diaphragm can include one or more pressure equalizing apertures.Type: ApplicationFiled: November 19, 2021Publication date: May 12, 2022Applicant: KNOWLES ELECTRONICS, LLCInventors: Sung Bok LEE, Vahid NADERYAN, Bing YU, Michael KUNTZMAN, Yunfei MA, Wade CONKLIN, Peter LOEPPERT
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Patent number: 11310600Abstract: An acoustic transducer for generating electrical signals in response to acoustic signals includes a transducer substrate, a back plate, and a diaphragm assembly. The diaphragm assembly includes a first diaphragm and a second diaphragm coupled thereto. The second diaphragm is positioned closer to the back plate than the first diaphragm. The second diaphragm includes a plurality of diaphragm apertures configured to allow air to pass through the second diaphragm. Each of the back plate and the first diaphragm are coupled to the transducer substrate at their periphery. In an embodiment, the transducer includes a post coupled to the first diaphragm and the second diaphragm, the post configured to prevent movement of the second diaphragm relative to the first diaphragm in a direction substantially perpendicular to the second diaphragm.Type: GrantFiled: November 8, 2019Date of Patent: April 19, 2022Assignee: KNOWLES ELECTRONICS, LLCInventors: Vahid Naderyan, Sung Bok Lee, Michael Kuntzman
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Patent number: 11297406Abstract: Acoustic transducers for generating electrical signals in response to acoustic signals are disclosed. In some embodiments, an acoustic transducer includes an at least partially evacuated hermetically sealed cavity defined in part by a first diaphragm. The acoustic transducer also includes a backplate disposed at least partially within the cavity. The cavity having a pressure lower than atmospheric pressure. The acoustic transducer further includes a pressure sensor coupled to the backplate and configured to sense the pressure in the cavity.Type: GrantFiled: December 18, 2020Date of Patent: April 5, 2022Assignee: Knowles Electronics, LLCInventors: Venkataraman Chandrasekaran, Michael Kuntzman, Michael Pedersen, Sung Bok Lee
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Patent number: 11274034Abstract: A microelectromechanical system (MEMS) motor includes a substrate, a backplate, and a diaphragm. The substrate has a first surface and a second surface. The second surface has a slot that extends at least partially into the substrate. A port extends through the substrate. The backplate is mounted to the first surface of the substrate, and the backplate covers at least a portion of the port. The diaphragm is between the backplate and the substrate. The diaphragm moves with respect to the backplate in response to acoustic energy that passes through the port.Type: GrantFiled: July 26, 2018Date of Patent: March 15, 2022Assignee: KNOWLES ELECTRONICS, LLCInventors: Alyssa Kueffner, Sung Bok Lee, Yenhao Chen, Yaoyang Guo, Jeremy Hui, John J. Albers, Jonathan Reeg
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Patent number: 11228845Abstract: A microphone assembly includes an acoustic transducer having a back plate and a diaphragm, such that a surface of the back plate includes a plurality of holes. At least a portion of the plurality of holes are arranged in a non-uniform pattern. The non-uniform pattern includes holes of varying sizes spaced apart from neighboring holes by varying distances. The microphone assembly further includes an audio signal electrical circuit configured to receive an acoustic signal from the acoustic transducer.Type: GrantFiled: September 14, 2018Date of Patent: January 18, 2022Assignee: KNOWLES ELECTRONICS, LLCInventors: Vahid Naderyan, Michael Kuntzman, Sung Bok Lee, Wade Conklin
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Patent number: 11212621Abstract: An acoustic transducer comprises a transducer substrate defining an aperture therein. A diaphragm is disposed on the transducer substrate. The diaphragm comprises a diaphragm inner portion disposed over the aperture such that an outer edge of the diaphragm inner portion is located radially inwards of a rim of the aperture, the diaphragm inner portion having a first stress. A diaphragm outer portion extends radially from the outer edge of the diaphragm inner portion to at least the rim of the aperture, the diaphragm outer portion having a second stress different from the first stress.Type: GrantFiled: May 29, 2020Date of Patent: December 28, 2021Assignee: Knowles Electronics, LLCInventors: Peter V. Loeppert, Sung Bok Lee
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Patent number: 11206494Abstract: A microphone device includes a base and a microelectromechanical system (MEMS) transducer and an integrated circuit (IC) disposed on the base. The microphone device also includes a cover mounted on the base and covering the MEMS transducer and the IC. The MEMS transducer includes a diaphragm attached to a surface of the substrate and a back plate mounted on the substrate and in a spaced apart relationship with the diaphragm. The diaphragm is attached to the surface of the substrate along at least a portion of a periphery of the diaphragm. The diaphragm can include a silicon nitride insulating layer, and a conductive layer, that faces a conductive layer of the back plate. The MEMS transducer can include a peripheral support structure that is disposed between at least a portion of the diaphragm and the substrate. The diaphragm can include one or more pressure equalizing apertures.Type: GrantFiled: October 4, 2019Date of Patent: December 21, 2021Assignee: Knowles Electronics, LLCInventors: Sung Bok Lee, Vahid Naderyan, Bing Yu, Michael Kuntzman, Yunfei Ma, Wade Conklin, Peter Loeppert
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Publication number: 20210274287Abstract: An acoustic transducer for generating electrical signals in response to acoustic signals includes a transducer substrate, a back plate, and a diaphragm assembly. The diaphragm assembly includes a first diaphragm and a second diaphragm coupled thereto. The second diaphragm is positioned closer to the back plate than the first diaphragm. The second diaphragm includes a plurality of diaphragm apertures configured to allow air to pass through the second diaphragm. Each of the back plate and the first diaphragm are coupled to the transducer substrate at their periphery. In an embodiment, the transducer includes a post coupled to the first diaphragm and the second diaphragm, the post configured to prevent movement of the second diaphragm relative to the first diaphragm in a direction substantially perpendicular to the second diaphragm.Type: ApplicationFiled: November 8, 2019Publication date: September 2, 2021Inventors: Vahid Naderyan, Sung Bok Lee, Michael Kuntzman
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Publication number: 20210239559Abstract: In accordance with one aspect, a device is provided having a transducer comprising a conductor, a diaphragm configured to move relative to the conductor, and a reference volume in communication with the external environment. The diaphragm separates the reference volume and the external environment. The device further includes a controller operably coupled to the transducer and configured to determine an air pressure of an external environment based at least in part on movement of the diaphragm.Type: ApplicationFiled: July 24, 2017Publication date: August 5, 2021Applicant: Knowles Electronics, LLCInventors: Andy Unruh, Sung Bok Lee, Pete Loeppert, Wade Conklin, Michael Kuntzman, Vahid Naderyan
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Publication number: 20210204048Abstract: Acoustic transducers for generating electrical signals in response to acoustic signals are disclosed. In some embodiments, an acoustic transducer includes an at least partially evacuated hermetically sealed cavity defined in part by a first diaphragm. The acoustic transducer also includes a backplate disposed at least partially within the cavity. The cavity having a pressure lower than atmospheric pressure. The acoustic transducer further includes a pressure sensor coupled to the backplate and configured to sense the pressure in the cavity.Type: ApplicationFiled: December 18, 2020Publication date: July 1, 2021Inventors: Venkataraman Chandrasekaran, Michael Kuntzman, Michael Pedersen, Sung Bok Lee
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Publication number: 20210176570Abstract: An acoustic transducer for generating electrical signals in response to acoustic signals, comprises a first diaphragm having a first corrugation formed therein. A second diaphragm has a second corrugation formed therein, and is spaced apart from the first diaphragm such that a cavity having a pressure lower than atmospheric pressure is formed therebetween. A back plate is disposed between the first diaphragm and the second diaphragm. One or more posts extend from at least one of the first diaphragm or the second diaphragm towards the other through the back plate. The one or more posts prevent each of the first diaphragm and the second diaphragm from contacting the back plate due to movement of the first diaphragm and/or the second diaphragm towards the back plate. Each of the first corrugation and the second corrugation protrude outwardly from the first diaphragm and the second diaphragm, respectively, away from the back plate.Type: ApplicationFiled: January 27, 2021Publication date: June 10, 2021Applicant: KNOWLES ELECTRONICS, LLCInventors: Michael KUNTZMAN, Michael PEDERSEN, Sung Bok LEE, Bing YU, Vahid NADERYAN, Peter LOEPPERT