Patents by Inventor Sung-Hyun Park

Sung-Hyun Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11968643
    Abstract: An apparatus and method of processing a positioning reference signal are disclosed. In some embodiments, the method includes determining a narrow-band (NB) positioning reference signal (PRS) bitmap indicating a pattern selecting NB PRS subframes, wherein each NB PRS subframe comprises an NB PRS for positioning an NB user equipment (UE), transmitting, to the NB UE, NB PRS configuration information for the NB UE, the NB PRS configuration information comprising the NB PRS bitmap, determining, by a reference cell and based on the NB PRS bitmap, NB PRS subframes of the reference cell, mapping, by the reference cell, a first NB PRS in the NB PRS subframes of the reference cell, and receiving, from the NB UE and in response to the first NB PRS, a reference signal time difference (RSTD) measurement.
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: April 23, 2024
    Assignee: Innovative Technology Lab Co., Ltd.
    Inventors: Sung Jun Yoon, Dong Hyun Park
  • Publication number: 20240128136
    Abstract: A wafer level package includes: a substrate; an element portion disposed on one surface of the substrate; a cap disposed on the substrate to cover the element portion; a connection portion electrically connected to the element portion; and a bonding portion disposed on an outer side of the connection portion, wherein the bonding portion is disposed on a first surface of one of the substrate and the cap, wherein one end portion of the connection portion is disposed on a second surface having a step difference from the first surface, and wherein the connection portion and the bonding portion are formed of a eutectic material.
    Type: Application
    Filed: February 16, 2023
    Publication date: April 18, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Wook PARK, Seong Hun NA, Jae Hyun JUNG, Kwang Su KIM, Sung Jun LEE, Yong Suk KIM, Dong Hyun PARK
  • Patent number: 11961742
    Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide methods for manufacturing a semiconductor device, and semiconductor devices produced thereby, that comprise forming an interposer including a reinforcement layer.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: April 16, 2024
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
    Inventors: Jong Sik Paek, Doo Hyun Park, Seong Min Seo, Sung Geun Kang, Yong Song, Wang Gu Lee, Eun Young Lee, Seo Yeon Ahn, Pil Je Sung
  • Publication number: 20240118337
    Abstract: Proposed are a guide plate and a test device including the guide plate capable of being insulated from electrically conductive contact pins and capable of blocking signal interference between the electrically conductive contact pins.
    Type: Application
    Filed: October 11, 2023
    Publication date: April 11, 2024
    Applicant: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo AHN, Seung Ho PARK, Sung Hyun BYUN
  • Publication number: 20240119211
    Abstract: A semiconductor design optimization system that includes: a data base configured to store design data, a training data preprocessing unit configured to preprocess the design data and generate training data, a data learning unit configured to generate a physical property prediction model by training using the training data, a physical property prediction unit configured to generate predicted physical property data including information associated with predicted physical property values for each region of a semiconductor device to be fabricated, wherein the physical property prediction unit is configured to input, into the physical property prediction model, input data including information associated with design drawings of the semiconductor device to be fabricated, and a layout generator configured generate a design layout optimized to distribute the predicted physical property values for each region of the semiconductor device to be fabricated by modifying the design drawings based on the predicted physical
    Type: Application
    Filed: June 6, 2023
    Publication date: April 11, 2024
    Applicants: Samsung Electronics Co., Ltd., Research & Business Foundation SUNGKYUNKWAN UNIVERSITY
    Inventors: Eun-Ho Lee, Jae Choon Kim, Tae-Hyun Kim, Jeong-Hyeon Park, Hwanjoo Park, Sunggu Kang, Sung-Ho Mun
  • Publication number: 20240120475
    Abstract: The present disclosure relates to a cathode active material for an all-solid-state battery with a controlled particle size and a method for preparing the same. In particular, the cathode active material includes lithium and a transition metal, wherein the cathode active material has a single peak in the range of 1 ?m to 10 ?m as a result of particle size distribution (PSD) analysis.
    Type: Application
    Filed: May 4, 2023
    Publication date: April 11, 2024
    Inventors: Sung Woo NOH, Hong Seok MIN, Sang Heon LEE, Jeong Hyun SEO, Im Sul SEO, Chung Bum LIM, Ju Yeong SEONG, Je Sik PARK
  • Publication number: 20240120323
    Abstract: The present disclosure relates to an apparatus for fabricating a display panel including: an attachment member having a fixing portion in a pressurization direction to which a pressurization header is fixed, an attachment driving member configured to move the attachment member and the pressurization header in the pressurization direction or a detachment direction through a fixing frame of the attachment member, a first pressure sensing module between the pressurization header and the attachment member and configured to generate first pressure detection signals according to pressure applied to the pressurization header, a gradient setting module configured to set a gradient of the pressurization header based on magnitudes of the first pressure detection signals, and a gradient control module configured to adjust gradients of the pressurization header, the attachment member, and the fixing frame according to control of the gradient setting module.
    Type: Application
    Filed: September 6, 2023
    Publication date: April 11, 2024
    Inventors: Tae Hee LEE, Sung Kook PARK, Kyung Ho KIM, Young Seok SEO, Jae Gwang UM, Sang Hyun LEE, Hyung Suk HWANG
  • Patent number: 11954644
    Abstract: Provided is an electronic apparatus and a method thereof. The method includes identifying pickup item information, identifying at least one storage place corresponding to the pickup item information among a plurality of storage places in the item storage center based on information on or regarding an item group located at each of the plurality of storage places, and providing information on the identified storage place and the pickup item information to a manager terminal, wherein the item group comprises at least one same item corresponding to an item group, and at least a portion of a plurality of item groups comprising a same item are stored in different storage places in the item storage center.
    Type: Grant
    Filed: July 1, 2021
    Date of Patent: April 9, 2024
    Assignee: Coupang Corp.
    Inventors: Hyeon Chang Baek, Chang Hyun Kim, Sang Ho Yim, Sung Jin Park, Chang Geun Jin, Lianxi Bai
  • Patent number: 11951890
    Abstract: Proposed are a seat side bolster apparatus and a control method thereof. The seat side bolster apparatus of the disclosure includes a driving unit, which is provided under a foam pad of a seat cushion, is moved upwards and downwards by operation of an actuator, and presses the foam pad upwards when moving upwards, and a covering bracket, which is connected to the driving unit so as to be moved upwards and downwards together with the driving unit and to which an end of a covering enveloping the foam pad of the seat cushion is fixed.
    Type: Grant
    Filed: July 13, 2022
    Date of Patent: April 9, 2024
    Assignee: HYUNDAI TRANSYS INCORPORATED
    Inventors: Jae Keun Park, Do Hyun Kim, Sung Hyun Jo, Seung Joon Lee, Jae Sang Lim
  • Patent number: 11956426
    Abstract: Disclosed herein are a decoding method and apparatus and an encoding method and apparatus for deriving an intra-prediction mode. An intra-prediction mode may be derived using a method for deriving an intra-prediction mode based on a neighbor block of the target block, a method for deriving an intra-prediction mode using signaling of the intra-prediction mode of the target block, or a method for deriving an adaptive intra-prediction mode based on the type of a target slice. An MPM list may be used to derive the intra-prediction mode, and a temporal neighbor block or the like may be used to configure the MPM list.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: April 9, 2024
    Assignees: Electronics and Telecommunications Research Institute, Industry-University Cooperation Foundation Korea Aerospace University, Industry-Academia Cooperation Group of Sejong University
    Inventors: Jin-Ho Lee, Jae-Gon Kim, Jung-Won Kang, Do-Hyeon Park, Yung-Lyul Lee, Ha-Hyun Lee, Sung-Chang Lim, Hui-Yong Kim, Ji-Hoon Do, Yong-Uk Yoon
  • Publication number: 20240112968
    Abstract: Proposed are an anodic aluminum oxide film-based interposer for electrical connection and a manufacturing method therefor, a semiconductor package and a manufacturing method therefor, a multi-stacked semiconductor device and a manufacturing method therefor, and a display and a manufacturing method therefor that can cope with a narrow pitch between terminals and prevent an increase in current density and thermal energy density in a bump connection part. To this end, proposed is an interposer for electrical connection, in which a through-hole is provided in a body made of anodic aluminum oxide film and a first bonding material, an electrically conductive material, and a second bonding material are formed in the through-hole by electroplating. Here, fine trenches having repeated peaks and valleys in the circumferential direction are provided in an outer circumferential surface of a micro-bump.
    Type: Application
    Filed: March 23, 2022
    Publication date: April 4, 2024
    Applicant: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo AHN, Seung Ho PARK, Sung Hyun BYUN
  • Publication number: 20240107002
    Abstract: A method for coding image information includes generating prediction information by predicting information on a current coding unit, and determining whether the information on the current coding unit is the same as the prediction information. When the information on the current coding unit is the same as the prediction information, a flag indicating that the information on the current coding unit is the same as the prediction information is coded and transmitted. When the information on the current coding unit is not the same as the prediction information, a flag indicating that the information on the current coding unit is not the same as the prediction information and the information on the current coding unit are coded and transmitted.
    Type: Application
    Filed: December 6, 2023
    Publication date: March 28, 2024
    Applicants: Electronics and Telecommunications Research Institute, University-Industry Cooperation Group of Kyung Hee University
    Inventors: Se Yoon JEONG, Hui Yong KIM, Sung Chang LIM, Jin Ho LEE, Ha Hyun LEE, Jong Ho KIM, Jin Soo CHOI, Jin Woong KIM, Chie Teuk AHN, Gwang Hoon PARK, Kyung Yong KIM, Tae Ryong KIM, Han Soo LEE
  • Publication number: 20240102611
    Abstract: A low profile flat bombe for Liquefied Petroleum Gas (LPG) storage and method for manufacturing the same, may include a flat bombe body including an upper plate having a plurality of first piercing holes and a pump installation hole formed therethrough, a lower plate having a plurality of second piercing holes formed therethrough at positions vertically coinciding with the plurality of first piercing holes, and side plates integrally connecting first and second side end portions of the upper and lower plates, end plates mounted at front and rear openings in the flat bombe body, and support pipes, wherein upper end portions of the support pipes are welded to internal circumferential portions of the plurality of first piercing holes and lower end portions thereof are welded to internal circumferential portions of the plurality of second piercing holes to maintain a vertical distance between the upper and lower plates.
    Type: Application
    Filed: December 6, 2023
    Publication date: March 28, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, DAE HUNG PRECISION IND'L CO., LTD.
    Inventors: Seong Cheol Cho, Sung Won Lee, Ju Tae Song, Seung Hyun Yeo, Duk Hee Park
  • Patent number: 11939505
    Abstract: Provided are a silicon nitride film etching composition, a method of etching a silicon nitride film using the same, and a manufacturing method of a semiconductor device. Specifically, a silicon nitride film may be stably etched with a high selection ratio relative to a silicon oxide film, and when the composition is applied to an etching process at a high temperature and a semiconductor manufacturing process, not only no precipitate occurs but also anomalous growth in which the thickness of the silicon oxide film is rather increased does not occur, thereby minimizing defects and reliability reduction.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 26, 2024
    Assignee: ENF Technology Co., Ltd.
    Inventors: Dong Hyun Kim, Hyeon Woo Park, Sung Jun Hong, Myung Ho Lee, Myung Geun Song, Hoon Sik Kim, Jae Jung Ko, Myong Euy Lee, Jun Hyeok Hwang
  • Patent number: 11938822
    Abstract: The button structure including a front panel configured to define a body and having a mounting hole formed in a front surface of the front panel directed toward an interior of an occupant compartment, a button unit accommodated in the mounting hole and configured to selectively control various types of AV systems of a vehicle, a detection unit accommodated in the front panel and configured to detect a user's hand, a switch unit configured to operate various types of AV systems of the vehicle under the control of the button unit, and a lighting unit accommodated in a housing and configured to emit light to the button unit in response to a detection signal of the detection unit, in which the detection unit is disposed rearward of the button unit and positioned from the button unit in a direction opposite to the direction toward the interior of the occupant compartment.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: March 26, 2024
    Assignee: HYUNDAI MOBIS CO., LTD.
    Inventors: Sung Hyun Park, Jun Seong Seo, Sol Ji Yoo
  • Patent number: 11937194
    Abstract: One or more synchronization procedures in wireless communications are provided. A wireless user device may determine a global navigation satellite system (GNSS) as a synchronization reference source associated with a sidelink synchronization. The wireless user device may determine, based on the GNSS being the synchronization reference source associated with a sidelink synchronization and a subcarrier spacing index for sidelink, a slot number for sidelink communication. The wireless user device may transmit, based on the slot number, a sidelink synchronization signal from the wireless user device to a second wireless user device.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: March 19, 2024
    Assignee: Innovative Technology Lab Co., Ltd.
    Inventors: Dong Hyun Park, Sung Jun Yoon
  • Publication number: 20240084057
    Abstract: An olefin polymer and a preparation method for manufacturing the olefin polymer are disclosed. The olefin polymer has a high melting point and a high crystallization temperature, thus having excellent heat resistance. Therefore, the olefin polymer may be utilized in spout pouches for high-temperature liquid containers, or the like. The olefin polymer may have a density of 0.9 to 0.95 g/cm3, preferably 0.91 to 0.945 g/cm3, and satisfies the following Equations 1a and 2a: 224.02×d?86.257<Tm, and ??[Equation 1a] 219.64×d?95.767<Tc.
    Type: Application
    Filed: December 2, 2021
    Publication date: March 14, 2024
    Applicant: HANWHA SOLUTIONS CORPORATION
    Inventors: Jisong JO, Jeong Hyun PARK, Sung Dong KIM, Munhee LEE, Ui Gap JOUNG
  • Publication number: 20240084025
    Abstract: Provided is a method for purifying an anti-4-1BB/anti-HER2 bispecific antibody, the method of which includes carrying out affinity chromatography with a sodium acetate buffer containing a certain inorganic salt as an elution buffer. The purification method of the presently claimed subject matter increases the elution of an antibody in the intact form, thereby being able to provide an anti-4-1BB/anti-HER2 bispecific antibody in the intact form in high purity and high yield.
    Type: Application
    Filed: January 21, 2022
    Publication date: March 14, 2024
    Applicant: YUHAN CORPORATION
    Inventors: Ju-Young PARK, Sung-Hyun CHOI, Yun-Hee CHOI, Won-Tae KIM
  • Publication number: 20240082345
    Abstract: Provided is a peptide composition for preventing or treating Alzheimer's dementia. A peptide or a salt substituent thereof according to the presently claimed subject matter exhibits effects such as suppression of LPS-mediated cytokine production, suppression of LPS-induced neuroinflammation, amelioration of cognitive impairment, suppression of beta amyloid or tau protein aggregation, and suppression of neuronal loss. The polypeptide or the salt substituent thereof can permeate the blood-brain barrier, and thus, is expected to be usefully used for preventing or treating Alzheimer's dementia.
    Type: Application
    Filed: August 25, 2021
    Publication date: March 14, 2024
    Applicant: HLB SCIENCE INC.
    Inventors: Yeong Min PARK, Wahn Soo CHOI, Seung-Hyun LEE, In Duk JUNG, Yong Joo KIM, Seung Jun LEE, Sung Min KIM, Mi Suk LEE, Hee Jo PARK, Seung Pyo CHOI, Minho MOON, Soo Jung SHIN, Sujin KIM, Yong Ho PARK, Jae-Yong PARK, Kun Ho LEE
  • Publication number: 20240087991
    Abstract: A semiconductor package including a die paddle, a first lead spaced apart from the die paddle and on one side of the die paddle, a second lead spaced apart from the die paddle and on another side of the die paddle, a spacer on the die paddle, a semiconductor die on the spacer, a first wire configured to connect an upper surface of the semiconductor die to the first lead, and a mold film configured to cover the die paddle, the first lead, the second lead, the spacer, the semiconductor die, and the first wire, wherein a first width of the spacer is greater than a second width of the die paddle so that the spacer overlaps the first lead may be provided.
    Type: Application
    Filed: June 30, 2023
    Publication date: March 14, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jae Hyun LIM, Sung Woo PARK, Hyun Jong MOON, Kwang Jin LEE