Abstract: A memory device includes: a first casing; a second casing on the first casing; a memory module in an inner space between the first and second casings; and a plate between the first and second casings, wherein the plate includes an air hole and a wing, and wherein the wing includes: a first segment near an outside of the first and second casings; and a second segment near the inner space, wherein the first segment is located at a level different from a level of the second segment.

Abstract: A semiconductor device includes a first case part, a second case part coupled to the first case part to provide a case, a semiconductor module disposed within the case closer to the second case part than to the first case part, and a plate interposed between the first case part and the semiconductor module. The plate is a thermal conductor, that is a material having thermal conductivity, to transfer heat generated by the semiconductor module to the case where the heat can dissipate to the outside of the semiconductor device.

Abstract: A solid state drive apparatus includes a case including a base and side walls extending upward along a circumference of the base, an electrostatic prevention structure of a metal pillar spaced apart from the side walls and protruding from at least a partial surface of the base and an electrostatic absorbing member on at least a partial surface of the metal pillar, a package substrate module mounted on the electrostatic prevention structure in the case, and a cover covering the case and the package substrate module.

Abstract: Provided is a method for manufacturing a brake pad used in a brake of a vehicle, which is capable of improving a limitation of separation of a friction material and a back plate of the brake pad. The method for manufacturing the brake pad includes manufacturing an intermediate plate and integrally pressing and molding a back plate and a friction material on both surfaces with the intermediate plate manufactured in a mold therebetween so that the back plate and the friction material are integrally coupled to each other by using the intermediate plate as a medium to manufacture the brake pad.

Abstract: A solid state drive apparatus includes a case including a base and side walls extending upward along a circumference of the base, an electrostatic prevention structure of a metal pillar spaced apart from the side walls and protruding from at least a partial surface of the base and an electrostatic absorbing member on at least a partial surface of the metal pillar, a package substrate module mounted on the electrostatic prevention structure in the case, and a cover covering the case and the package substrate module.

Abstract: Provided is a caliper unit for a brake of a vehicle, in particular, a compact caliper unit capable of reducing a size, a weight, and a production cost of a component and improving fuel efficiency. The caliper unit for the brake includes an inner pad and an outer pad, which press both surfaces of a disc to generate braking force, a torque member fixed to a vehicle body and coupled to be movable forward and backward so that the inner pad and the outer pad press the disc, or the pressing of the inner pad and the outer pad to the disc is released, a caliper housing including a cylinder to which a brake hydraulic pressure is applied and a reaction force support part configured to press the outer pad to the disc, and a piston installed in the cylinder and moving forward and backward depending on a state of the brake hydraulic pressure applied to the cylinder to press the inner pad to the disc.

Abstract: A gas injection module includes a showerhead having first injection holes on a first region of the showerhead and second injection holes on a second region of the showerhead, the second region being outside the first region, a first distribution plate on the showerhead and having first and second upper passages respectively connected to the first and second injection holes, and a flow rate controller on the first and second upper passages of the first distribution plate. The flow rate controller reduces a difference in pressure within the first and second upper passages so that the gas may have similar flow rates within the first and second injection holes.

Abstract: An embodiment console having a multi-storage configuration includes a console body configured to be disposed inside a vehicle, a first storage assembly located in the console body, and a second storage assembly held in the console body and configured to be withdrawn by deploying at least a portion of the console body, wherein the second storage assembly includes a housing including at least one surface of the console body and configured to be deployed to form a second storage region, a first support located at an upper end of the second storage region, and a second support configured to be deployed in an extension direction of the second storage region.

Abstract: A capacitor module configured to be horizontally mounted on a PCB and including; a case including a first side surface, an opposing second side, a first electrode pad and a second electrode pad disposed at the first side surface, and a third electrode pad disposed at the second side surface, and an electrolytic capacitor including a dielectric extending in a first horizontal direction, a first electrode contacting the first electrode pad and a second electrode contacting the second electrode pad, wherein the first electrode pad is spaced apart from second electrode pad in a second horizontal direction.

Abstract: A memory device includes: a first casing; a second casing on the first casing; a memory module in an inner space between the first and second casings; and a plate between the first and second casings, wherein the plate includes an air hole and a wing, and wherein the wing includes: a first segment near an outside of the first and second casings; and a second segment near the inner space, wherein the first segment is located at a level different from a level of the second segment.

Abstract: A semiconductor device includes a first case part, a second case part coupled to the first case part to provide a case, a semiconductor module disposed within the case closer to the second case part than to the first case part, and a plate interposed between the first case part and the semiconductor module. The plate is a thermal conductor, i.e., is of material having thermal conductivity, to transfer heat generated by the semiconductor module to the case where the heat can dissipate to the outside of the semiconductor device.

Abstract: A memory device includes: a first casing; a second casing on the first casing; a memory module in an inner space between the first and second casings; and a plate between the first and second casings, wherein the plate includes an air hole and a wing, and wherein the wing includes: a first segment near an outside of the first and second casings; and a second segment near the inner space, wherein the first segment is located at a level different from a level of the second segment.

Abstract: A semiconductor device includes a first case part, a second case part coupled to the first case part to provide a case, a semiconductor module disposed within the case closer to the second case part than to the first case part, and a plate interposed between the first case part and the semiconductor module. The plate is a thermal conductor, i.e., is of material having thermal conductivity, to transfer heat generated by the semiconductor module to the case where the heat can dissipate to the outside of the semiconductor device.

Abstract: A gas injection module includes a showerhead having first injection holes on a first region of the showerhead and second injection holes on a second region of the showerhead, the second region being outside the first region, a first distribution plate on the showerhead and having first and second upper passages respectively connected to the first and second injection holes, and a flow rate controller on the first and second upper passages of the first distribution plate. The flow rate controller reduces a difference in pressure within the first and second upper passages so that the gas may have similar flow rates within the first and second injection holes.

Abstract: A gas injection module includes a showerhead having first injection holes on a first region of the showerhead and second injection holes on a second region of the showerhead, the second region being outside the first region, a first distribution plate on the showerhead and having first and second upper passages respectively connected to the first and second injection holes, and a flow rate controller on the first and second upper passages of the first distribution plate. The flow rate controller reduces a difference in pressure within the first and second upper passages so that the gas may have similar flow rates within the first and second injection holes.

Abstract: A substrate processing method includes providing a substrate into a process chamber; introducing a reference light into the process chamber; generating a plasma light in the process chamber while performing an etching process on the substrate; receiving the reference light and the plasma light; and detecting an etching end point by analyzing the plasma light and the reference light. Detecting the etching end point includes a compensation adjustment based on a change rate of an absorption signal of the reference light with respect to a change rate of an emission signal of the plasma light.

Abstract: A memory device includes: a first casing; a second casing on the first casing; a memory module in an inner space between the first and second casings; and a plate between the first and second casings, wherein the plate includes an air hole and a wing, and wherein the wing includes: a first segment near an outside of the first and second casings; and a second segment near the inner space, wherein the first segment is located at a level different from a level of the second segment.

Abstract: A memory device includes: a first casing; a second casing on the first casing; a memory module in an inner space between the first and second casings; and a plate between the first and second casings, wherein the plate includes an air hole and a wing, and wherein the wing includes: a first segment near an outside of the first and second casings; and a second segment near the inner space, wherein the first segment is located at a level different from a level of the second segment.

Abstract: A substrate processing method includes providing a substrate into a process chamber; introducing a reference light into the process chamber; generating a plasma light in the process chamber while performing an etching process on the substrate; receiving the reference light and the plasma light; and detecting an etching end point by analyzing the plasma light and the reference light.

Abstract: A gas injection module includes a showerhead having first injection holes on a first region of the showerhead and second injection holes on a second region of the showerhead, the second region being outside the first region, a first distribution plate on the showerhead and having first and second upper passages respectively connected to the first and second injection holes, and a flow rate controller on the first and second upper passages of the first distribution plate. The flow rate controller reduces a difference in pressure within the first and second upper passages so that the gas may have similar flow rates within the first and second injection holes.