Abstract: An electronic device and a control method therefor are disclosed. A method for controlling an electronic device according to the present invention comprises the steps of: receiving a current frame; determining a region, within the current frame, where there is a movement, on the basis of a prior frame and the current frame; inputting the current frame into an artificial intelligence learning model on the basis of the region where there is the movement, to obtain information relating to at least one object included in the current frame; and determining the object included in the region where there is the movement, by using the obtained information relating to the at least one object. Therefore, electronic device can rapidly determine an object included in a frame configuring a captured image.

Abstract: The present embodiments provides a memory repair solution finding device and method which find a fault by testing a memory and find a repair solution in parallel and dynamically reconfigure the stored fault information to minimize a repair solution searching time with an optimal repair rate.

Abstract: The present exemplary embodiments provide a security circuit which senses a micro probe attack by changing both ends of a wire of a shield to be a high impedance state to change a connection state of the wire and analyzing a test signal reflected by the connected wire path, or senses a focused ion beam attack by changing both ends of a wire of a shield to be a high impedance state to change a connection state of the wire and analyzing a test signal which passes through a selected wire for every group, or blocks a physical approach by changing an accessible signal path to be a high impedance state when an external attack is detected by the detection circuit.

Abstract: The present embodiments provide a stacked memory apparatus and a repairing method thereof which store information about a spare resource in a pre-bond process, check a spare resource available in a post-bond process, correct an error through an error correction code, and variably use the same number of spare resources to additionally ensure a number of spare resources in the post-bond process, thereby improving a yield.

Abstract: Zero-power system for remote monitoring of heat sources is provided. The systems detect failure indicators of remote equipment including power substations, oil rigs, large inaccessible machinery in a factory, and communications equipment. The systems also can be used to detect the presence of people in buildings or in other locations, so as to improve HVAC utilization in large buildings. When the zero-power monitoring systems detect heat sources, such as the presence of people, failure indicators, or a targeted environmental signal, a circuit is closed using the energy of the detected radiation, and activating an RFID tag, a radio transmitter, or an alarm. The monitoring systems can remain deployed and active for many years without the need for battery replacement.

Abstract: An electronic device and a control method therefor are disclosed. A method for controlling an electronic device according to the present invention comprises the steps of: receiving a current frame; determining a region, within the current frame, where there is a movement, on the basis of a prior frame and the current frame; inputting the current frame into an artificial intelligence learning model on the basis of the region where there is the movement, to obtain information relating to at least one object included in the current frame; and determining the object included in the region where there is the movement, by using the obtained information relating to the at least one object. Therefore, electronic device can rapidly determine an object included in a frame configuring a captured image.

Abstract: The present disclosure relates to an artificial intelligence (AI) system that utilizes a machine learning algorithm, and applications therefore. Disclosed is an electronic device. The electronic device comprises: a storage unit which stores therein an artificial intelligence model trained to determine parameters for a plurality of filters used for image processing on the basis of a deep neural network (DNN); and a processor for determining, through the artificial intelligence mode, parameters for each of the plurality of filters used for image processing for an input image, and performing, through the plurality of filters, filtering of the input image on the basis of the determined parameters so as to perform image processing for the input image.

Abstract: The present embodiments provides a memory repair solution finding device and method which find a fault by testing a memory and find a repair solution in parallel and dynamically reconfigure the stored fault information to minimize a repair solution searching time with an optimal repair rate.

Abstract: The present exemplary embodiments provide a security circuit which senses a micro probe attack by changing both ends of a wire of a shield to be a high impedance state to change a connection state of the wire and analyzing a test signal reflected by the connected wire path, or senses a focused ion beam attack by changing both ends of a wire of a shield to be a high impedance state to change a connection state of the wire and analyzing a test signal which passes through a selected wire for every group, or blocks a physical approach by changing an accessible signal path to be a high impedance state when an external attack is detected by the detection circuit.

Abstract: The disclosure relates to an artificial intelligence (AI) system that simulates functions such as cognition and judgment of the human brain by utilizing machine learning algorithms such as deep learning and its applications.

Abstract: A zero-power plasmonic microelectromechanical system (MEMS) device is capable of specifically sensing electromagnetic radiation and performing signal processing operations. Such devices are highly sensitive relays that consume no more than 10 nW of power, utilizing the energy in detected electromagnetic radiation to detect and discriminate a target without the need of any additional power source. The devices can continuously monitor an environment and wake up an electronic circuit upon detection of a specific trigger signature of electromagnetic radiation, such as vehicular exhaust, gunfire, an explosion, a fire, a human or animal, and a variety of sources of radiation from the ultraviolet to visible light, to infrared, to terahertz radiation.

Abstract: The present embodiments provide a stacked memory apparatus and a repairing method thereof which store information about a spare resource in a pre-bond process, check a spare resource available in a post-bond process, correct an error through an error correction code, and variably use the same number of spare resources to additionally ensure a number of spare resources in the post-bond process, thereby improving a yield.

Abstract: A zero-power plasmonic microelectromechanical system (MEMS) device is capable of specifically sensing electromagnetic radiation and performing signal processing operations. Such devices are highly sensitive relays that consume no more than 10 nW of power, utilizing the energy in detected electromagnetic radiation to detect and discriminate a target without the need of any additional power source. The devices can continuously monitor an environment and wake up an electronic circuit upon detection of a specific trigger signature of electromagnetic radiation, such as vehicular exhaust, gunfire, an explosion, a fire, a human or animal, and a variety of sources of radiation from the ultraviolet to visible light, to infrared, to terahertz radiation.

Abstract: Exemplary embodiments of the present invention provides a three dimensional integrated circuit and a method for repairing the three dimensional integrated circuit which dispose a signal through silicon via (STSV) or a redundant through silicon via (RTSV) for each basic unit in which a through silicon via (TSV) and a switch are combined and connect repair paths among the basic units to efficiently repair a defective through silicon via which exists in a dense area by using a small number of redundant resources.

Abstract: Disclosed are a stacked memory device and a method of repairing the same, in which spare cells for a post-bond test and repair process are disposed in a base die and the spare cells are used in each memory layer as many as the number desired, a repair result after the test is permanently stored, and the spare cell of the base die and the memory layer are simultaneously approached and meaningful data is selected, so that it is not necessary to newly perform a test even though power of a memory is blocked, it is possible to solve time wasted during an approach to a memory layer after a spare memory performs determination, and it is possible to secure a high repair rate.

Abstract: An encoding apparatus connected to a learning circuit processing learning of a deep neural network and configured to perform encoding for reconfiguring connection or disconnection of a plurality of edges in a layer of the deep neural network using an edge sequence generated based on a random number sequence and dropout information indicating a ratio between connected edges and disconnected edges of a plurality of edges included in a layer of the deep neural network.

Abstract: Exemplary embodiments of the present invention provides a three dimensional integrated circuit and a method for repairing the three dimensional integrated circuit which dispose a signal through silicon via (STSV) or a redundant through silicon via (RTSV) for each basic unit in which a through silicon via (TSV) and a switch are combined and connect repair paths among the basic units to efficiently repair a defective through silicon via which exists in a dense area by using a small number of redundant resources.

Abstract: Disclosed are a stacked memory device and a method of repairing the same, in which spare cells for a post-bond test and repair process are disposed in a base die and the spare cells are used in each memory layer as many as the number desired, a repair result after the test is permanently stored, and the spare cell of the base die and the memory layer are simultaneously approached and meaningful data is selected, so that it is not necessary to newly perform a test even though power of a memory is blocked, it is possible to solve time wasted during an approach to a memory layer after a spare memory performs determination, and it is possible to secure a high repair rate.

Abstract: A zero-power plasmonic microelectromechanical system (MEMS) device is capable of specifically sensing electromagnetic radiation and performing signal processing operations. Such devices are highly sensitive relays that consume no more than 10 nW of power, utilizing the energy in detected electromagnetic radiation to detect and discriminate a target without the need of any additional power source. The devices can continuously monitor an environment and wake up an electronic circuit upon detection of a specific trigger signature of electromagnetic radiation, such as vehicular exhaust, gunfire, an explosion, a fire, a human or animal, and a variety of sources of radiation from the ultraviolet to visible light, to infrared, to terahertz radiation.

Abstract: Disclosed is a three-dimensional integrated circuit divided into a plurality of groups and capable of repairing failed through-silicon vias (TSVs). In particular, the three-dimensional integrated circuit includes a plurality of through-silicon vias (TSVs) vertically penetrating the three-dimensional integrated circuit and included in each of the groups, and two or more redundant through-silicon vias (RTSVs), wherein, when the number of failed TSVs in one group exceeds a repairable number, the failed TSVs exceeding the repairable number are repaired using at least one RTSV included in another group adjacent to the group.