Patents by Inventor Sushumna Iruvanti
Sushumna Iruvanti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 5990418Abstract: A device and method for hermetically sealing an integrated circuit chip between a substrate and a lid while providing effective dissipation of heat generated by the integrated circuit chip. The device includes an integrated circuit chip, carrier substrate, interface coolant, and a lid. The integrated circuit chip is attached to the top of the carrier substrate. The interface coolant is disposed on the top of the integrated circuit chip and the lid is placed on top of the carrier substrate/integrated circuit chip combination and contacts the interface coolant. The interface coolant provides a thermal path for conducting heat from the integrated circuit chip to the lid. The substrate is attached to a circuit board by a ceramic ball grid array (CBGA) or a ceramic column grid array (CCGA).Type: GrantFiled: July 29, 1997Date of Patent: November 23, 1999Assignee: International Business Machines CorporationInventors: Kevin G. Bivona, Jeffrey T. Coffin, Stephen S. Drofitz, Jr., Lewis S. Goldmann, Mario J. Interrante, Sushumna Iruvanti, Raed A. Sherif
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Patent number: 5981310Abstract: A multi-chip module and heat-sink cap assembly and method of fabrication, which provides sufficient cooling for higher power density chips. The heat-sink cap has heat-sink columns disposed over each chip on a substrate. The heat-sink columns are interconnected by flexible members to provide a unitary cover. Thin film metallization of at least a portion of the mating surfaces of the substrate, chips and heat-sink column permits soldering of the cap to the chips and substrate to form the package which is a mechanically stable structure with no degradation of interconnection fatigue life due to thermal cycling of the assembly when in use.Type: GrantFiled: January 22, 1998Date of Patent: November 9, 1999Assignee: International Business Machines CorporationInventors: Giulio DiGiacomo, Stephen S. Drofitz, Jr., David L. Edwards, Larry D. Gross, Sushumna Iruvanti, Raed A. Sherif, Subhash L. Shinde, David J. Womac, David B. Goland, Lester W. Herron
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Patent number: 5930597Abstract: A C4 or flip chip reworkable electronic device is provided comprising an integrated circuit chip having conductive pads thereon which pads are electrically connected to corresponding pads on an interconnection substrate by solder connections, wherein the space between the chip and substrate is sealed using a specially defined thermoplastic resin such as polysulfone and polyetherimide.Type: GrantFiled: April 15, 1997Date of Patent: July 27, 1999Assignee: International Business Machines CorporationInventors: Anson Jay Call, Stephen Leslie Buchwalter, Sushumna Iruvanti, Stanley J. Jasne, Frank L. Pompeo, Jr., Paul Anthony Zucco, Wayne Martin Moreau
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Patent number: 5891755Abstract: A process wherein thermal material such as a paste or gel is confined within a paste gap between a surface of a flat cooling plate and an opposing surface of a chip mounted on a surface of a chip carrier or substrate by forming a partition, preferably in the form of a grid, at the periphery of one or more chips. The partition is located laterally in sufficient proximity to the chip and in communication with the paste gap to form a capillary and thus confine motion of a viscous thermal material to repetitive bidirectional flow out of and into the paste gap with relative motion of the chip and the surface of the flat cooling plate. The grid is preferably fitted closely within grooves formed in the surface of the flat cooling plate and preferably supported by leaf springs so that thermal material is confined within cells of the grid while providing support and/or damping of relative motion between the flat cooling plate and the substrate or carrier.Type: GrantFiled: March 27, 1997Date of Patent: April 6, 1999Assignee: International Business Machines CorporationInventors: David Linn Edwards, Sushumna Iruvanti, Gaetano Paolo Messina, Raed A. Sherif
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Patent number: 5881945Abstract: The present invention relates generally to a new scheme of providing a seal band for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method that uses a multi-layer metallic seal to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection. For the preferred embodiment the multi-layer metallic seal band is a three layer, solder sandwich structure which is used to create a low cost, high reliability, hermetic seal for the module. This solder sandwich has a high melting temperature thick solder inner core, and lower melting point thin interconnecting solder layers, where the thin interconnecting solder layers may have similar or different melting points.Type: GrantFiled: April 30, 1997Date of Patent: March 16, 1999Assignee: International Business Machines CorporationInventors: David L. Edwards, Armando S. Cammarano, Jeffrey T. Coffin, Mark G. Courtney, Stephen S. Drofitz, Jr., Michael J. Ellsworth, Jr., Lewis S. Goldmann, Sushumna Iruvanti, Frank L. Pompeo, William E. Sablinski, Raed A. Sherif, Hilton T. Toy
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Patent number: 5881944Abstract: The present invention relates generally to a new scheme of providing a seal band for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method that uses a multi-layer metallic seal to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection. For the preferred embodiment the multi-layer metallic seal band is a three layer, solder sandwich structure which is used to create a low cost, high reliability, hermetic seal for the module. This solder sandwich has a high melting temperature thick solder inner core, and lower melting point thin interconnecting solder layers, where the thin interconnecting solder layers may have similar or different melting points.Type: GrantFiled: April 30, 1997Date of Patent: March 16, 1999Assignee: International Business Machines CorporationInventors: David L. Edwards, Armando S. Cammarano, Jeffrey T. Coffin, Mark G. Courtney, Stephen S. Drofitz, Jr., Michael J. Ellsworth, Jr., Lewis S. Goldmann, Sushumna Iruvanti, Frank L. Pompeo, William E. Sablinski, Raed A. Sherif, Hilton T. Toy
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Patent number: 5825087Abstract: An electronic module is provided comprising integrated circuit chips mounted on a substrate and having a specially designed cooling plate overlying the chip producing a gap above about 1 mil and a thermal paste or thermal adhesive between the cooling plate and the chip to facilitate heat transfer from the chip to the cooling plate. The cooling plate has a roughened area made by grit blasting and the like and having a roughness of about 0.4 to 6.4 microns or comprising a plurality of channels and corresponding protrusions overlying the chip area which roughened area penetrates the thermal paste and thermal adhesive and improves the adhesion and inhibits the flow of thermal paste from between the lower surface of the cooling plate and the upper surface of the chip during operation of the electronic module.Type: GrantFiled: December 3, 1996Date of Patent: October 20, 1998Assignee: International Business Machines CorporationInventors: Sushumna Iruvanti, Martin Klepeis, Gaetano Paolo Messina, Raed Sherif
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Patent number: 5819402Abstract: The present invention relates generally to a new apparatus and method for customized cooling of chips. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by varying the depth of thermal compound filled gap or the blind hole that is above each chip.Type: GrantFiled: June 4, 1997Date of Patent: October 13, 1998Assignee: International Business Machines CorporationInventors: David Linn Edwards, Mark Gerard Courtney, Albert Joseph Fahey, Gregory Scott Hopper, Sushumna Iruvanti, Charles Frederick Jones, Gaetano Paolo Messina, Raed A. Sherif
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Patent number: 5770478Abstract: An electronic module is provided comprising integrated circuit chips mounted on a substrate and having a specially designed cooling plate overlying the chip producing a gap above about 1 mil and a thermal paste or thermal adhesive between the cooling plate and the chip to facilitate heat transfer from the chip to the cooling plate. The cooling plate has a roughened area made by grit blasting and the like and having a roughness of about 0.4 to 6.4 microns or comprising a plurality of channels and corresponding protrusions overlying the chip area which roughened area penetrates the thermal paste and thermal adhesive and improves the adhesion and inhibits the flow of thermal paste from between the lower surface of the cooling plate and the upper surface of the chip during operation of the electronic module.Type: GrantFiled: April 7, 1997Date of Patent: June 23, 1998Assignee: International Business Machines CorporationInventors: Sushumna Iruvanti, Martin Klepeis, Gaetano Paolo Messina, Raed Sherif
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Patent number: 5757620Abstract: The present invention relates generally to a new apparatus and method for customized cooling of chips. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by varying the depth of thermal compound filled gap or the blind hole that is above each chip.Type: GrantFiled: August 2, 1996Date of Patent: May 26, 1998Assignee: International Business Machines CorporationInventors: David Linn Edwards, Mark Gerard Courtney, Albert Joseph Fahey, Gregory Scott Hopper, Sushumna Iruvanti, Charles Frederick Jones, Gaetano Paolo Messina, Raed A. Sherif
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Patent number: 5724729Abstract: The present invention relates generally to a new apparatus and method for customized cooling of chips using a plurality of thermally conductive materials. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by using a plurality of thermally conductive materials.Type: GrantFiled: April 15, 1996Date of Patent: March 10, 1998Assignee: International Business Machines CorporationInventors: Raed A. Sherif, Mark Gerard Courtney, David Linn Edwards, Albert Joseph Fahey, Gregory Scott Hopper, Sushumna Iruvanti, Charles Frederick Jones, Gaetano Paolo Messina
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Patent number: 5706171Abstract: Thermal material such as a paste or gel is confined within a paste gap between a surface of a flat cooling plate and an opposing surface of a chip mounted on a surface of a chip carrier or substrate by forming a partition, preferably in the form of a grid, at the periphery of one or more chips. The partition is located laterally in sufficient proximity to the chip and in communication with the paste gap to form a capillary and thus confine motion of a viscous thermal material to repetitive bidirectional flow out of and into the paste gap with relative motion of the chip and the surface of the flat cooling plate. The grid is preferably fitted closely within grooves formed in the surface of the flat cooling plate and preferably supported by leaf springs so that thermal material is confined within cells of the grid while providing support and/or damping of relative motion between the flat cooling plate and the substrate or carrier.Type: GrantFiled: November 20, 1995Date of Patent: January 6, 1998Assignee: International Business Machines CorporationInventors: David Linn Edwards, Sushumna Iruvanti, Gaetano Paolo Messina, Raed A. Sherif
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Patent number: 5659203Abstract: A C4 or flip chip reworkable electronic device is provided comprising integrated circuit chip having conductive pads thereon which pads are electrically connected to corresponding pads on an interconnection substrate by solder connections, wherein the space between the chip and substrate is sealed using a specially defined thermoplastic resin such as polysulfone and polyetherimide.Type: GrantFiled: June 7, 1995Date of Patent: August 19, 1997Assignee: International Business Machines CorporationInventors: Anson Jay Call, Stephen Leslie Buchwalter, Sushumna Iruvanti, Stanley J. Jasne, Frank L. Pompeo, Jr., Paul Anthony Zucco, Wayne Martin Moreau
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Patent number: 5623394Abstract: The present invention relates generally to a new apparatus and method for customized cooling of chips using a plurality of thermally conductive materials. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by using a plurality of thermally conductive materials.Type: GrantFiled: August 2, 1996Date of Patent: April 22, 1997Assignee: International Business Machines CorporationInventors: Raed A. Sherif, Mark G. Courtney, David L. Edwards, Albert J. Fahey, Gregory S. Hopper, Sushumna Iruvanti, Charles F. Jones, Gaetano P. Messina
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Patent number: 5604978Abstract: The present invention relates generally to a new apparatus and method for customized cooling of chips using a plurality of thermally conductive materials. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by using a plurality of thermally conductive materials.Type: GrantFiled: May 31, 1995Date of Patent: February 25, 1997Assignee: International Business Machines CorporationInventors: Raed A. Sherif, Mark G. Courtney, David L. Edwards, Albert J. Fahey, Gregory S. Hopper, Sushumna Iruvanti, Charles F. Jones, Gaetano P. Messina
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Patent number: 5591789Abstract: A paste composition having a high thermal conductivity and a relatively low viscosity is used to provide a thermal conductive connection between an electronic component and a cooling device to increase the heat transfer rate between the component and the device cooling the electronic component. The paste composition comprises a non-aqueous dielectric carrier, thermally conductive filler particles and a specially defined dispersant comprising the self-condensation reaction product of a hydroxy fatty acid, the reaction product having an acid number of about 30-100. A 12-hydroxy stearic acid self condensed reaction product is the preferred dispersant.Type: GrantFiled: June 7, 1995Date of Patent: January 7, 1997Assignee: International Business Machines CorporationInventors: Sushumna Iruvanti, Keith S. Olsen, Krishna G. Sachdev
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Patent number: 5098609Abstract: A paste including a thermally conducting solid filler, a nonaqueous liquid carrier and a stabilizing dispersant. The pastes are highly concentrated, of low viscosity, electrically resistive, highly thermally conducting and stable. The pastes are easily applicable to electrical and electronic devices and may be removed therefrom with common solvents to access components where necessary.Type: GrantFiled: November 3, 1989Date of Patent: March 24, 1992Assignee: The Research Foundation of State Univ. of N.Y.Inventors: Sushumna Iruvanti, Rakesh K. Gupta, Eli Ruckenstein