Patents by Inventor Tadahiro Nakagawa

Tadahiro Nakagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11976855
    Abstract: A heat exchanger and an air conditioner including the same. The heat exchanger includes a plurality of heat transfer tubes formed in a flat shape and configured to allow a refrigerant to flow in a vertical direction therein. The heat transfer tube includes a gas refrigerant region including one end connected to a refrigerant inlet port and another end disposed above the refrigerant inlet port; a two-phase refrigerant region including one end connected to the other end of the gas refrigerant region and another end disposed below a refrigerant outlet port; and a liquid refrigerant region including one end connected to the other end of the two-phase refrigerant region and another end connected to the refrigerant outlet port.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: May 7, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyunyoung Kim, Yo Agata, Kentaro Imagawa, Tadahiro Nakagawa, Takeshi Takahara
  • Patent number: 11493249
    Abstract: A refrigerant charging device and a refrigerant charging system include a refrigerant charging flour path having a refrigerant charging port connected to a refrigerant flow path of an air conditioner, a valve provided at the refrigerant charging flow path, and a control device configured to control the valve. The control device includes a discharging superheat calculator configured to calculate the discharging superheat degree from a refrigerant temperature and a refrigerant pressure at a discharge side of a compressor, and a valve controller configured to control the opening and closing state of the valve based on the calculated discharging superheat degree calculated by the discharge super-heat calculator.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: November 8, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tadahiro Nakagawa, Hiroaki Eguchi, Masatoshi Takahashi
  • Publication number: 20210140691
    Abstract: A heat exchanger and an air conditioner including the same. The heat exchanger includes a plurality of heat transfer tubes formed in a flat shape and configured to allow a refrigerant to flow in a vertical direction therein. The heat transfer tube includes a gas refrigerant region including one end connected to a refrigerant inlet port and another end disposed above the refrigerant inlet port; a two-phase refrigerant region including one end connected to the other end of the gas refrigerant region and another end disposed below a refrigerant outlet port; and a liquid refrigerant region including one end connected to the other end of the two-phase refrigerant region and another end connected to the refrigerant outlet port.
    Type: Application
    Filed: November 13, 2020
    Publication date: May 13, 2021
    Inventors: Hyunyoung KIM, Yo AGATA, Kentaro IMAGAWA, Tadahiro NAKAGAWA, Takeshi TAKAHARA
  • Publication number: 20210003332
    Abstract: The present invention provides an inexpensive and stable refrigerant charging device and a refrigerant charging system by improving a charging speed and reducing costs while preventing liquid-back. The present invention includes a refrigerant charging flow path having a refrigerant charging port connected to a refrigerant flow path of an air conditioner, a valve provided at the refrigerant charging flow path, and a control device configured to control the valve. The control device includes a discharging superheat calculator configured to calculate the discharging superheat degree from a refrigerant temperature and a refrigerant pressure at a discharge side of a compressor, and a valve controller configured to control the opening and closing state of the valve based on the calculated discharging superheat degree calculated by the discharge super-heat calculator.
    Type: Application
    Filed: July 2, 2020
    Publication date: January 7, 2021
    Inventors: Tadahiro NAKAGAWA, Hirooaki EGUCHI, Masatoshi TAKAHASHI
  • Patent number: 10156390
    Abstract: An air conditioner includes a heat storage apparatus for storing heat emitted from a compressor arranged in an outdoor unit, wherein the heat storage apparatus includes a heat storage tank installed in the compressor for storing heat emitted from the compressor and a heat transfer member configured to deliver heat emitted from the compressor to the heat storage tank, wherein the heat storage tank includes a first heat transfer face configured to have a form corresponding to a part of an outer circumferential face of the compressor to come into contact with the outer circumferential face of the compressor and a pair of second heat transfer faces configured to extend from both ends of the first heat transfer face to be in parallel to each other and form space with the outer circumferential face of the compressor, and wherein the heat transfer member is arranged in the space.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: December 18, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Tadahiro Nakagawa
  • Publication number: 20180231278
    Abstract: An air conditioner includes a heat storage apparatus for storing heat emitted from a compressor arranged in an outdoor unit, wherein the heat storage apparatus includes a heat storage tank installed in the compressor for storing heat emitted from the compressor and a heat transfer member configured to deliver heat emitted from the compressor to the heat storage tank, wherein the heat storage tank includes a first heat transfer face configured to have a form corresponding to a part of an outer circumferential face of the compressor to come into contact with the outer circumferential face of the compressor and a pair of second heat transfer faces configured to extend from both ends of the first heat transfer face to be in parallel to each other and form space with the outer circumferential face of the compressor, and wherein the heat transfer member is arranged in the space.
    Type: Application
    Filed: October 28, 2015
    Publication date: August 16, 2018
    Applicant: Samsung Electronics Co., Ltd.
    Inventor: Tadahiro NAKAGAWA
  • Patent number: 9187321
    Abstract: A reactor includes a reaction part and a removal part. The reaction part is configured to generate at least two products as a result of a reaction of an unreacted material. The removal part is configured to selectively occlude at least one product from the at least two products so as to separate and remove the at least one product. The removal part includes an absorbent and a cooling unit. The absorbent releases heat at time of the selective occlusion of the at least one product. The cooling unit is configured to remove the heat released by the absorbent.
    Type: Grant
    Filed: October 23, 2012
    Date of Patent: November 17, 2015
    Assignee: DENSO CORPORATION
    Inventors: Takuya Fuse, Kazutoshi Kuwayama, Tadahiro Nakagawa
  • Patent number: 8951475
    Abstract: A chemical heat accumulator includes a receptacle, a first reaction vessel, and a second reaction vessel. The first reaction vessel is hermetically connected to the receptacle and supplied with water from the receptacle. The first reaction vessel contains a chemical compound that causes a hydration reaction with the water from the receptacle to generate water vapor by a heat of reaction, and causes a dehydration reaction by receiving heat. The second reaction vessel is hermetically connected to the first reaction vessel and supplied with the water vapor from the first reaction vessel. The second reaction vessel contains a chemical heat storage material that generates heat by causing a hydration reaction with the water vapor from the first reaction vessel and stores heat through a dehydration reaction caused by receiving heat. The chemical heat storage material is thermally in contact with an object to be heated.
    Type: Grant
    Filed: March 29, 2012
    Date of Patent: February 10, 2015
    Assignee: Denso Corporation
    Inventors: Katsuya Komaki, Hiroshi Mieda, Tadahiro Nakagawa, Takashi Shimazu, Tomohisa Wakasugi, Hiroyuki Mitsui, Hideo Sobukawa
  • Publication number: 20130025547
    Abstract: A fuel supply system includes an energy output device, a reformer and a cooling unit. The energy output device consumes fuel, which is a compound including hydrogen, and outputs energy. The reformer decomposes fuel so as to generate hydrogen which is to be supplied to the energy output device. The cooling unit cools the hydrogen generated in the reformer.
    Type: Application
    Filed: July 25, 2012
    Publication date: January 31, 2013
    Applicant: DENSO CORPORATION
    Inventors: Tadahiro NAKAGAWA, Takuya Fuse, Kazutoshi Kuwayama
  • Publication number: 20120251394
    Abstract: A chemical heat accumulator includes a receptacle, a first reaction vessel, and a second reaction vessel. The first reaction vessel is hermetically connected to the receptacle and supplied with water from the receptacle. The first reaction vessel contains a chemical compound that causes a hydration reaction with the water from the receptacle to generate water vapor by a heat of reaction, and causes a dehydration reaction by receiving heat. The second reaction vessel is hermetically connected to the first reaction vessel and supplied with the water vapor from the first reaction vessel. The second reaction vessel contains a chemical heat storage material that generates heat by causing a hydration reaction with the water vapor from the first reaction vessel and stores heat through a dehydration reaction caused by receiving heat. The chemical heat storage material is thermally in contact with an object to be heated.
    Type: Application
    Filed: March 29, 2012
    Publication date: October 4, 2012
    Applicant: DENSO CORPORATION
    Inventors: Katsuya Komaki, Hiroshi Mieda, Tadahiro Nakagawa, Takashi Shimazu, Tomohisa Wakasugi, Hiroyuki Mitsui, Hideo Sobukawa
  • Patent number: 6981859
    Abstract: The object of the present invention is to reduce irregularity of the amount of applying of the conductive paste applied for forming the side face electrode so as to be extended from a part of the side face of the component body up to a part of the face adjoining the side face, wherein the conductive paste is filled into the slit provided on the slit plate, and the component body is disposed with its side face toward the first principal face side of the slit plate, followed by allowing the shutter member to undergo elastic deformation toward the inside of the slit by compressing the shutter member comprising an elastic material with a projection on the compression member, thereby the conductive paste is applied so as to extend the paste from a part of the side face of the component body up to a part of the faces adjoining the side face while supplying the conductive paste on in the slit so as to swell on the first principal face.
    Type: Grant
    Filed: February 24, 2003
    Date of Patent: January 3, 2006
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shingo Okuyama, Tadahiro Nakagawa, Takehiko Miura, Makoto Fukuda
  • Patent number: 6715197
    Abstract: A laminated ceramic electronic component significantly simplifies a step of forming external electrodes and has reliable electrical connection between an internal electrode and the external electrodes. A method for manufacturing the laminated ceramic electronic component includes the steps of forming composite sheets each having a conductor and a ceramic layer provided at the sides of the conductor on a carrier film, laminating the composite sheets with each other for forming a mother laminate, cutting the mother laminate in the thickness direction thereof so as to divide the conductor for forming laminates each forming one laminated ceramic electronic component, in which the conductor is exposed on the cut surface of the laminate, and firing the laminate so as to simultaneously form external electrodes from the exposed conductors and a sintered ceramic body.
    Type: Grant
    Filed: May 22, 2001
    Date of Patent: April 6, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shingo Okuyama, Tadahiro Nakagawa
  • Publication number: 20030132544
    Abstract: The object of the present invention is to reduce irregularity of the amount of applying of the conductive paste applied for forming the side face electrode so as to be extended from a part of the side face of the component body up to a part of the face adjoining the side face, wherein the conductive paste is filled into the slit provided on the slit plate, and the component body is disposed with its side face toward the first principal face side of the slit plate, followed by allowing the shutter member to undergo elastic deformation toward the inside of the slit by compressing the shutter member comprising an elastic material with a projection on the compression member, thereby the conductive paste is applied so as to extend the paste from a part of the side face of the component body up to a part of the faces adjoining the side face while supplying the conductive paste on in the slit so as to swell on the first principal face.
    Type: Application
    Filed: February 24, 2003
    Publication date: July 17, 2003
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Shingo Okuyama, Tadahiro Nakagawa, Takehiko Miura, Makoto Fukuda
  • Patent number: 6569367
    Abstract: The object of the present invention is to reduce irregularity of the amount of applying of the conductive paste applied for forming the side face electrode so as to be extended from a part of the side face of the component body up to a part of the face adjoining the side face, wherein the conductive paste is filled into the slit provided on the slit plate, and the component body is disposed with its side face toward the first principal face side of the slit plate, followed by allowing the shutter member to undergo elastic deformation toward the inside of the slit by compressing the shutter member comprising an elastic material with a projection on the compression member, thereby the conductive paste is applied so as to extend the paste from a part of the side face of the component body up to a part of the faces adjoining the side face while supplying the conductive paste on in the slit so as to swell on the first principal face.
    Type: Grant
    Filed: May 25, 2000
    Date of Patent: May 27, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shingo Okuyama, Tadahiro Nakagawa, Takehiko Miura, Makoto Fukuda
  • Patent number: 6433995
    Abstract: An electrode is formed on a chip-like electronic part of the type having a central axis, a polygonal cross section as viewed in a plane which is perpendicular to the central axis, a plurality of side surfaces extending in respective planes which are generally parallel to the central axis, and a pair of end surfaces extending generally parallel to the central axis, each adjacent pair of side surfaces meeting along a respective edge of the chip-like electronic part. The electrode is formed by applying a first band of conductive material to at least one of the side surfaces and applying a second band of conductive material to the remaining side surface(s) in such a manner that the first and second bands meet at respective ones of the edges and together form a continuous band of conductive material extending around the outer periphery of the chip-type electronic part.
    Type: Grant
    Filed: April 20, 2001
    Date of Patent: August 13, 2002
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Tadahiro Nakagawa, Makoto Fukuda
  • Publication number: 20020008606
    Abstract: A laminated ceramic electronic component significantly simplifies a step of forming external electrodes and has reliable electrical connection between an internal electrode and the external electrodes. A method for manufacturing the laminated ceramic electronic component includes the steps of forming composite sheets each having a conductor and a ceramic layer provided at the sides of the conductor on a carrier film, laminating the composite sheets with each other for forming a mother laminate, cutting the mother laminate in the thickness direction thereof so as to divide the conductor for forming laminates each forming one laminated ceramic electronic component, in which the conductor is exposed on the cut surface of the laminate, and firing the laminate so as to simultaneously form external electrodes from the exposed conductors and a sintered ceramic body.
    Type: Application
    Filed: May 22, 2001
    Publication date: January 24, 2002
    Applicant: Murata Manufacturing Co., Ltd
    Inventors: Shingo Okuyama, Tadahiro Nakagawa
  • Patent number: 6306456
    Abstract: A method of forming an electrode of electronic component part which comprises: filling conductive paste in a slit of a slit plate, the slit being nearly equal to the width of an electrode to be formed and having an opening in the upper surface of the slit plate, making a rubber plate in contact with the side of the lower surface of the slit plate, making an electronic part in contact with and pressing against the upper surface of the slit plate, making the rubber plate deform so that the upper surface of the rubber plate protrudes into the slit, and by the deformation making the conductive paste protrude over the slit and adhere to the lower surface of the electronic part.
    Type: Grant
    Filed: February 25, 1999
    Date of Patent: October 23, 2001
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Makoto Fukuda, Tadahiro Nakagawa
  • Patent number: 6297942
    Abstract: A metal terminal includes a central portion having a cross section with a relatively large internal diameter and an approximately circular shape and cylindrical portions having a relatively a smaller diameter are extended from both sides of the central portion. The approximately circular shape portion is inserted into a through hole of a through hole type capacitor and disposed in contact with and elastically pressing against the inner wall of the through hole.
    Type: Grant
    Filed: August 31, 1998
    Date of Patent: October 2, 2001
    Assignee: Morata Manufacturing Co., LTD
    Inventors: Takahiro Azuma, Hidetoshi Yamamoto, Kunio Okumura, Tadahiro Nakagawa
  • Publication number: 20010013602
    Abstract: An electrode is formed on a chip-like electronic part of the type having a central axis, a polygonal cross section as viewed in a plane which is perpendicular to the central axis, a plurality of side surfaces extending in respective planes which are generally parallel to the central axis, and a pair of end surfaces extending generally parallel to the central axis, each adjacent pair of side surfaces meeting along a respective edge of the chip-like electronic part. The electrode is formed by applying a first band of conductive material to at least one of the side surfaces and applying a second band of conductive material to the remaining side surface(s) in such a manner that the first and second bands meet at respective ones of the edges and together form a continuous band of conductive material extending around the outer periphery of the chip-type electronic part.
    Type: Application
    Filed: April 20, 2001
    Publication date: August 16, 2001
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Tadahiro Nakagawa, Makoto Fukuda
  • Patent number: 6270613
    Abstract: An electrode is formed on a chip-like electronic part of the type having a central axis, a polygonal cross section as viewed in a plane which is perpendicular to the central axis, a plurality of side surfaces extending in respective planes which are generally parallel to the central axis, and a pair of end surfaces extending generally parallel to the central axis, each adjacent pair of side surfaces meeting along a respective edge of the chip-like electronic part. The electrode is formed by applying a first band of conductive material to at least one of the side surfaces and applying a second band of conductive material to the remaining side surface(s) in such a manner that the first and second bands meet at respective ones of the edges and together form a continuous band of conductive material extending around the outer periphery of the chip-type electronic part.
    Type: Grant
    Filed: July 24, 1998
    Date of Patent: August 7, 2001
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Tadahiro Nakagawa, Makoto Fukuda