Abstract: A dipping machine has a chucking portion for engaging a holding plate to downwardly direct chip components, which are held by the holding plate, and a dipping vessel provided under the chucking portion, which is coated with a thin film of electrode paste. Conveyors horizontally transfer the holding plate holding the downwardly directed chip components, coated with the electrode paste, to a drying furnace. The drying furnace receives the holding plate holding the chip components downwardly and rotates the same by 360.degree. for drying the electrode paste. Thus, the as-formed electrodes have uniform widths on side surfaces of the chip components and the electrode paste is protected against adhesion of foreign matters such as dust, whereby it is possible to manufacture chip components with stable quality.

Abstract: A method of press-molding a ceramic green sheet laminate for stacking a plurality of ceramic green sheets with each other and pressing the laminate thus obtained along its thickness by carrying out a first pressurization cycle including steps of pressurizing the laminate at a pressure value P.sub.3 and reducing the pressure to a value P.sub.2, and subsequently carrying out a second pressurization cycle including a step of pressurizing the laminate at a pressure value P.sub.4 and a pressure reduction step.

Abstract: An electrode forming system automatically carries out overall steps of charging chip components, coating electrode material on both ends of the components and discharging the components using a holding plate, a guide plate and a spacer. This system comprises a charger, a transferer, an electrode coater, a drying furnace, a holding plate standby means, a spacer storage means, a holding plate storage means, a discharger, a transport robot, conveyor means and a control unit. Movements of these apparatus are integratedly controlled by the control unit. The robot transports the holding plate, the guide plate or the spacer among these apparatus arranged within its working area.

Abstract: A thick layer of electrode material paint is formed on a flat surface. A film of the electrode material paint is formed on an element by dipping the element into the layer. In the next step, a thinner layer of the electrode material paint than the aforementioned layer is formed on a flat surface. Into the thinner layer of the electrode material paint, the film of the electrode material paint formed on the element is dipped. Alternatively, the element may first be dipped into a thinner layer of the electrode material paint so that a thin film of the electrode material paint is formed on the element. The film formed on the element is then dipped into a thick layer of the electrode material paint and then again into a thin layer of the electrode material paint in such order. By firing the film of the electrode material paint obtained in this manner, an electronic element having external electrodes of a uniform thickness can be obtained.

Abstract: An electrode forming apparatus comprises a recovery blade for collecting electrode paste on the bottom surface of a dipping vessel toward a first end of the dipping vessel and a levelling blade for levelling the electrode paste, being collected toward the first end, toward a second end of the dipping vessel for adjusting the same to a constant film thickness. The recovery blade and the levelling blade are supported by a blade support frame, which is horizontally reciprocated with respect to the dipping vessel. The recovery blade is vertically moved by a cylinder, while the vertical position of the levelling blade is finely controlled by a levelling control motor. Thus, the film thickness of the electrode paste can be accurately adjusted with excellent repeatability, thereby carrying out homogeneous electrode application.

Abstract: A chucking portion (10) is supported at the lower part of a dip head portion (2) to be vertically movable in a horizontal state through four shafts. Two diagonally positioned two shafts 11a, 11b are formed by ball screws, and the other two (11c, 11d) serve as guide shafts. The dip head portion (2) contains a motor (12) for synchronously driving the two ball screws, and the chucking portion (10) horizontally engages a holding plate (A) holding a number of chip type electronic components (B) to downwardly direct the same. A dipping vessel (7) having a bottom surface which is coated with a thin film of paste is horizontally arranged under the dip head portion (2). Thus, it is possible to maintain the holding plate in parallel with the paste, for applying electrodes to the chip type electronic components with high accuracy.

Abstract: Pin head mounting members are rotatably mounted on a horizontal spindle above a table which horizontally supports a holding, plate holding chip type electronic components. The spindle is vertically movable by a vertical cylinder. Each pin head mounting member is shaped as a rectangular sleeve. A mounting surface is formed on each side portion of the pin head mounting member. A pin head each having a number of press pin is detachably mounted on each of the mounting surfaces A locking pin is provided on an upper end portion of the spindle for locking the pin head mounting members every 90.degree.. Thus, it is possible to efficiently replace press pins in response to a type change of chip type electronic components, as well as to quickly exchange a broken press pin.

Abstract: Take-in and take-out conveyors are provided on horizontal sides of a chucking mechanism, which is adapted to engage a workpiece and vertically move the same, and disposed flush with each other for supplying and discharging the workpiece to and from a position of the chucking mechanism. A dipping vessel is provided immediately under the chucking mechanism at a position lower than the level at which the workpiece is carried by the take-in and take-out conveyors. The take-in and take-out conveyors, which are adapted to carry the workpiece in the same direction and at the same speed, are slid/driven in approaching and separating directions between standby positions, which are opposite to each other across a vertical space of the chucking mechanism, and working positions which are located near each other immediately under the chucking mechanism. Thus, it is possible to perform dipping with high accuracy without sliding the chucking portion while protecting the workpiece against vibration and deviation.

Abstract: A plurality of vertically extending cylinders are formed in the interior of a chuck body providing a chucking face on its lower surface. Pistons, in which permanent magnets are embedded, are vertically movably provided in respective ones of the cylinders. When compressed air is introduced into upper portions of the cylinders, the pistons are downwardly displaced so that the permanent magnets are relatively approached to the lower surface of the chuck body. Thus, the chucking face is supplied with magnetic force exceeding a prescribed level, to attract a holder holding electronic component chips, for example. When compressed air is introduced into lower portions of the cylinders, on the other hand, the pistons are upwardly displaced so that the permanent magnets are relatively separated from the lower surface of the chuck body. Thus, the chucking face is supplied with no magnetic force exceeding the prescribed level, so that the holder is separated from the chuck body.

Abstract: A method of forming external electrodes at both ends of chip parts while elastically holding the chip parts.

Abstract: A method of forming external electrodes at both ends of chip parts while elastically holding the chip parts.