Abstract: Provided herein are mixed resin systems and the use thereof for wafer-level underfill (WAUF) for three-dimensional TSV packages. In one aspect, there are provided compositions comprising (1) an epoxy resin, (2) a maleimide, nadimide or itaconamide, (3) an acrylate and (4) a filler. In certain aspects, the epoxy resin is a siloxane-modified resin. In certain aspects, the invention relates to underfill films prepared from invention compositions. In certain aspects, the invention relates to articles comprising the underfill films described herein.

Abstract: The present invention discloses an organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same, particularly used as an encapsulant in light emitting diodes.

Abstract: Provided herein are stabilized underfill film-containing assemblies which extend the work-life of underfill films. In accordance with certain aspects of the present invention, there are also provided stabilized underfill film-containing assemblies which extend the shelf-life of underfill films. In certain aspects of the present invention, there are also provided methods for extending the work-life of underfill films. In another aspect of the present invention, there are also provided methods for extending the shelf-life of underfill films.

Abstract: Provided herein are multilayer structures having a reduced propensity to warp upon curing of certain components thereof. In one aspect, there are provided multilayer assemblies comprising a plurality of the above-described multilayer structures. In another aspect, there are provided methods for reducing wafer warpage upon cure of molding compositions applied thereto. In yet another aspect, there are provided methods for preparing wafers having substantially no warpage upon cure thereof.

Abstract: The present invention discloses an organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same, particularly used as an encapsulant in light emitting diodes.

Abstract: An objective of the present invention is to provide a sinterable bonding material excellent in sinterability. The present invention relates to a sinterable bonding material comprising a silver filler and an organic base compound as a sintering promoter.

Abstract: An objective of the present invention is to provide a sinterable bonding material capable of providing a bonded article having a long-term reliability. The present invention relates to a sinterable bonding material comprising a silver filler and resin particles, wherein the silver filler comprises a flake-shaped filler having an arithmetic average roughness (Ra) of 10 nm or less; and the resin particles have an elastic modulus (E) of 10 GPa or less, and a heat decomposition temperature of 200° C. or more. The sintered product of the sinterable bonding material of the present invention is excellent in bonding strength and heat-release characteristics, and has an improved stress relaxation ability.

Abstract: A pouch container is provided with sack-like portions provided respectively to upper parts of the front-surface sheet and the rear-surface sheet.

Abstract: A pouch container as one example of an embodiment is equipped with wall-surface sheets and a grip part, said wall-surface sheets constituting at least a first surface and a second surface that face each other. The grip part comprises an interior sheet that is joined to the inner surface of the first surface and/or the second surface and openings that are formed on the wall-surface sheet to which the interior sheet is joined at positions where the wall-surface sheet overlaps with the interior sheet.

Abstract: Provided herein are multilayer structures having a reduced propensity to warp upon curing of certain components thereof. In one aspect, there are provided multilayer assemblies comprising a plurality of the above-described multilayer structures. In another aspect, there are provided methods for reducing wafer warpage upon cure of molding compositions applied thereto. In yet another aspect, there are provided methods for preparing wafers having substantially no warpage upon cure thereof.

Abstract: A pouch container is provided with sack-like portions provided respectively to upper parts of the front-surface sheet and the rear-surface sheet.

Abstract: Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.

Abstract: Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.

Abstract: Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.

Abstract: A pressing mold for use in press working of a material includes a mold body, a coating film formed on the portion of the pressing mold that comes into contact with the material in the press working, the coating film being formed by PVD method. The coating film includes a TiN layer formed on a surface of the mold body, a Ti(CxNy) layer (wherein, x+y=1, x<1, and x gradually increases to 1 as it becomes more distant from the surface of the TiN layer) formed on the TiN layer, and a TiC layer formed on the Ti(CxNy) layer.

Abstract: A document processing apparatus, including: a communication section to communicate with an external device; a document storage section to store a document file including a content portion and a menu information portion, wherein a content is stored in the content portion and menu information of executable processing for the content is stored in the menu information portion; and a menu display control section to control the communication section so as to transmit the menu information of an accessed document file to the external device, when an access request for the document file is received from external device via the communication section.

Abstract: In accordance with the present invention, there are provided filled epoxy-based formulations wherein the filler comprises silver-coated boron nitride particulate material. In accordance with a further embodiment of the present invention, there are provided articles comprising particulate boron nitride having a silver coating on at least a portion of the surface thereof. In additional embodiments of the present invention, there are provided methods for the use of invention articles and formulations.

Abstract: Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.

Abstract: Provided is a method which selects six points from nine sampling points surrounding a point (x,y)=(X,Y) as a center and estimates a Z-axis value of an arbitrary point in six triangles obtained by the (X,Y) point and the six points. The method selects two points substantially on a diagonal of a rectangle defined by the outermost circumference of the nine points and constitutes the six triangles by the six points excluding the two points.