Abstract: A sliding-type mobile communication terminal having a first housing and a second housing adapted to allow the first housing to be opened or closed by means of a sliding movement on the first housing in a longitudinal direction of the first housing. The terminal includes a spring module adapted to provide a sliding force, along the longitudinal direction of the first housing, for allowing closing of the second housing within a predetermined range of distance, and for providing the sliding force in an opposite direction for allowing opening of the second housing beyond the predetermined range of distance. The spring module includes link bars rotatably coupled in one end onto the first housing, coil springs supported by one end of the link bar and coupled to enclose the link bar, and a slider slidably coupled to the link bar to be acted upon by an elastic force from the coil spring. The terminal uses the elasticity in coil springs to implement a semi-automatic sliding opening/closure of the second housing.

Abstract: A method for preventing process errors in a semiconductor fabricating process allows only a few authorized engineers to release interlocks of semiconductor fabricating equipment when a count of interlock occurrences exceeds a predetermined number within a predetermined period of time. By allowing a semiconductor fabricating equipment operator only limited ability to reset equipment interlocks, repeated interlock conditions caused by test specification failures may be over-ridden only a predetermined number of times before the semiconductor fabricating equipment is disabled completely. The disabled semiconductor fabricating equipment may only be re-enabled using an authorization code, which is only made available to selected personnel, thereby ensuring that necessary repairs and corrections have been implemented on the semiconductor fabricating equipment.

Abstract: The present invention relates to amplifier combined digital amplifier using pulse width modulation and analog amplifier, and more particularly, to amplifier converting the analog input signal to pulse width modulation signal by comparing the analog input signal with triangle-wave, inputting the pulse width modulation signal to a dead time logic circuit, controlling the “ON”, and “OFF” operation of output transistor by output signal of the dead time logic circuit and converting the pulse width modulation signal of the output transistor to amplified analog signal using LC low pass filter. The present invention reduces the loss of efficiency of output transistor. Therefore the size of heat radiating plate can be easily reduced and amplifier with compact size can be accomplished by the present invention.

Abstract: Disclosed are flat panel field emitter displays whose unit cell structure adopt a planar cathode structure in stead of a conventional microtip structure, so as to increase the degree of integration and can be operated at low operation voltages at high speeds. In the structure, a channel insulator is formed below the cathode and underlaid by a gate. By means of the gate voltage, the electron emission from the cathode can be controlled. The electrodes in the structure are arranged in the order of anode, cathode and gate, allowing the simplification of processes. With the ease of controlling the distance between electrodes, the displays can be applied for almost all video systems from small sizes to large screen area displays, in place of conventional displays. The displays allows conventional semiconductor processes and facilities to be utilized as they are.

Abstract: The present invention relates to amplifier combined digital amplifier using pulse width modulation and analog amplifier, and more particularly, to amplifier converting the analog input signal to pulse width modulation signal by comparing the analog input signal with triangle-wave, inputting the pulse width modulation signal to a dead time logic circuit, controlling the “ON”, and “OFF” operation of output transistor by output signal of the dead time logic circuit and converting the pulse width modulation signal of the output transistor to amplified analog signal using LC low pass filter. The present invention reduces the loss of efficiency of output transistor. Therefore the size of heat radiating plate can be easily reduced and amplifier with compact size can be accomplished by the present invention.

Abstract: A method for preventing process errors in a semiconductor fabricating process allows only a few authorized engineers to release interlocks of semiconductor fabricating equipment when a count of interlock occurrences exceeds a predetermined number within a predetermined period of time. By allowing a semiconductor fabricating equipment operator only limited ability to reset equipment interlocks, repeated interlock conditions caused by test specification failures may be over-ridden only a predetermined number of times before the semiconductor fabricating equipment is disabled completely. The disabled semiconductor fabricating equipment may only be re-enabled using an authorization code, which is only made available to selected personnel, thereby ensuring that necessary repairs and corrections have been implemented on the semiconductor fabricating equipment.

Abstract: A system for manufacturing a print board assembly, which is implemented in a system having a computer for storing parts insertion instruction diagrams and displaying parts insertion instructions, and a soldering unit for soldering a printed circuit board, includes: assembling different types of the printed circuit boards from pieces of parts and inspecting them in a multitude of cells; installing different types of the printed circuit boards in carriers to assemble them separately according to the parts insertion instructions displayed by the computer of each cell, and moving them to the soldering unit through a transfer conveyor line; and returning the carriers having the printed circuit boards completely soldered to each cell identified for the carriers through a return conveyor line.

Abstract: A method of manufacturing a print board assembly, which is implemented in a system having a computer for storing parts insertion instruction diagrams and displaying parts insertion instructions, and a soldering unit for soldering a printed circuit board, includes the steps of: assembling different types of the printed circuit boards from pieces of parts and inspecting them in a multitude of cells; installing different types of the printed circuit boards in carriers to assemble them separately according to the parts insertion instructions displayed by the computer of each cell, and moving them to the soldering unit through a transfer conveyor line; and returning the carriers having the printed circuit boards completely soldered to each cell identified for the carriers through a return conveyor line.