Abstract: An apparatus for predicting a traffic speed and a method thereof are provided. The apparatus includes an input device that receives traffic speed sequences of a plurality of links and a controller that detects a spatio-temporal relationship between traffic speeds of the plurality of links and predicts a future traffic speed of a target link based on the spatio-temporal relationship between the traffic speeds of the plurality of links.

Abstract: A semiconductor light emitting device includes a light emitting structure having a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer, a transparent electrode layer on the second conductivity-type semiconductor layer and spaced apart from an edge of the second conductivity-type semiconductor layer, a first insulating layer on the light emitting structure to cover the transparent electrode layer and including a plurality of holes connected to the transparent electrode layer, and a reflective electrode layer on the first insulating layer and connected to the transparent electrode layer through the plurality of holes.

Abstract: The present invention provides an optical filter having a narrow bandpass, high transmittance in the bandpass, low transmittance outside the bandpass, little change in optical properties even when the incident angle of light changes and thus, being advantageous in terms of yield and cost per hour. In addition, the present invention may provide a LiDAR system including the optical filter and an application of the optical filter and the LiDAR system.

Abstract: An electronic device may include a semiconductor memory structured to include a plurality of memory cells, wherein each of the plurality of memory cells may comprise: a first electrode layer; a second electrode layer; and a selection element layer disposed between the first electrode layer and the second electrode layer to electrically couple or decouple an electrical connection between the first electrode layer and the second electrode layer based on a magnitude of an applied voltage or an applied current with respect to a threshold magnitude, wherein the selection element layer has a dopant concentration profile which decreases from an interface between the selection element layer and the first electrode layer toward an interface between the selection element layer and the second electrode layer.

Abstract: Proposed is a probe head having a probe card for performing a circuit inspection of a wafer. More particularly, proposed are a probe head and a probe card having the probe head, the probe head having a guide plate. The guide plate has a guide hole and a shield portion composed of a metal material positioned at the periphery of the guide hole, thereby blocking signal interference that may be occurred between adjacent probes.

Abstract: Proposed are an inductor and a manufacturing method thereof. More particularly, proposed are an inductor capable of mass production by simplifying the manufacturing process while satisfying the needs for miniaturization and low resistance, and a manufacturing method thereof.

Abstract: The present invention relates to a micro LED grip body and a system having the same for inspecting a micro LED, the micro LED grip body having a vacuum-suction structure capable of being used for transferring a micro LED, thereby solving problems of micro LED transfer heads that have been proposed in the related art.

Abstract: Proposed are a part having a corrosion-resistant layer that minimizes peeling off and particle generation of a porous ceramic layer, a manufacturing process apparatus having the same, and a method of manufacturing the part.

Abstract: Proposed is an anodic oxide film structure that includes an anodic oxide film sheet and has high strength, chemical resistance and corrosion resistance.

Abstract: Disclosed are a piezoelectric material-based electronic device having high recognition precision for a three-dimensional shape and improved durability, and a manufacturing method thereof. The electronic device includes an anodic oxide film, a first electrode provided on an upper surface of the anodic oxide film, a second electrode provided on an a lower surface of the anodic oxide film, and a piezoelectric column made of a piezoelectric material and provided between the first electrode and the second electrode.

Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same that facilitate realizing of pixels of the micro LED structure.

Abstract: Proposed are an anodic aluminum oxide mold made of an anodic aluminum oxide film, a manufacturing method thereof, a half-finished probe product, a manufacturing method thereof, a probe card, and a manufacturing method thereof.

Abstract: The present invention relates to a transfer head and a method of manufacturing a micro LED display using the same. In particular, the present invention relates to a transfer head and a method of manufacturing a micro LED display using the same, the transfer head mounting normal micro LEDs on a display substrate without performing a complicated process of sorting out defective micro LEDs from the micro LEDs mounted on the display substrate and replacing the defective micro LEDs with normal micro LEDs.

Abstract: Proposed is a probe head having a probe card for performing a circuit inspection of a wafer. More particularly, proposed are a probe head and a probe card having the probe head, the probe head having a guide plate. The guide plate has a guide hole and a shield portion composed of a metal material positioned at the periphery of the guide hole, thereby blocking signal interference that may be occurred between adjacent probes.

Abstract: Proposed is an anodic oxide film structure that includes an anodic oxide film sheet and has high strength, chemical resistance and corrosion resistance.

Abstract: A method of manufacturing a probe card and a probe card manufactured using the same are disclosed. The method is configured to be capable of collectively attaching probes to a wiring board provided with a connection pad to which the probes are attached.

Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same. More particularly, the present invention relates to a micro LED structure and a method of manufacturing the same, the micro LED structure including: a micro LED; a circuit board driving the micro LED; and an anisotropic conductive anodic oxide film provided between the micro LED and the circuit board to electrically connect the circuit board and the micro LED. According to the present invention, without applying an external force (thermocompression bonding) to the anisotropic conductive anodic oxide film, it is possible to electrically connect the circuit board and the micro LED. In addition, it is possible to obtain characteristics such as uniform conductivity in a vertical direction and heat dissipation.

Abstract: The present invention relates to a transfer head and a method of manufacturing a micro LED display using the same. In particular, the present invention relates to a transfer head and a method of manufacturing a micro LED display using the same, the transfer head mounting normal micro LEDs on a display substrate without performing a complicated process of sorting out defective micro LEDs from the micro LEDs mounted on the display substrate and replacing the defective micro LEDs with normal micro LEDs.

Abstract: A method for manufacturing a chip-mounting substrate includes a pre-coating step of forming a precoat on a substrate including a plurality of conductive portions and an insulating portion interposed between the conductive portions, an etching step of etching at least a portion of the precoat through a laser to form a pattern, and a step of forming a metal layer on the substrate. The pattern is disposed on at least one of the conductive portions, and the metal layer is formed in the pattern.

Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same. More particularly, the present invention relates to a micro LED structure and a method of manufacturing the same, the micro LED structure including: a micro LED; a circuit board driving the micro LED; and an anisotropic conductive anodic oxide film provided between the micro LED and the circuit board to electrically connect the circuit board and the micro LED. According to the present invention, without applying an external force (thermocompression bonding) to the anisotropic conductive anodic oxide film, it is possible to electrically connect the circuit board and the micro LED. In addition, it is possible to obtain characteristics such as uniform conductivity in a vertical direction and heat dissipation.