Abstract: A method for manufacturing a chip-mounting substrate includes a pre-coating step of forming a precoat on a substrate including a plurality of conductive portions and an insulating portion interposed between the conductive portions, an etching step of etching at least a portion of the precoat through a laser to form a pattern, and a step of forming a metal layer on the substrate. The pattern is disposed on at least one of the conductive portions, and the metal layer is formed in the pattern.

Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same. More particularly, the present invention relates to a micro LED structure and a method of manufacturing the same, the micro LED structure including: a micro LED; a circuit board driving the micro LED; and an anisotropic conductive anodic oxide film provided between the micro LED and the circuit board to electrically connect the circuit board and the micro LED. According to the present invention, without applying an external force (thermocompression bonding) to the anisotropic conductive anodic oxide film, it is possible to electrically connect the circuit board and the micro LED. In addition, it is possible to obtain characteristics such as uniform conductivity in a vertical direction and heat dissipation.

Abstract: A fluid permeable member includes a support body provided in a lower portion thereof with a support plate having a fluid permeable through-hole, and a fluid permeable anodic oxide film disposed on the support plate.

Abstract: Disclosed is a microsensor package. Particularly, disclosed is a microsensor package configured such that a substrate with a sensor electrode is formed with a plurality of pores penetrating vertically therethrough, the lower surface of the substrate is formed with a bonding portion, and the pores under the sensor electrode pad are provided therein with respective connecting portions electrically connecting the sensor electrode pad and the bonding portion, whereby it is possible to provide a light, slim, and compact microsensor package, and it is possible to mount the microsensor package to a printed circuit board (PCB) without wire bonding.

Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same. More particularly, the present invention relates to a micro LED structure and a method of manufacturing the same, the micro LED structure including: a micro LED; a circuit board driving the micro LED; and an anisotropic conductive anodic oxide film provided between the micro LED and the circuit board to electrically connect the circuit board and the micro LED. According to the present invention, without applying an external force (thermocompression bonding) to the anisotropic conductive anodic oxide film, it is possible to electrically connect the circuit board and the micro LED. In addition, it is possible to obtain characteristics such as uniform conductivity in a vertical direction and heat dissipation.

Abstract: A method for manufacturing a chip-mounting substrate includes a pre-coating step of forming a precoat on a substrate including a plurality of conductive portions and an insulating portion interposed between the conductive portions, an etching step of etching at least a portion of the precoat through a laser to form a pattern, and a step of forming a metal layer on the substrate. The pattern is disposed on at least one of the conductive portions, and the metal layer is formed in the pattern.

Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same that facilitate realizing of pixels of the micro LED structure.

Abstract: Disclosed are a piezoelectric material-based electronic device having high recognition precision for a three-dimensional shape and improved durability, and a manufacturing method thereof. The electronic device includes an anodic oxide film, a first electrode provided on an upper surface of the anodic oxide film, a second electrode provided on an a lower surface of the anodic oxide film, and a piezoelectric column made of a piezoelectric material and provided between the first electrode and the second electrode.

Abstract: The present invention relates to a micro LED grip body and a system having the same for inspecting a micro LED, the micro LED grip body having a vacuum-suction structure capable of being used for transferring a micro LED, thereby solving problems of micro LED transfer heads that have been proposed in the related art.

Abstract: The present invention relates generally to a substrate for an optical device, an optical device package, a manufacturing method of the substrate for the optical device, and a manufacturing method of the optical device package. More particularly, the present invention relates to a substrate for an optical device, an optical device package, a manufacturing method of the substrate for the optical device, and a manufacturing method of the optical device package, in which the optical device to be mounted self-aligns, thus improving mounting precision of the optical device, and also reflection efficiency is prevented from being reduced.

Abstract: The present invention relates to an air quality measuring apparatus, which has a structure for minimizing interference between a particulate matter sensor, a gas sensor, and a humidity sensor and measures air quality by generating air flow therein by using a pumping part capable of pumping restoration.

Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same. More particularly, the present invention relates to a micro LED structure and a method of manufacturing the same, the micro LED structure including: a micro LED; a circuit board driving the micro LED; and an anisotropic conductive anodic oxide film provided between the micro LED and the circuit board to electrically connect the circuit board and the micro LED. According to the present invention, without applying an external force (thermocompression bonding) to the anisotropic conductive anodic oxide film, it is possible to electrically connect the circuit board and the micro LED. In addition, it is possible to obtain characteristics such as uniform conductivity in a vertical direction and heat dissipation.

Abstract: Disclosed is a substrate for an optical device. The substrate has a cavity for mounting an optical element. The cavity has a sloped wall surface having a surface roughness Ra controlled to fall within a range of 1 nm?Ra?100 nm, thereby increasing the surface reflectance inside the cavity in which the optical element is mounted and thus minimizing the loss of light emitted from the optical element. Further disclosed is an optical device package including the same substrate.

Abstract: A fluid permeable member includes a support body provided in a lower portion thereof with a support plate having a fluid permeable through-hole, and a fluid permeable anodic oxide film disposed on the support plate.

Abstract: The present invention relates to a substrate for supporting an antenna pattern. The substrate includes a porous anodic oxide layer having a plurality of pores formed by anodizing metal. A metallic material is filled in at least a part of the pores.

Abstract: A chip substrate includes: a plurality of conductive layers horizontally stacked and constituting the chip substrate; a plurality of insulation layers alternately with the conductive layers and electrically separating the conductive layers; a lens insert comprising a groove having a predetermined number of edges on the upper surface of the chip substrate and having a cross-section wherein an arc is formed at the region where the extended edges meet; a cavity comprising a groove reaching down to a predetermined depth towards the area accommodating the insulation layer within the internal region of the lens insert; and a plurality of joining grooves formed on the surface of the lens insert. Thus, the lens to be inserted also can be formed to be a shape comprising straight lines so that the manufacturing process of the lens to be inserted into the chip substrate can be further simplified.

Abstract: The present invention relates to a method for manufacturing an optical device, and to an optical device manufactured thereby, which involve using a substrate itself as a heat-dissipating plate, and adopting a substrate with vertical insulation layers formed thereon, such that electrode terminals do not have to be extruded out from a sealed space, and thus enabling the overall structure and manufacturing process for an optical device to be simplified.

Abstract: A light engine for a light emitting element includes an element substrate on which a plurality of light emitting elements is mounted, a plurality of circuit substrates connected to one another in an insulated state in order to apply a drive voltage to the light emitting elements and connected to the element substrate in an insulated state, and a plurality of protection substrates configured to surround the element substrate and the circuit substrates and to make contact with the element substrate and the circuit substrates in an insulated state.

Abstract: A chip substrate includes conductive layers, an insulation layer configured to electrically isolate the conductive layers, and a cavity composed of a groove formed at a predetermined depth in a region including the insulation layer. One side of the cavity includes a first surface and a second surface continuously extending from the first surface, the first surface is formed to vertically extend from a lower portion of the cavity and the second surface is formed so as to have the same slope as the other side of the cavity, whereby the distance between one side of the lower portion of the cavity and the insulation layer is increased.

Abstract: A chip substrate includes conductive portions, an insulation portion and a cavity. The conductive portions are laminated in one direction to constitute the chip substrate. The insulation portion is interposed between the conductive portions to electrically isolate the conductive portions. The cavity is formed on an upper surface of the chip substrate at a predetermined depth in a region including the insulation portion. The cavity is defined by a plurality of continuously-extending curved surfaces having predetermined radii of curvature.