Abstract: An engine controller, an engine control method, and memory medium are provided. A second calculation process calculates an intake air amount without using a detection result of an air flow meter. The determination process determines that intake air pulsation is great if it is confirmed that a difference between an average flow rate and a minimum flow rate is great. The average flow rate is an average value of an intake air flow rate within a period of the intake air pulsation. The minimum flow rate is a minimum value of the intake air flow rate within the period. When it is determined that the intake air pulsation is great, a calculation method switching process selects a calculated value of the intake air amount that is obtained by the second calculation process.

Abstract: Provided is a semiconductor module including a semiconductor device and a cooling apparatus, wherein the semiconductor device includes semiconductor chips, circuit boards where the semiconductor chips are implemented, and a resin structure for sealing the semiconductor chips; the cooling apparatus includes a top plate, a side wall, a bottom plate, a coolant flow portion, a plurality of fins and reinforcement pins; the metal layer has a part overlapped with the cooling region, and other parts other than the part overlapped with one communication region of the first communication region and the second communication region in planar view; and the reinforcement pins are arranged in the one communication region.

Abstract: A power semiconductor module including a cooling apparatus and a power semiconductor device mounted on the cooling apparatus, wherein the cooling apparatus includes: a ceiling plate that; a case; and a cooling fin, a ceiling plate and the case respectively include fastening portions that are used to fasten the ceiling plate and the case to an external apparatus, while the ceiling plate and the outer edge portion are arranged in an overlapping manner, the power semiconductor device includes a circuit substrate and a terminal case, the fastening portions protrude farther outward than a periphery of the ceiling plate, and the terminal case includes a case body arranged along a perimeter of the circuit substrate and reinforcing portions that extend to top surface sides of the fastening portions.

Abstract: An engine controller is provided. A second calculation process calculates an intake air amount without using an output of an air flow meter. A second determination process determines whether an intake air pulsation in an intake passage is great without using the output of the air flow meter. When the intake air pulsation is determined to be great by at least one of a first determination process and the second determination process, a calculation method switching process selects the calculated value of the intake air amount obtained by the second calculation process as a calculated value of the intake air amount used to determine an operation amount of an actuator.

Abstract: A semiconductor module includes at least two semiconductor elements connected in parallel; a control circuit board placed between the at least two semiconductor elements; a control terminal for external connection; a first wiring member that connects the control terminal and the control circuit board; and a second wiring member that connects a control electrode of one of the at least two semiconductor elements and the control circuit board, wherein the second wiring member is wire-bonded from the control electrode towards the control circuit board, and has a first end on the control electrode and a second end on the control circuit board, the first end having a cut end face facing upward normal to a surface of the control electrode and the second end having a cut end face facing sideways parallel to a surface of the control circuit board.

Abstract: A semiconductor device includes a semiconductor chip including a semiconductor substrate with a top surface electrode deposited on a top surface of the semiconductor substrate. An insulating film selectively covers edges of a top surface of the top surface electrode, and a plating layer covers the top surface of the top surface electrode exposed to an opening of the insulating film. A metal wiring plate includes a junction part located over the insulating film and the plating layer, and provided with a groove recessed upward from a bottom surface of the junction part. A solder part fills the groove so as to bond the plating layer and the bottom surface of the junction part together. A boundary between the insulating film and the plating layer is encompassed within the groove.

Abstract: A semiconductor module includes a semiconductor device, and a cooling device. The semiconductor device includes a semiconductor chip and a circuit board for mounting the chip. The cooling device includes a top plate mounted in the semiconductor device and having a side wall connected thereto, a bottom plate connected to the side wall, and a refrigerant circulating portion, defined by the top plate, the side wall, and the bottom plate and has a substantially rectangular shape with a cross section parallel to a main surface of the top plate having long and short sides. The circuit board is a substantially rectangular laminated circuit board including an insulating plate having an upper surface with a circuit layer and a lower surface with a metal layer. In a plan view, at least one corner of the metal layer at least partially overlaps with the slope portion of the side wall.

Abstract: A first intake air amount an engine is calculated based on a detected value of an intake air flow rate of an air flowmeter. A second intake air amount is calculated based on any one of a detected value of an intake pipe pressure and a throttle opening degree instead of the detected value of the intake air flow rate. When it is determined that the intake pulsation is not large, a difference amount of the second intake air amount from the first intake air amount is calculated. A corrected second intake air amount, which is a sum of the second intake air amount and the difference amount, is set as an intake air amount calculated value when it is determined that the intake pulsation is large.

Abstract: An engine controller, an engine control method, and memory medium are provided. A second calculation process calculates an intake air amount without using a detection result of an air flow meter. The determination process determines that intake air pulsation is great if it is confirmed that a difference between an average flow rate and a minimum flow rate is great. The average flow rate is an average value of an intake air flow rate within a period of the intake air pulsation. The minimum flow rate is a minimum value of the intake air flow rate within the period. When it is determined that the intake air pulsation is great, a calculation method switching process selects a calculated value of the intake air amount that is obtained by the second calculation process.

Abstract: An engine controller is provided. A second calculation process calculates an intake air amount without using an output of an air flow meter. A second determination process determines whether an intake air pulsation in an intake passage is great without using the output of the air flow meter. When the intake air pulsation is determined to be great by at least one of a first determination process and the second determination process, a calculation method switching process selects the calculated value of the intake air amount obtained by the second calculation process as a calculated value of the intake air amount used to determine an operation amount of an actuator.

Abstract: To improve the stability of spray application of a monolithic refractory in which a water injector is disposed in a material carrier pipe extending from a material supply device to a distal spray nozzle, and application water is injected from the water injector into a spray material that is being carried through the material carrier pipe, a ratio of a flow volume of an application water carrier gas for carrying the application water to be introduced into the water injector to a flow volume of a spray material carrier gas for carrying the spray material is set to 0.07 to 2, and a compressibility index of the spray material is set to 32% or less. Alternatively, a ratio of a flow volume of an application water carrier gas for carrying the application water to be introduced into the water injector to an application water volume is set to 100 to 1,000.

Abstract: A semiconductor module is provided, including: a semiconductor chip having an upper surface electrode and a lower surface electrode opposite to the upper surface electrode; a metal wiring plate electrically connected to the upper surface electrode of the semiconductor chip; and a sheet-like low elastic sheet provided on the metal wiring plate, the low elastic sheet having elastic modulus lower than that of the metal wiring plate. A manufacturing method for a semiconductor module is provided, including: providing a semiconductor chip; solder-bonding a metal wiring plate above said semiconductor chip; and applying a sheet-like low elastic sheet having the elastic modulus lower than that of said metal wiring plate to said metal wiring plate.

Abstract: A semiconductor device includes a semiconductor chip including a semiconductor substrate with a top surface electrode deposited on a top surface of the semiconductor substrate. An insulating film selectively covers edges of a top surface of the top surface electrode, and a plating layer covers the top surface of the top surface electrode exposed to an opening of the insulating film. A metal wiring plate includes a junction part located over the insulating film and the plating layer, and provided with a groove recessed upward from a bottom surface of the junction part. A solder part fills the groove so as to bond the plating layer and the bottom surface of the junction part together. A boundary between the insulating film and the plating layer is encompassed within the groove.

Abstract: An image processing apparatus is configured to execute first image data process, second image data process, a first storing process to store process combination information including a first default parameter and a second default parameter, and a combination process. The combination process includes a first obtaining process of obtaining an alternative parameter including at least one of a first alternative parameter and a second alternative parameter, a first combination execution process of executing the first image data process in accordance with the first alternative parameter when the first alternative parameter is obtained, and a second combination execution process of executing the second image data process in accordance with the second alternative parameter when the second alternative parameter is obtained.

Abstract: A power semiconductor module including a cooling apparatus and a power semiconductor device mounted on the cooling apparatus, wherein the cooling apparatus includes: a ceiling plate that; a case; and a cooling fin, a ceiling plate and the case respectively include fastening portions that are used to fasten the ceiling plate and the case to an external apparatus, while the ceiling plate and the outer edge portion are arranged in an overlapping manner, the power semiconductor device includes a circuit substrate and a terminal case, the fastening portions protrude farther outward than a periphery of the ceiling plate, and the terminal case includes a case body arranged along a perimeter of the circuit substrate and reinforcing portions that extend to top surface sides of the fastening portions.

Abstract: A first intake air amount an engine is calculated based on a detected value of an intake air flow rate of an air flowmeter. A second intake air amount is calculated based on any one of a detected value of an intake pipe pressure and a throttle opening degree instead of the detected value of the intake air flow rate. When it is determined that the intake pulsation is not large, a difference amount of the second intake air amount from the first intake air amount is calculated. A corrected second intake air amount, which is a sum of the second intake air amount and the difference amount, is set as an intake air amount calculated value when it is determined that the intake pulsation is large.

Abstract: An image processing apparatus is configured to execute first image data process, second image data process, a first storing process to store process combination information including a first default parameter and a second default parameter, and a combination process. The combination process includes a first obtaining process of obtaining an alternative parameter including at least one of a first alternative parameter and a second alternative parameter, a first combination execution process of executing the first image data process in accordance with the first alternative parameter when the first alternative parameter is obtained, and a second combination execution process of executing the second image data process in accordance with the second alternative parameter when the second alternative parameter is obtained.

Abstract: A cooling apparatus for a semiconductor module including a semiconductor chip is provided, including; a ceiling plate having a lower surface; a casing portion having a coolant circulation portion and an outer edge portion surrounding the coolant circulation portion, the coolant circulation portion being arranged to face the lower surface of the ceiling plate, and the casing portion being closely attached, directly or indirectly, to a lower surface of the ceiling plate at the outer edge portion; and a cooling fin arranged in the coolant circulation portion, where the ceiling plate and the casing portion have a fastening portion in which the ceiling plate and the outer edge portion are stacked, and the fastening portion fastens the ceiling plate and the casing portion to an external device, and the cooling apparatus further includes a reinforcing member provided between the ceiling plate and the casing portion at the fastening portion.

Abstract: A semiconductor module includes a semiconductor chip; an insulating circuit board that has on one of principal surfaces of an insulating substrate a circuit member electrically connected to the semiconductor chip, and a first metal member disposed in the other principal surface of the insulating substrate; a second metal member that is disposed on a side of an outer edge of the first metal member and is at least partially disposed further toward an outer side than the insulating substrate; a molding resin portion that seals the semiconductor chip, the insulating circuit board, and the second metal member such that a portion of the first metal member and a portion of the second metal member are exposed; a cooler; a first bonding member that bonds the cooler and the first metal member; and a second bonding member that bonds the cooler and the second metal member.

Abstract: An image processing apparatus is configured to execute first image data process, second image data process, a first storing process to store process combination information including a first default parameter and a second default parameter, and a combination process. The combination process includes a first obtaining process of obtaining an alternative parameter including at least one of a first alternative parameter and a second alternative parameter, a first combination execution process of executing the first image data process in accordance with the first alternative parameter when the first alternative parameter is obtained, and a second combination execution process of executing the second image data process in accordance with the second alternative parameter when the second alternative parameter is obtained.