Abstract: A semiconductor module uses pin bonding and improves cooling capacity. The semiconductor module includes a semiconductor element; a pin electrically and thermally connected to an upper surface of the semiconductor element; a pin wiring substrate having a first metal film and a second metal film respectively provided on the rear and front surfaces of a pin wiring insulating substrate, the first metal film being bonded to the pin; a first DCB substrate having a third metal film and a fourth metal film respectively provided on the rear and front surfaces of a first ceramic insulating substrate, the third metal film being bonded to a lower surface of the semiconductor element; a first cooler thermally connected to the fourth metal film; and a second cooler that thermally connected to the second metal film.

Abstract: A semiconductor module includes first and second semiconductor elements connected to pins, respectively; a first pin wiring substrate having first and second metal films bonded to the pin on the upper and lower surfaces; a first DCB substrate having third and fourth metal films on the upper and lower surfaces, the third metal film being bonded to the lower surface of the first semiconductor element; a second DCB substrate having fifth and sixth metal films respectively provided on the lower and upper surfaces, the fifth metal film being bonded to the upper surface of the second semiconductor element; a second pin wiring substrate having seventh and eighth metal films bonded to the pin, on the upper and lower surfaces; a connection member connected to the second and fifth metal films; a first cooler connected to the fourth metal film; and a second cooler connected to the sixth metal film.

Abstract: The semiconductor module includes a pin that is connected to a semiconductor element; a pin wiring substrate that has a second metal film and a first metal film on the upper and lower surfaces, the first metal film and the second metal film being electrically bonded to the pin; solder that bonds the pin and the semiconductor element; a DCB substrate that has a third metal film and a fourth metal film on the upper and lower surfaces, the third metal film being bonded to a lower surface of the semiconductor element; and a first cooler that is connected to the fourth metal film. The ratio H/T of a height H of the solder to a distance T from the semiconductor element to the first metal film is equal to or greater than 0.2 and equal to or less than 0.7.

Abstract: A power semiconductor module includes an insulated wiring board; semiconductor elements mounted on one main surface of the insulated wiring board; a heat radiation board bonded to another main surface of the insulated wiring board; a plurality of fins including a first group of fins each having one end fixed to the another main surface of the heat radiation board and another end with a free end; and a water jacket housing the plurality of fins and allowing coolant to flow among the plurality of fins. The plurality of fins further includes a second group of fins as reinforced fins each having one end fixed to the another main surface of the heat radiation board and another end bonded to the water jacket.

Abstract: A semiconductor device has a single unit capable of improving adhesion to a cooling body and a heat dissipation performance, and an aggregate of the single units is capable of configuring any circuit at a low cost. A single unit includes copper blocks, an insulating substrate with a conductive pattern, an IGBT chip, a diode chip, a collector terminal pin, implant pins fixed to the chips by solder, a printed circuit board having the implant pins fixed thereto, an emitter terminal pin, a control terminal pin, a collector terminal pin, and a resin case having the above-mentioned components sealed therein. The copper blocks make it possible to improve adhesion to a cooling body and the heat dissipation performance. A plurality of single units can be combined with an inter-unit wiring board to form any circuit.

Abstract: An apparatus receives a first selection command to select a part of an area of a displayed first document (e.g., text, image, etc) as a selected area. When the apparatus receives the first selection command, the apparatus causes display content included in the selected area selected in response to the first selection command to be stored in a storage unit and determines whether link information linked to second document is included in the selected area. The apparatus acquires document data of the second document using the link information in response to determining that the link information is included in the selected area.

Abstract: A semiconductor device includes an insulating substrate; a semiconductor element mounted on the insulating substrate; and a cooler cooling the semiconductor element. The cooler includes a heat radiating substrate bonded to the insulating substrate; a plurality of fins provided on a surface opposite to a surface bonded with the insulating substrate of the heat radiating substrate; and a case accommodating the fins, and including an inlet and an outlet for a coolant. Upper end portions of side walls of the case include cutaways to arrange end portions of the heat radiating substrate. The heat radiating substrate is liquid-tightly bonded to the case.

Abstract: A semiconductor device has a single unit capable of improving adhesion to a cooling body and a heat dissipation performance, and an aggregate of the single units is capable of configuring any circuit at a low cost. A single unit (101) includes copper blocks (1, 8), an insulating substrate (6) with a conductive pattern, an IGBT chip (10), a diode chip (13), a collector terminal pin (15), implant pins (17) fixed to the chips (10) by solder (11), a printed circuit board (16) having the implant pins (17) fixed thereto, an emitter terminal pin (19), a control terminal pin (20), a collector terminal pin (15), and a resin case (21) having the above-mentioned components sealed therein. The copper blocks (1, 8) make it possible to improve adhesion to a cooling body and the heat dissipation performance. A plurality of single units (101) can be combined with an inter-unit wiring board to form any circuit.

Abstract: Embodiments of the invention provide a power semiconductor module wherein it is possible to reduce switching noise generated in a switching element, and at the same time, to reduce thermal resistance between a power semiconductor chip and an insulating substrate. In some embodiments, by a capacitor being installed between a printed substrate and an insulating substrate so as to be adjacent to a power semiconductor chip which is a switching element, it is possible to reduce switching noise generated in the switching element, and furthermore, it is possible to reduce thermal resistance between the power semiconductor chip and insulating substrate.

Abstract: Various embodiments for forming an image of selected objects from a web page are provided. An example of an image processing apparatus comprises a web page display unit which, based on web page data supplied from a web page data source, is configured to display web pages on a web page display range present on the screen of a display apparatus, an object information storage control unit configured to control the storing of object information including information necessary to print selected objects from the web pages based upon a user selection in a storage unit, an object information update control unit configured to control updating of object information describing the stored object with object information describing the latest object corresponding to the stored object, and an image forming control unit configured to control the formation of images of objects on an output medium based on the stored object information.

Abstract: There is provided a computer readable medium having computer readable instructions stored thereon, which, when executed by a computer, are configured to extract driver configuration files forming a device driver from the computer in which the device driver for controlling a device has been installed, to acquire an initial setting file describing control parameters that have incorporated inputs made in regard to the control parameters to be used by the device driver for controlling the device, and to create an installer which installs a device driver, including the driver configuration files and the initial setting file and controlling the device according to the control parameters described in the initial setting file, in a computer.

Abstract: A data processor includes a communication unit, a customized data acquiring unit, a storing unit, a status data acquiring unit, and a display unit. The communication unit performs data communication with an electrical equipment. The customized data acquiring unit acquires customized data. The storing unit stores fixed data and the customized data acquired by the customized data acquiring unit. The customized data is correlated with the fixed data. The status data acquiring unit acquires status data from the electrical equipment via the communication unit. The display unit displays the fixed data and the customized data. The fixed data and the customized data are in association with the status data acquired by the status data acquiring unit.

Abstract: A restricting pin is provided so as to be slidable in a moving direction of a front end of a reverse restricting member provided at a select lever for selecting forward and reverse fork shafts switching a shift gear(s), and is biased toward the reverse restricting member. A lockout lever that can be inserted into/detached from between the restricting pin and the front end of the reverse restricting member is biased toward an insertion side by a spring, and at a vehicle speed less than a predetermined vehicle speed. A front end of an advancing operating rod of the actuator contacts and is detached against the force of the spring. At a vehicle speed not less than a predetermined vehicle speed, the front end of the reverse restricting member contacts the inserted lockout lever, thereby preventing the select lever from moving to a reverse select position.

Abstract: Embodiments of the invention provide a power semiconductor module wherein it is possible to reduce switching noise generated in a switching element, and at the same time, to reduce thermal resistance between a power semiconductor chip and an insulating substrate. In some embodiments, by a capacitor being installed between a printed substrate and an insulating substrate so as to be adjacent to a power semiconductor chip which is a switching element, it is possible to reduce switching noise generated in the switching element, and furthermore, it is possible to reduce thermal resistance between the power semiconductor chip and insulating substrate.

Abstract: A print control device for controlling a printing device is provided with a print control unit which controls the printing device to print an image corresponding to print target data on a sheet when the print target data is specified; and a time information acquiring unit which acquires information on a time to be printed on the sheet as an expiration date/time of the printed document. The print control unit is configured to be capable of making the printing device print an image representing the expiration date/time of the printed document on the sheet printed with the image corresponding to the specified print target data based on the information acquired by the time information acquiring unit when the print control unit makes the printing device execute the printing of the image corresponding to the specified print target data.

Abstract: An internal combustion engine exhaust gas system includes a filter arranged in an exhaust passage of the internal combustion engine, a fuel adding valve which is arranged upstream of the filter and supplies fuel into the exhaust passage, and a low-pressure exhaust gas recirculation apparatus that removes some of the exhaust gas from downstream of the filter as EGR gas. An EGR rate is controlled taking into account the amount of fuel supplied by the fuel adding valve such that an oxygen concentration of intake gas, which is drawn into a cylinder of the internal combustion engine in a state in which the EGR gas that is introduced by the low-pressure exhaust gas recirculation apparatus is mixed with air introduced into an intake passage, is constant before and after fuel is supplied by the fuel adding valve.

Abstract: A semiconductor device has a single unit capable of improving adhesion to a cooling body and a heat dissipation performance, and an aggregate of the single units is capable of configuring any circuit at a low cost. A single unit (101) includes copper blocks (1, 8), an insulating substrate (6) with a conductive pattern, an IGBT chip (10), a diode chip (13), a collector terminal pin (15), implant pins (17) fixed to the chips (10) by solder (11), a printed circuit board (16) having the implant pins (17) fixed thereto, an emitter terminal pin (19), a control terminal pin (20), a collector terminal pin (15), and a resin case (21) having the above-mentioned components sealed therein. The copper blocks (1, 8) make it possible to improve adhesion to a cooling body and the heat dissipation performance. A plurality of single units (101) can be combined with an inter-unit wiring board to form any circuit.

Abstract: An object of the present invention is to control the discharge amount of unburned fuel components in the internal combustion engine. According the present invention, the number of times of execution of sub fuel injection is changed based on the operation range within which the operation state of the internal combustion engine falls so that the lower the engine load of the internal combustion engine is, and the lower the number of engine revolutions of the internal combustion engine is, the more the number of times of execution of sub fuel injection is increased. Furthermore, the lower the atmospheric pressure is, the lower the temperature of the cooling water of the internal combustion engine is, or the lower the temperature of the intake air of the internal combustion engine is, the more an operation range in which the number of times of execution of sub fuel injection is large is expanded to higher loads and higher revolutions.

Abstract: An apparatus receives a first selection command to select a part of an area of a displayed first document (e.g., text, image, etc) as a selected area. When the apparatus receives the first selection command, the apparatus causes display content included in the selected area selected in response to the first selection command to be stored in a storage unit and determines whether link information linked to second document is included in the selected area. The apparatus acquires document data of the second document using the link information in response to determining that the link information is included in the selected area.

Abstract: A communication system includes: at least one user terminal; a printer; a storage device; a registering unit; and a list transmitting unit. The printer includes a print controlling unit that prints an image on a recording sheet based on target print data received from a user terminal, and that prints on the same recording sheet a mark set by the user terminal according to a mark configuration parameter. The registering unit records in the storage device a combination of a mark configuration parameter and identification data that is received from one of the at least one user terminal, the mark configuration parameter indicating configuration of a mark that has been set at the subject user terminal, the identification data identifying one user that has set the mark. The list transmitting unit transmits to each user terminal data of a mark list that lists up at least one combination of the mark configuration parameter and the identification data that has been stored in the storage device.