Abstract: A disclosed cable connection structure includes a circuit board that includes a first main body portion and a second main portion that includes a shield set portion, a shield connection electrode, and a plurality of core wire connection electrodes; and a plurality of coaxial cables each of which is processed such that a core wire, an internal insulator, and a shield are exposed from a tip portion in a stepwise manner, where the core wires are connected to the respective core wire connection electrodes and the shields are collectively connected to the shield connection electrode. The second main body portion and the coaxial cables are positioned within a projection plane of a front surface that is perpendicular to a principal surface of the first main body portion.

Abstract: An imaging apparatus mount assembly for an image sensor chip includes a substrate, a plurality of first pins and at least one first electronic component, both mounted on a first surface of the substrate, and a first resin sealant configured to seal the first surface so as to expose an end face of a first shaft section opposite to where a first connecting section is provided. A plurality of second pins and at least one second electronic component are both mounted on a second surf ace of the substrate. A second resin sealant is configured to seal the second surface so as to expose an end face of a second shaft section opposite to where a second connecting section is provided. The image sensor chip includes a light receiving unit and a back-surface electrode, the first shaft section exposed on the first resin sealant is connected to the back-surface electrode.

Abstract: A mounting cable includes: a metal cable that includes a core wire formed of a conductive material and a jacket formed of an insulator and covering the core wire; a cable fixing portion that fixes an end portion of the metal cable, and has an end face which is perpendicular to an axial direction of the metal cable and on which a cross section of an end portion of the core wire is exposed; an external connection electrode formed on at least one surface of the cable fixing portion, the at least one surface being in parallel with the axial direction of the metal cable; and a wire pattern that extends from an area on the core wire exposed on the end face to the external connection electrode.

Abstract: A mounting cable includes: a metal cable that includes a core wire formed of a conductive material and a jacket formed of an insulator and covering the core wire; a cable fixing portion that fixes an end portion of the metal cable, and has an end face which is perpendicular to an axial direction of the metal cable and on which a cross section of an end portion of the core wire is exposed; an external connection electrode formed on at least one surface of the cable fixing portion, the at least one surface being in parallel with the axial direction of the metal cable; and a wire pattern that extends from an area on the core wire exposed on the end face to the external connection electrode.

Abstract: A cable connection substrate includes: a first substrate that is provided with, on a front surface of the first substrate, a first connection electrode to be connected to a sensor electrode of an imaging element, and provided with a second connection electrode on a back surface side of the first substrate; and a second substrate that is provided with, on a front surface of the second substrate, a third connection electrode to be connected to the second connection electrode, and provided with, on a top surface side of the second substrate, the top surface being a side surface perpendicular to the front surface of the second substrate, a plurality of cable connection electrodes to be connected to a plurality of cables. A sum of effective conductor areas of the plurality of cable connection electrodes is greater than a sum of effective conductor areas of the third connection electrode.

Abstract: A disclosed cable connection structure includes a circuit board that includes a first main body portion and a second main portion that includes a shield set portion, a shield connection electrode, and a plurality of core wire connection electrodes; and a plurality of coaxial cables each of which is processed such that a core wire, an internal insulator, and a shield are exposed from a tip portion in a stepwise manner, where the core wires are connected to the respective core wire connection electrodes and the shields are collectively connected to the shield connection electrode. The second main body portion and the coaxial cables are positioned within a projection plane of a front surface that is perpendicular to a principal surface of the first main body portion.

Abstract: An imaging device includes at least one lens collecting light incident from an object; an imaging sensor receiving light from the at least one lens and converting the received light to an electric signal; a multi-layer substrate electrically connected to the imaging sensor, the multi-layer substrate including electronic components and conductive layers and vias; and a collective cable including at least one coaxial cable. A core connection electrode to which a core of the coaxial cable is connected is formed on a first surface of the multi-layer substrate, the first substrate intersecting with a height direction of the multi-layer substrate, and a shielded-wire connection electrode to which a shielded wire of the coaxial cable is connected is formed on a second surface of the multi-layer substrate that is adjacent to the first surface and that faces to a proximal end from which the collective cable extends.

Abstract: A cable includes: a core wire that is electrically conductive; a first inner insulation layer that covers an outer periphery of the core wire and has an exposing portion that exposes the core wire at a distal end side of the first inner insulation layer; and a first latching portion that is fixed to the core wire in the exposing portion, and is latched onto the first inner insulation layer and holds the core wire by coming into contact with the first inner insulation layer.

Abstract: An imaging module includes: an imaging unit including a light receiving unit having a plurality of pixels arranged in a specified shape including a lattice shape and configured to receive light and to perform photoelectric conversion on the received light, the imaging unit being configured to capture an image of a subject and to output the image as a light quantity signal; a signal processing unit configured to perform signal processing on the light quantity signal; and a flexible substrate which includes a bendable insulating film and on which the imaging unit and the signal processing unit are mounted. The flexible substrate is bent to arrange the signal processing unit and the flexible substrate in a space extending from an outer edge of an incident surface of the imaging unit in a direction perpendicular to the incident surface while maintaining a shape of the outer edge.

Abstract: A cable connection structure includes a cable assembly that fixes a plurality of cables, and a mounting member connected to the cable assembly. The plurality of cables includes: core wires having core wire exposed portions where the core wires are exposed at distal ends of the plurality of cables; and jackets, each of which is formed of an insulator and covers each of the core wires. The mounting member includes a plurality of external connection electrodes to which the core wires are to be connected. The cable assembly includes a first cable fixing portion that is formed of an insoluble resin insoluble in organic solvents or alkali and that fixes the core wire exposed portions. The core wires are exposed on an end face of the first cable fixing portion and are connected to the plurality of external connection electrodes using a conductive material.

Abstract: A cable connection structure includes: a plurality of cables including at least one coaxial cable including a central conductor, an inner insulator, and an outer conductor exposed stepwise at a distal end portion; an aligning member that is in contact with side surfaces of exposed conductive portions of the cables positioned at least at both ends, of the plurality of cables, to align the cables such that axial directions become parallel and outer sheaths of the adjacent cables are in contact with each other; and a board on which an electrode portion that connects the conductive portions of the plurality of cables are arranged. The conductive portions of the plurality of cables are electrically and mechanically connected to the electrode portion of the board via a conductive connecting member and the aligning member.

Abstract: A mounting cable includes: a coaxial cable including: a core wire made of a conductive material; an internal insulator covering an outer periphery of the core wire; a shield covering an outer periphery of the internal insulator; and a jacket covering an outer periphery of the shield with an insulator, the coaxial cable having one end portion on which the core wire, the internal insulator and the shield are exposed; a cable fixing unit that fixes one end portion of the exposed core wire and has a connection surface on which an end face of the core wire is exposed; and a conductor having one end electrically and mechanically connected to the exposed shield and having the other end fixed to the cable fixing unit. An end portion of the conductor is exposed on the connection surface of the cable fixing unit.

Abstract: An imaging device includes: an image sensor including a light receiving unit, and sensor electrodes; a relay board including at least one rectangular substrate, one or more electronic components, a body part, substrate electrodes, cable electrodes, and pins standing on the substrate and configured to electrically connect the substrate electrodes and the cable electrodes, wherein the substrate electrodes are electrically and mechanically connected with the sensor electrodes; and a cable assembly including cables, and a cable fixing member, wherein cores of the cables exposed on an connection face of the cable fixing member are electrically and mechanically connected with the cable electrodes. A coefficient of thermal expansion of the image sensor, a coefficient of thermal expansion of the relay board, and a coefficient of thermal expansion of the cable assembly vary gradually in descending order or ascending order.

Abstract: A multi-chip semiconductor device includes a plate-shaped first semiconductor chip having a first connection portion in which a first semiconductor chip electrode is formed on a first main surface of the first semiconductor chip or on a first side surface vertical to the first main surface, and a plate-shaped second semiconductor chip having a second connection portion in which a second semiconductor chip electrode is formed on a second side surface vertical to a second main surface of the second semiconductor chip. Each of the first and second connection portions includes at least an inclined surface that is inclined with respect to each of the first and second main surfaces. The first connection portion and the second connection portion are connected to each other such that the first main surface of the first semiconductor chip and the second main surface of the second semiconductor chip are vertical to each other.

Abstract: A mounting cable includes: a coaxial cable including: a core wire made of a conductive material; an internal insulator covering an outer periphery of the core wire; a shield covering an outer periphery of the internal insulator; and a jacket covering an outer periphery of the shield with an insulator, the coaxial cable having one end portion on which the core wire, the internal insulator and the shield are exposed; a cable fixing unit that fixes one end portion of the exposed core wire and has a connection surface on which an end face of the core wire is exposed; and a conductor having one end electrically and mechanically connected to the exposed shield and having the other end fixed to the cable fixing unit. An end portion of the conductor is exposed on the connection surface of the cable fixing unit.

Abstract: A semiconductor-device mounting structure includes a first semiconductor device and a plate-shaped second semiconductor device connected to the first semiconductor device. The first semiconductor device includes a flexible board, an electronic component, and a sealing resin. The flexible board includes a bendable flexible portion and a hard portion. The flexible portion is bent at a boundary with the hard portion, along a shape of the electronic component such that the flexible board covers the electronic component. The flexible board and the electronic component are sealed with the sealing resin. The first semiconductor device is provided vertical to the second semiconductor device such that the hard portion is provided parallel to the second semiconductor device, and a length of the hard portion in a direction perpendicular to a bend line of the flexible portion is equal to a thickness of a bottom surface of the electronic component in the direction.

Abstract: A method for manufacturing a mount assembly in which pins and electronic components are connected to a same surface of a substrate. Each pin including a connecting section and a shaft section having a diameter smaller than that of the connecting section. A height of each electronic component being not larger than that of each pin when being mounted. The method includes: setting the pins and the electronic components so as to be aligned; and disposing the pins and the electronic components which are aligned, on a stage of a mounting apparatus, lowering a head unit of the mounting apparatus on which the substrate is adsorbed, and connecting the pins and the electronic components collectively to the surface of the substrate by applying heat and pressure while solder applied to a land on the substrate and the connecting section of each pin are in contact with each other.

Abstract: An aligned structure of cables includes: a plurality of cables each including a conductive cable core, an insulator covering an outer periphery of the cable core, and a cable core exposed portion, in which the cable core is exposed, on a side of a distal end of the cable; a first cable core aligning insulator including a plurality of grooves into which the cable core exposed portions of the cables are respectively fitted and which align the cable cores; and a cable core fixing insulator which fixes the cable core exposed portions aligned by the first cable core aligning insulator, wherein cross sections of the cable cores are exposed on a surface on a side of distal ends of the cable cores of the cable core fixing insulator, and a pitch of the cross sections is shorter than a pitch of the cables.

Abstract: A semiconductor-device mounting structure includes a first semiconductor device and a plate-shaped second semiconductor device connected to the first semiconductor device. The first semiconductor device includes a flexible board, an electronic component, and a sealing resin. The flexible board includes a bendable flexible portion and a hard portion. The flexible portion is bent at a boundary with the hard portion, along a shape of the electronic component such that the flexible board covers the electronic component. The flexible board and the electronic component are sealed with the sealing resin. The first semiconductor device is provided vertical to the second semiconductor device such that the hard portion is provided parallel to the second semiconductor device.

Abstract: An electronic component mounting structure includes a three-dimensional substrate having a three-dimensional shape and including a hollow portion formed on at least one of side surfaces of the three-dimensional substrate, and an electronic component mounted on a bottom face of the hollow portion. The three-dimensional substrate includes an opening portion on a side surface different from a side surface on which the hollow portion is formed for allowing observation of a connection portion between the bottom face of the hollow portion and the electronic component from an outer periphery side of the three-dimensional substrate.