Abstract: A semiconductor-device mounting structure includes a first semiconductor device and a plate-shaped second semiconductor device connected to the first semiconductor device. The first semiconductor device includes a flexible board, an electronic component, and a sealing resin. The flexible board includes a bendable flexible portion and a hard portion. The flexible portion is bent at a boundary with the hard portion, along a shape of the electronic component such that the flexible board covers the electronic component. The flexible board and the electronic component are sealed with the sealing resin. The first semiconductor device is provided vertical to the second semiconductor device such that the hard portion is provided parallel to the second semiconductor device, and a length of the hard portion in a direction perpendicular to a bend line of the flexible portion is equal to a thickness of a bottom surface of the electronic component in the direction.

Abstract: A multi-chip semiconductor device includes a plate-shaped first semiconductor chip having a first connection portion in which a first semiconductor chip electrode is formed on a first main surface of the first semiconductor chip or on a first side surface vertical to the first main surface, and a plate-shaped second semiconductor chip having a second connection portion in which a second semiconductor chip electrode is formed on a second side surface vertical to a second main surface of the second semiconductor chip. Each of the first and second connection portions includes at least an inclined surface that is inclined with respect to each of the first and second main surfaces. The first connection portion and the second connection portion are connected to each other such that the first main surface of the first semiconductor chip and the second main surface of the second semiconductor chip are vertical to each other.

Abstract: A mount assembly includes a member in which a mount component is mounted at least on one main face of the member and at which a member connecting electrode is formed; and a connection member that has a pillar-shaped parallel portion arranged so that a longitudinal direction of the parallel portion is parallel to the main face of the member, one end side of the parallel portion being connected to the member connecting electrode.

Abstract: A multi-chip semiconductor device includes a plate-shaped first semiconductor chip having a first connection portion in which a first semiconductor chip electrode is formed on a first main surface of the first semiconductor chip or on a first side surface vertical to the first main surface, and a plate-shaped second semiconductor chip having a second connection portion in which a second semiconductor chip electrode is formed on a second side surface vertical to a second main surface of the second semiconductor chip. Each of the first and second connection portions includes at least an inclined surface that is inclined with respect to each of the first and second main surfaces. The first connection portion and the second connection portion are connected to each other such that the first main surface of the first semiconductor chip and the second main surface of the second semiconductor chip are vertical to each other.

Abstract: A cable connection structure includes a cable assembly that fixes a plurality of cables, and a mounting member connected to the cable assembly. The plurality of cables includes: core wires having core wire exposed portions where the core wires are exposed at distal ends of the plurality of cables; and jackets, each of which is formed of an insulator and covers each of the core wires. The mounting member includes a plurality of external connection electrodes to which the core wires are to be connected. The cable assembly includes a first cable fixing portion that is formed of an insoluble resin insoluble in organic solvents or alkali and that fixes the core wire exposed portions. The core wires are exposed on an end face of the first cable fixing portion and are connected to the plurality of external connection electrodes using a conductive material.

Abstract: A mounting cable includes: a metal cable that includes a core wire formed of a conductive material and a jacket formed of an insulator and covering the core wire; a cable fixing portion that fixes an end portion of the metal cable, and has an end face which is perpendicular to an axial direction of the metal cable and on which a cross section of an end portion of the core wire is exposed; an external connection electrode formed on at least one surface of the cable fixing portion, the at least one surface being in parallel with the axial direction of the metal cable; and a wire pattern that extends from an area on the core wire exposed on the end face to the external connection electrode.

Abstract: An image pickup unit includes an image pickup device, an objective lens, and a prism that has a reflective surface. The image pickup unit includes: a projecting portion that is an area at which the image pickup device projects to the rear from the prism; a terminal portion provided on the projecting portion; a flexible printed wiring board that extends along the prism and the projecting portion; an image pickup device connection terminal portion formed on a face that faces the projecting portion of the flexible printed wiring board; and a cable connection terminal portion formed at an area that extends over the projecting portion of the flexible printed wiring board. The terminal portion and the image pickup device connection terminal portion are joined in an opposed state. An electronic component is mounted on a face on an opposite side to the reflective surface of the flexible printed wiring board.

Abstract: An imaging module includes: an imaging unit including a light receiving unit having a plurality of pixels arranged in a specified shape including a lattice shape and configured to receive light and to perform photoelectric conversion on the received light, the imaging unit being configured to capture an image of a subject and to output the image as a light quantity signal; a signal processing unit configured to perform signal processing on the light quantity signal; and a flexible substrate which includes a bendable insulating film and on which the imaging unit and the signal processing unit are mounted. The flexible substrate is bent to arrange the signal processing unit and the flexible substrate in a space extending from an outer edge of an incident surface of the imaging unit in a direction perpendicular to the incident surface while maintaining a shape of the outer edge.

Abstract: An electronic component mounting structure includes a three-dimensional substrate having a three-dimensional shape and including a hollow portion formed on at least one of side surfaces of the three-dimensional substrate, and an electronic component mounted on a bottom face of the hollow portion. The three-dimensional substrate includes an opening portion on a side surface different from a side surface on which the hollow portion is formed for allowing observation of a connection portion between the bottom face of the hollow portion and the electronic component from an outer periphery side of the three-dimensional substrate.

Abstract: A cable assembly includes: a plurality of cables; a cable fixing member that fixes the cables together; and conductor layers, wherein the cable assembly is formed with a connecting end surface that includes thereon connecting ends of the cables, and the conductor layers are provided to cover surfaces of the connecting ends that are on the connecting end surface.

Abstract: A cable includes: a core wire that is electrically conductive; a first inner insulation layer that covers an outer periphery of the core wire and has an exposing portion that exposes the core wire at a distal end side of the first inner insulation layer; and a first latching portion that is fixed to the core wire in the exposing portion, and is latched onto the first inner insulation layer and holds the core wire by coming into contact with the first inner insulation layer.

Abstract: A cable connection structure includes: a cable including a core wire and an external covering layer covering the core wire; a board on which an electrode is formed, the core wire being electrically connected to the electrode at an end face of the cable; and a compressing member attached to an outer periphery of the cable and radially compressing a part in a longitudinal direction of the cable.

Abstract: An aligned structure of cables includes: a plurality of cables each including a conductive cable core, an insulator covering an outer periphery of the cable core, and a cable core exposed portion, in which the cable core is exposed, on a side of a distal end of the cable; a first cable core aligning insulator including a plurality of grooves into which the cable core exposed portions of the cables are respectively fitted and which align the cable cores; and a cable core fixing insulator which fixes the cable core exposed portions aligned by the first cable core aligning insulator, wherein cross sections of the cable cores are exposed on a surface on a side of distal ends of the cable cores of the cable core fixing insulator, and a pitch of the cross sections is shorter than a pitch of the cables.

Abstract: A multi-chip semiconductor device includes a plate-shaped first semiconductor chip having a first connection portion in which a first semiconductor chip electrode is formed on a first main surface of the first semiconductor chip or on a first side surface vertical to the first main surface, and a plate-shaped second semiconductor chip having a second connection portion in which a second semiconductor chip electrode is formed on a second side surface vertical to a second main surface of the second semiconductor chip. Each of the first and second connection portions includes at least an inclined surface that is inclined with respect to each of the first and second main surfaces. The first connection portion and the second connection portion are connected to each other such that the first main surface of the first semiconductor chip and the second main surface of the second semiconductor chip are vertical to each other.

Abstract: A semiconductor-device mounting structure includes a first semiconductor device and a plate-shaped second semiconductor device connected to the first semiconductor device. The first semiconductor device includes a flexible board, an electronic component, and a sealing resin. The flexible board includes a bendable flexible portion and a hard portion. The flexible portion is bent at a boundary with the hard portion, along a shape of the electronic component such that the flexible board covers the electronic component. The flexible board and the electronic component are sealed with the sealing resin. The first semiconductor device is provided vertical to the second semiconductor device such that the hard portion is provided parallel to the second semiconductor device.

Abstract: An image pickup unit includes an image pickup device, an objective lens, and a prism that has a reflective surface. The image pickup unit includes: a projecting portion that is an area at which the image pickup device projects to the rear from the prism; a terminal portion provided on the projecting portion; a flexible printed wiring board that extends along the prism and the projecting portion; an image pickup device connection terminal portion formed on a face that faces the projecting portion of the flexible printed wiring board; and a cable connection terminal portion formed at an area that extends over the projecting portion of the flexible printed wiring board. The terminal portion and the image pickup device connection terminal portion are joined in an opposed state. An electronic component is mounted on a face on an opposite side to the reflective surface of the flexible printed wiring board.

Abstract: A mount assembly includes a member in which a mount component is mounted at least on one main face of the member and at which a member connecting electrode is formed; and a connection member that has a pillar-shaped parallel portion arranged so that a longitudinal direction of the parallel portion is parallel to the main face of the member, one end side of the parallel portion being connected to the member connecting electrode.

Abstract: A laminate mount assembly includes a first member that includes an inter-member connection electrode that is provided on an end surface that forms a predetermined inter-member connection side surface; a second member that includes an inter-member connection electrode that is provided on an end surface that forms the inter-member connection side surface, the second member being arranged to be parallel with the first member; and a conductive film that electrically connects the inter-member connection electrodes to each other over a portion in which the first member and the second member are opposite to each other.

Abstract: A cable assembly includes: a plurality of cables; a cable fixing member that fixes the cables together; and conductor layers, wherein the cable assembly is formed with a connecting end surface that includes thereon connecting ends of the cables, and the conductor layers are provided to cover surfaces of the connecting ends that are on the connecting end surface.

Abstract: A laminate mount assembly includes a first member that includes an inter-member connection electrode that is provided on an end surface that forms a predetermined inter-member connection side surface; a second member that includes an inter-member connection electrode that is provided on an end surface that forms the inter-member connection side surface, the second member being arranged to be parallel with the first member; and a conductive film that electrically connects the inter-member connection electrodes to each other over a portion in which the first member and the second member are opposite to each other.