Abstract: A module includes: a board having a first surface; a first component and a second component mounted on the first surface; and a wire disposed to extend across the first component and having one end and the other end. The one end is connected to the second component. The wire is grounded.

Abstract: A radio frequency module includes a mounting substrate, a first electronic component, a second electronic component, a connection terminal, and a wiring layer. The second electronic component is disposed on the second main surface of the mounting substrate. The connection terminal is disposed on the second main surface of the mounting substrate and is connected to the mounting substrate and the wiring layer. The wiring layer faces the second main surface of the mounting substrate with the second electronic component interposed therebetween and is in contact with the connection terminal. The wiring layer has a base material and an external connection electrode. The base material has a second conductive member connected to the first conductive member of the mounting substrate with the connection terminal interposed therebetween. The external connection electrode is connected to the second conductive member. The wiring layer is in contact with the second electronic component.

Abstract: An increase in cost can be suppressed. A high frequency module includes a mounting substrate, a first electronic component, a second electronic component, a resin layer, and a metal layer. The first electronic component and the second electronic component are disposed on a first main surface of the mounting substrate. The metal layer has a ground potential and covers a part of the resin layer. The metal layer overlaps a part of the first electronic component and overlaps a part of the second electronic component in plan view from a thickness direction of the mounting substrate. A height of the first electronic component is lower than a height of the second disposal condition in the thickness direction of the mounting substrate. A part of a main surface of the first electronic component that is far away from the mounting substrate is in contact with the metal layer.

Abstract: A radio-frequency circuit includes an antenna connection terminal, switch circuits, a duplexer, a low-pass filter, and a high-pass filter. The switch circuit includes a port connected to the antenna connection terminal and ports. The switch circuit includes a single transmission port connected to the port, a simultaneous transmission port connected to ports. The duplexer is connected to the port. The low-pass filter is disposed on a signal path connecting the port and the simultaneous transmission port. The high-pass filter is connected to the port. No filter is disposed on a signal path connecting the port and the single transmission port.

Abstract: A high-frequency module includes a mounting board, a first electronic component, a first resin layer, and a first ground electrode. The mounting board has a first principal surface and a second principal surface opposite to each other. The first electronic component is disposed on the first principal surface of the mounting board. The first resin layer is disposed on the first principal surface of the mounting board, and covers at least a part of an outer peripheral surface of the first electronic component. The first ground electrode covers at least a part of the first resin layer. A principal surface of the first electronic component opposite to the mounting board is in contact with the first ground electrode. The mounting board includes a second ground electrode inside the mounting board. The first ground electrode is not in contact with the second ground electrode.

Abstract: A high-frequency module includes a mounting board, a first electronic component, a first resin layer, and a first ground electrode. The mounting board has a first principal surface and a second principal surface facing each other. The first electronic component is disposed on the first principal surface of the mounting board. The first resin layer is disposed on the first principal surface of the mounting board, and covers at least a part of an outer peripheral surface of the first electronic component. The first ground electrode covers at least a part of the first resin layer. A principal surface of the first electronic component opposite to the mounting board is connected to the first ground electrode. The mounting board includes a second ground electrode inside the mounting board. The first ground electrode is connected to the second ground electrode.

Abstract: A high frequency circuit includes a switch that includes terminals; a switch that includes terminals; a filter that has a pass band including a first band; and a diplexer that includes terminals. The diplexer includes a filter that is connected between the terminals and has a pass band including a first frequency band group containing the first band and a filter that is connected between the terminals and has a pass band including a second frequency band group. The terminal is connected to an antenna terminal. The terminals are connected to one terminal of the filter. The terminal is connected to the terminal. The terminal is connected to the terminal.

Abstract: A high-frequency module includes a mounting substrate, a first electronic component, a second electronic component, a resin layer, and a metal electrode layer. The first electronic component and the second electronic component are disposed on a first main surface of the mounting substrate. The metal electrode layer covers at least a part of the resin layer, and overlaps with at least a part of the first electronic component and at least a part of the second electronic component in a plan view. At least a part of a main surface of the first electronic component opposite to the mounting substrate side is in contact with the metal electrode layer. The metal electrode layer has a through-portion between a first signal terminal of the first electronic component and a second signal terminal of the second electronic component in the plan view.

Abstract: A high-frequency module includes a first module substrate including first and second major surfaces, and a second module substrate including third and fourth major surfaces. The first major surface (faces the second major surface. Electronic components are disposed between the second and third major surfaces, on the first major surface, and on the fourth major surface. External connection terminals are disposed on the fourth major surface. A recess is formed in the first major surface. The electronic components include a first electronic component and a second electronic component (shorter in height than the first electronic component. The first electronic component is disposed in the recess, and the second electronic component is disposed in a region outside of the recess on the first major surface.

Abstract: A radio-frequency module includes a module substrate, a hybrid filter for 5th Generation New Radio (5G-NR) n77 including a first acoustic wave resonator element, a first inductor, and a first capacitor, a filter for 5G-NR n79 including a second acoustic wave resonator element and a second inductor, power amplifiers, a third inductor coupled between the power amplifier and the hybrid filter, and a fourth inductor coupled between the power amplifier and the filter. The first inductor, the second inductor, the third inductor, and the fourth inductor are disposed at a major surface or inside the module substrate. The distance between the first inductor and the third inductor is larger than the distance between the second inductor and the fourth inductor.

Abstract: A radio-frequency module includes a hybrid filter for 5th Generation New Radio (5G-NR) n77, a filter for 5G-NR n79, power amplifiers, a third inductor coupled to the power amplifier, and a fourth inductor coupled to a power amplifier. When a module substrate is viewed in plan view, the power amplifiers are disposed in a first quadrant, the third inductor and the fourth inductor are disposed in a second quadrant, the hybrid filter and the filter are disposed in a third quadrant, the power amplifier is disposed closer to a reference point than the power amplifier, the third inductor is disposed closer to the reference point than the fourth inductor, and the hybrid filter is disposed closer to the reference point than the filter.

Abstract: A radio-frequency module includes a module substrate having major surfaces opposite to each other; a module substrate having major surfaces opposite to each other, the major surface being disposed facing the major surface; a plurality of external connection terminals disposed on the major surface; a plurality of inter-substrate connection terminals disposed between the major surfaces to couple the module substrate to the module substrate; a first electronic component (integrated circuit) including a switch; a second electronic component including a filter coupled to a power amplifier via the switch; and a third electronic component including a filter coupled to the power amplifier via the switch. The first electronic component, the second electronic component, and the third electronic component are disposed in the same module substrate.

Abstract: A radio-frequency module includes: plural electronic components that include plural bare SAW devices and that are disposed between a major surface of a module substrate and a major surface of a module substrate, on a major surface of the module substrate, and on a major surface of the module substrate; plural external connection terminals disposed on the major surface; and resin members. The resin member covers the plural SAW devices but does not fill between central regions of the plural bare SAW devices in which the IDT electrodes are disposed and the major surface to which plural bump electrodes are joined. The plural bare SAW devices are disposed on the major surface, and no bare SAW devices are disposed between the major surfaces and on the major surface.

Abstract: A radio-frequency module includes a module substrate having major surfaces opposite to each other; a module substrate having major surfaces opposite to each other, the major surface being disposed facing the major surface; a first electronic component including a filter coupled to a power amplifier via a switch; a second electronic component including a filter coupled to the power amplifier via the switch; and a third electronic component including the switch. The first electronic component is disposed one of between the major surfaces, on the major surface, and on the major surface. The second electronic component is disposed another one of between the major surfaces, on the major surface, and on the major surface. The third electronic component is disposed other one of between the major surfaces, on the major surface, and on the major surface.

Abstract: A radio frequency module includes a module substrate that has main surfaces that face each other, a module substrate that has main surfaces that face each other. A first main surface faces a second main surface. Multiple electronic components are disposed between the main surfaces, on or along one main surface, and on or along another main surface. Multiple external connection terminals are disposed on or along one main surface and are joined to the module substrate and a motherboard. An absolute value of a difference between a thermal expansion coefficient of the module substrate and a thermal expansion coefficient of the motherboard is smaller than an absolute value of a difference between a thermal expansion coefficient of the module substrate and the thermal expansion coefficient of the motherboard.

Abstract: A radio frequency module includes a first module substrate that has a first main surface facing a second main surface, a second module substrate that has a third main surface facing a fourth main surface, the third main surface facing the second main surface, multiple electronic components that are disposed between the second main surface and the third main surface, on or along the first main surface, and on or along the fourth main surface, and a LC component that is disposed in the module substrate and that is an inductor or a capacitor. A relative dielectric constant of the module substrate is higher than a relative dielectric constant of the module substrate.

Abstract: A high-frequency module includes a module substrate including major surfaces opposite to each other; a module substrate including major surfaces opposite to each other, the major surface being disposed facing the major surface; a first electronic component including a filter coupled to a power amplifier; a second electronic component including a filter coupled to a low-noise amplifier; and a third electronic component (an integrated circuit) including the low-noise amplifier. The first electronic component is disposed one of between the major surfaces, on the major surface, and on the major surface. The second electronic component is disposed another one of between the major surface surfaces, on the major surface, and on the major surface. The third electronic component is disposed other one of between the major surfaces, on the major surface, and on the major surface.

Abstract: A radio-frequency module includes module substrates, multiple electronic components, and multiple external connection terminals. The module substrate has major surfaces that are opposite to each other. The module substrate has major surfaces that are opposite to each other. The module substrate is disposed such that the major surface faces the major surface. The multiple electronic components are disposed between the major surfaces, at the major surface, or at the major surface. The external connection terminals are disposed at the major surface. The multiple electronic components include one or more first electronic components each including at least a transistor and one or more second electronic components each not including any transistor. At the major surface, at least one of the one or more first electronic components is disposed, and the one or more second electronic components are not disposed.

Abstract: A high-frequency module includes a module substrate having major surfaces, and a module substrate having major surfaces. The major surface are disposed facing the major surface. A first electronic component includes a filter coupled to a power amplifier and a low-noise amplifier. A second electronic component includes a filter coupled to a low-noise amplifier. A third electronic component includes a switch coupled between filters and an antenna connection terminal. The first electronic component is disposed between the major surfaces, on the major surface, or on the major surface. The second electronic component is disposed between the major surfaces, on the major surface, or on the major surface where the first electronic component is not disposed. The third electronic component is disposed between the major surfaces, on the major surface, or on the major surface wherein neither of the first nor second electronic component is disposed.

Abstract: A radio-frequency module includes a module substrate having major surfaces opposite to each other; a module substrate having major surfaces opposite to each other, the major surface being disposed facing the major surface; a first electronic component disposed on the major surface; a second electronic component that includes a first electrode joined to the major surface and a second electrode joined to the major surface and that is disposed between the major surfaces; and a third electronic component disposed on the major surface; and an external connection terminal disposed on the major surface. The second electronic component is at least one of a chip inductor, a chip capacitor, and a chip resistor. The second electronic component is coupled via the first electrode to the first electronic component and is coupled via the second electrode to the third electronic component or external connection terminal.